JPH0363971U - - Google Patents
Info
- Publication number
- JPH0363971U JPH0363971U JP12343789U JP12343789U JPH0363971U JP H0363971 U JPH0363971 U JP H0363971U JP 12343789 U JP12343789 U JP 12343789U JP 12343789 U JP12343789 U JP 12343789U JP H0363971 U JPH0363971 U JP H0363971U
- Authority
- JP
- Japan
- Prior art keywords
- bare conductor
- parallel
- circuit board
- pattern
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000005219 brazing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12343789U JPH0363971U (no) | 1989-10-21 | 1989-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12343789U JPH0363971U (no) | 1989-10-21 | 1989-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363971U true JPH0363971U (no) | 1991-06-21 |
Family
ID=31671414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12343789U Pending JPH0363971U (no) | 1989-10-21 | 1989-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363971U (no) |
-
1989
- 1989-10-21 JP JP12343789U patent/JPH0363971U/ja active Pending