JPH0365299U - - Google Patents

Info

Publication number
JPH0365299U
JPH0365299U JP12576689U JP12576689U JPH0365299U JP H0365299 U JPH0365299 U JP H0365299U JP 12576689 U JP12576689 U JP 12576689U JP 12576689 U JP12576689 U JP 12576689U JP H0365299 U JPH0365299 U JP H0365299U
Authority
JP
Japan
Prior art keywords
circuit board
ceramic circuit
metal
frame plate
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12576689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12576689U priority Critical patent/JPH0365299U/ja
Publication of JPH0365299U publication Critical patent/JPH0365299U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP12576689U 1989-10-27 1989-10-27 Pending JPH0365299U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12576689U JPH0365299U (zh) 1989-10-27 1989-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12576689U JPH0365299U (zh) 1989-10-27 1989-10-27

Publications (1)

Publication Number Publication Date
JPH0365299U true JPH0365299U (zh) 1991-06-25

Family

ID=31673620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12576689U Pending JPH0365299U (zh) 1989-10-27 1989-10-27

Country Status (1)

Country Link
JP (1) JPH0365299U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881896B2 (en) 2003-05-20 2005-04-19 Nec Compound Semiconductor, Ltd. Semiconductor device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881896B2 (en) 2003-05-20 2005-04-19 Nec Compound Semiconductor, Ltd. Semiconductor device package

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