JPH036834U - - Google Patents
Info
- Publication number
- JPH036834U JPH036834U JP1989064896U JP6489689U JPH036834U JP H036834 U JPH036834 U JP H036834U JP 1989064896 U JP1989064896 U JP 1989064896U JP 6489689 U JP6489689 U JP 6489689U JP H036834 U JPH036834 U JP H036834U
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- less
- conductive layer
- layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Bag Frames (AREA)
Description
第１図は本考案の電子部品用バツグに使用する
複合フイルム断面図、第２図は２枚のフイルムを
ヒートシールして製袋した従来のバツグの斜視図
、第３図は本考案による電子部品用バツグの斜視
図、第４図は従来のバツグのヒートシール部の断
面図、第５図は本考案による電子部品用バツグの
半折部の断面図。
Figure 1 is a cross-sectional view of a composite film used in the bag for electronic parts of the present invention, Figure 2 is a perspective view of a conventional bag made by heat-sealing two films, and Figure 3 is a cross-sectional view of the composite film used in the bag for electronic parts of the present invention. FIG. 4 is a sectional view of the heat-sealed part of the conventional bag, and FIG. 5 is a sectional view of the half-folded part of the bag for electronic parts according to the present invention.
Claims (1)
ング、あるいは蒸着、ラミネートした表面抵抗が
１０６Ω／□以下の導電層を、他面にポリクロロ
トリフルオロエチレンをバリアー層としてラミネ
ートし、かつ該バリアー層側に１８０℃以下でヒ
ートシール可能なオレフイン系樹脂にカーボンブ
ラツクを混練した表面抵抗が１０３〜１０８Ω／
□の半導電層をラミネートし、フイルム全体とし
ての透湿度が３ｇ／m2・２４ｈｒ以下である複合
フイルムであつて、該複合フイルムの導電層側を
表層として折り曲げ、内層の半導電層の両側端部
をヒートシールさせてなることを特徴とする電子
部品用バツグ。 A conductive layer having a surface resistance of 10 6 Ω/□ or less is coated, vapor deposited, or laminated on one side of an insulating base film, and polychlorotrifluoroethylene is laminated as a barrier layer on the other side, and the barrier layer is On the side, carbon black is mixed with olefin resin that can be heat-sealed at 180℃ or less, and the surface resistance is 10 3 to 10 8 Ω/
A composite film in which the semi-conductive layers of □ are laminated and the moisture permeability of the film as a whole is 3 g/m 2 · 24 hr or less, the composite film is folded with the conductive layer side as the surface layer, and both sides of the inner semi-conductive layer are folded. A bag for electronic components characterized by heat-sealed edges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989064896U JPH036834U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989064896U JPH036834U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036834U true JPH036834U (en) | 1991-01-23 |
Family
ID=31596237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989064896U Pending JPH036834U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036834U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149746U (en) * | 1976-05-10 | 1977-11-14 |
-
1989
- 1989-06-05 JP JP1989064896U patent/JPH036834U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149746U (en) * | 1976-05-10 | 1977-11-14 |
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