JPH0365272U - - Google Patents

Info

Publication number

JPH0365272U

JPH0365272U JP12686689U JP12686689U JPH0365272U JP H0365272 U JPH0365272 U JP H0365272U JP 12686689 U JP12686689 U JP 12686689U JP 12686689 U JP12686689 U JP 12686689U JP H0365272 U JPH0365272 U JP H0365272U

Authority

JP

Japan

Prior art keywords

thick film

circuit device

film circuit

wiring pattern

conductor

Prior art date

1989-10-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 238000009966 trimming Methods 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 239000004020 conductor Substances 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 229910052802 copper Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1
• SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 239000012212 insulator Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1