JPH0363984U - - Google Patents
Info
- Publication number
- JPH0363984U JPH0363984U JP12522389U JP12522389U JPH0363984U JP H0363984 U JPH0363984 U JP H0363984U JP 12522389 U JP12522389 U JP 12522389U JP 12522389 U JP12522389 U JP 12522389U JP H0363984 U JPH0363984 U JP H0363984U
- Authority
- JP
- Japan
- Prior art keywords
- section
- connection lead
- printed circuit
- fixing plate
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12522389U JPH0363984U (pl) | 1989-10-26 | 1989-10-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12522389U JPH0363984U (pl) | 1989-10-26 | 1989-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0363984U true JPH0363984U (pl) | 1991-06-21 |
Family
ID=31673106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12522389U Pending JPH0363984U (pl) | 1989-10-26 | 1989-10-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0363984U (pl) |
-
1989
- 1989-10-26 JP JP12522389U patent/JPH0363984U/ja active Pending
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