JPH03683Y2 - - Google Patents
Info
- Publication number
- JPH03683Y2 JPH03683Y2 JP1986071883U JP7188386U JPH03683Y2 JP H03683 Y2 JPH03683 Y2 JP H03683Y2 JP 1986071883 U JP1986071883 U JP 1986071883U JP 7188386 U JP7188386 U JP 7188386U JP H03683 Y2 JPH03683 Y2 JP H03683Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- elastic buffer
- wiring board
- board
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000013011 mating Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000013016 damping Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986071883U JPH03683Y2 (US06373033-20020416-M00071.png) | 1985-12-13 | 1986-05-15 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19097185 | 1985-12-13 | ||
JP1986071883U JPH03683Y2 (US06373033-20020416-M00071.png) | 1985-12-13 | 1986-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62165680U JPS62165680U (US06373033-20020416-M00071.png) | 1987-10-21 |
JPH03683Y2 true JPH03683Y2 (US06373033-20020416-M00071.png) | 1991-01-11 |
Family
ID=33454968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986071883U Expired JPH03683Y2 (US06373033-20020416-M00071.png) | 1985-12-13 | 1986-05-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03683Y2 (US06373033-20020416-M00071.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722858Y2 (ja) * | 1987-06-05 | 1995-05-24 | 第一電子工業株式会社 | 電気コネクタ用コンタクト |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110985U (ja) * | 1982-01-25 | 1983-07-28 | 東芝熱器具株式会社 | 通電用接続器装置 |
-
1986
- 1986-05-15 JP JP1986071883U patent/JPH03683Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62165680U (US06373033-20020416-M00071.png) | 1987-10-21 |
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