JPH0367445U - - Google Patents
Info
- Publication number
- JPH0367445U JPH0367445U JP6961389U JP6961389U JPH0367445U JP H0367445 U JPH0367445 U JP H0367445U JP 6961389 U JP6961389 U JP 6961389U JP 6961389 U JP6961389 U JP 6961389U JP H0367445 U JPH0367445 U JP H0367445U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- moisture absorption
- plastic mold
- sealed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6961389U JPH0367445U (fi) | 1989-06-14 | 1989-06-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6961389U JPH0367445U (fi) | 1989-06-14 | 1989-06-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0367445U true JPH0367445U (fi) | 1991-07-01 |
Family
ID=31605073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6961389U Pending JPH0367445U (fi) | 1989-06-14 | 1989-06-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0367445U (fi) |
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1989
- 1989-06-14 JP JP6961389U patent/JPH0367445U/ja active Pending