JPH0363931U - - Google Patents
Info
- Publication number
- JPH0363931U JPH0363931U JP12581489U JP12581489U JPH0363931U JP H0363931 U JPH0363931 U JP H0363931U JP 12581489 U JP12581489 U JP 12581489U JP 12581489 U JP12581489 U JP 12581489U JP H0363931 U JPH0363931 U JP H0363931U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- semiconductor chip
- recess
- tip
- insertion groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12581489U JPH0363931U (en, 2012) | 1989-10-26 | 1989-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12581489U JPH0363931U (en, 2012) | 1989-10-26 | 1989-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363931U true JPH0363931U (en, 2012) | 1991-06-21 |
Family
ID=31673666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12581489U Pending JPH0363931U (en, 2012) | 1989-10-26 | 1989-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363931U (en, 2012) |
-
1989
- 1989-10-26 JP JP12581489U patent/JPH0363931U/ja active Pending