JPH0369226U - - Google Patents
Info
- Publication number
- JPH0369226U JPH0369226U JP13125689U JP13125689U JPH0369226U JP H0369226 U JPH0369226 U JP H0369226U JP 13125689 U JP13125689 U JP 13125689U JP 13125689 U JP13125689 U JP 13125689U JP H0369226 U JPH0369226 U JP H0369226U
- Authority
- JP
- Japan
- Prior art keywords
- heater
- wafer
- heat medium
- wax
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131256U JPH0747865Y2 (ja) | 1989-11-10 | 1989-11-10 | ウエハ貼付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131256U JPH0747865Y2 (ja) | 1989-11-10 | 1989-11-10 | ウエハ貼付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0369226U true JPH0369226U (US08063081-20111122-C00115.png) | 1991-07-09 |
| JPH0747865Y2 JPH0747865Y2 (ja) | 1995-11-01 |
Family
ID=31678775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989131256U Expired - Lifetime JPH0747865Y2 (ja) | 1989-11-10 | 1989-11-10 | ウエハ貼付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747865Y2 (US08063081-20111122-C00115.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150132A (ja) * | 2005-11-30 | 2007-06-14 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱装置 |
| JP2012204604A (ja) * | 2011-03-25 | 2012-10-22 | Fujikoshi Mach Corp | ワーク貼着方法およびワーク貼着装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252945A (ja) * | 1986-04-25 | 1987-11-04 | Mitsubishi Heavy Ind Ltd | 被加工材の仮止め着脱方法 |
-
1989
- 1989-11-10 JP JP1989131256U patent/JPH0747865Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252945A (ja) * | 1986-04-25 | 1987-11-04 | Mitsubishi Heavy Ind Ltd | 被加工材の仮止め着脱方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150132A (ja) * | 2005-11-30 | 2007-06-14 | Toshiba Mitsubishi-Electric Industrial System Corp | 均熱装置 |
| JP2012204604A (ja) * | 2011-03-25 | 2012-10-22 | Fujikoshi Mach Corp | ワーク貼着方法およびワーク貼着装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747865Y2 (ja) | 1995-11-01 |
