JPH036659B2 - - Google Patents
Info
- Publication number
- JPH036659B2 JPH036659B2 JP18301384A JP18301384A JPH036659B2 JP H036659 B2 JPH036659 B2 JP H036659B2 JP 18301384 A JP18301384 A JP 18301384A JP 18301384 A JP18301384 A JP 18301384A JP H036659 B2 JPH036659 B2 JP H036659B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- gate
- control electrode
- semiconductor device
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59183013A JPS6159742A (ja) | 1984-08-30 | 1984-08-30 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59183013A JPS6159742A (ja) | 1984-08-30 | 1984-08-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159742A JPS6159742A (ja) | 1986-03-27 |
| JPH036659B2 true JPH036659B2 (enFirst) | 1991-01-30 |
Family
ID=16128209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59183013A Granted JPS6159742A (ja) | 1984-08-30 | 1984-08-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6159742A (enFirst) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0287770B1 (de) * | 1987-03-25 | 1993-05-05 | BBC Brown Boveri AG | Halbleiterbauelement mit einer Steuerelektrode |
| JPH0744191B2 (ja) * | 1989-12-15 | 1995-05-15 | 三菱電機株式会社 | 半導体装置およびそのための電極ブロック |
-
1984
- 1984-08-30 JP JP59183013A patent/JPS6159742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159742A (ja) | 1986-03-27 |
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