JPH03636A - Insertion tool of semiconductor device into ic tube - Google Patents

Abstract

PURPOSE:To accurately insert a semiconductor device into a IC tube, by giving semiconductor devices along a guide gloove in case that a chamber is arranged in the guide gloove corresponding to protrusions thereof, and fitting them at a stopper, lifted up by the protrusions, in case that the chamber is arranged with out corresponding to the protrusions. CONSTITUTION:When a chamfer 14 of a tool body 21 is arranged to correspond to protrusions 21b and pushed into the IC tube 16, after correctly arranging semiconductor devices in the inserting direction, the semiconductor devices 11 are slided along a guide gloove 21a to be contained into the IC tube 16. In this case, if the semiconductor devices 11 are incorrectly arranged on the guide gloove 21 due to mistaken insertion direction, the semiconductor devices 11 are raised upward as some of sides, at which the chamber 14 is not formed, are held by protrusions 21b of the guide gloove 21a. When the semiconductor devices 11 are pushed to the IC tube 16 under the above condition, they are held at the end face of the stopper member 23 after sliding along the guide gloove 21a and prevented to slide further.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC tube insertion jig for a semiconductor device, which is used when inserting, for example, a PLCC package type semiconductor device into an IC tube.

[Conventional technology]

For example, when a plurality of PLCC package type semiconductor devices are transported or stored together, they may be housed in an IC tube.

FIG. 7 shows a perspective view for explaining a conventional method of inserting the semiconductor device 1 into the IC tube 2.

As shown in the figure, a PLCC package type semiconductor device 1 is formed so that a plurality of leads 1a are drawn out from each of the four sides of the package body, and each of the leads 1a is bent downward.

On the other hand, the IC tube 2 has a substantially cylindrical shape with both ends open, and has a substantially rectangular cross section that follows the outer peripheral shape of the semiconductor device 1. Furthermore, IC tube 2
A slit 2a is formed in the lower wall of the tube along the longitudinal direction of the tube.

To insert the semiconductor device 1 into this IC tube 2,
First, the other end of the IC tube 2 is closed with a rubber stopper (not shown) or the like. Next, the semiconductor device 1 is manually turned over as shown in FIG. 7, the four sides of the semiconductor device 1 are aligned in a predetermined direction, and the semiconductor device 1 is inserted into the IC tube 2 through the opening at one end thereof.

The reason why the semiconductor device 1 is turned over and inserted into the IC tube 2 is to make the semiconductor device 1 so that the leads 1a can be easily seen by the operator and to prevent the leads 1a from coming into contact with the edges of the IC tube 2. It can be inserted into the IC tube 2 and prevents the leads 1a from contacting the bottom wall surface inside the IC tube 2 due to the weight of the semiconductor device 1.
This prevents the lead 1a from being bent inadvertently.

[Problem to be solved by the invention]

By the way, when inserting the semiconductor device 1 into the IC tube 2, the directions of the four side surfaces of the semiconductor device 1, in other words, the insertion direction of the semiconductor device are predetermined, and the operator must check the directions provided on the top surface of the package body (not shown). The insertion direction of the semiconductor device 1 is determined based on the mark. However, when the semiconductor device 1 is turned over as described above, it becomes difficult for the operator to visually see the mark, and as a result, there is a problem that the semiconductor device 1 may be inserted in the wrong direction.

Furthermore, since the semiconductor device 1 is manually inserted into the IC tube 2, the leads 1a are inserted into the IC tube 2.
It is difficult to accurately position the semiconductor device 1 and insert it into the IC tube 2 so as not to contact the edge of the IC tube 2, and if the lead 1a is misaligned, the lead 1a may come into contact with the edge of the IC tube 2. There was a problem in that the lead 1a was bent.

The present invention solves the problems of the prior art described above, and provides a semiconductor device in which a semiconductor device can be inserted into an IC tube without making a mistake in the insertion direction of the semiconductor device, and with the semiconductor device accurately positioned to prevent bending of the leads. Our aim is to provide an IC tube insertion jig.

[Means to solve the problem]

The present invention is an IC tube insertion jig for a semiconductor device, which is used when inserting a semiconductor device having a chamfer formed on one of the four sides of the upper surface of a package body into an IC tube through an opening at one end thereof. In order to achieve the above object, a guide groove for guiding the slide of the semiconductor device when the semiconductor device is turned over is formed along the longitudinal direction with the groove opening facing upward, and the guide groove is formed along the longitudinal direction on the negative side of the semiconductor device. a jig main body having a protrusion corresponding to the recess, and a jig main body provided at one end of the jig main body so that the jig main body can be freely attached to and detached from the IC tube such that the guide groove is continuous with the tube hole of the IC tube. a connecting portion connected to the guide groove, and a connecting portion connected to the guide groove;
When the semiconductor device is slid from the other end side of the guide groove toward one end side with the chamfered portion corresponding to the protrusion provided so as to cross the upper side of the guide groove, While allowing the semiconductor device to slide along the guide groove, when the semiconductor device is slid from the other end of the guide groove toward one end without making the chamfer correspond to the protrusion, includes a stopper that locks the semiconductor device lifted by the protrusion and restricts the semiconductor device from sliding along the guide groove.

[Effect]

In the IC tube insertion jig for a semiconductor device of the present invention, when the semiconductor device is placed in the guide groove with the chamfered portion corresponding to the protrusion, the semiconductor device is guided by the guide groove, and the IC tube of the semiconductor device is In addition to accurately positioning the semiconductor device in the tube, if the semiconductor device is placed in the guide groove without matching the chamfer to the protrusion, the semiconductor device is lifted by the protrusion and locked to the stopper, and the semiconductor device is Sliding within the guide groove of the device is restricted.

〔Example〕

FIG. 1 is a perspective view showing an IC tube insertion jig 20 for a semiconductor device which is an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a plan view showing a PLCC package type semiconductor device 11. FIG. 4 is a side view thereof, and FIG. 5 is a front view thereof.

A PLCC package type semiconductor device 11 has leads 1 drawn out from each of the four sides of the package body 12.
3 are each curved downward, and then each is further curved inward. Further, one of the four sides of the top surface of the package body 12 is formed with a chamfered portion 14 along the negative side, and one of the four corner portions formed on each of the four sides is cut out. A notch 15 is formed.

On the other hand, the IC tube insertion jig 20 includes a jig main body 21,
It is composed of a connecting member 22 and a stopper member 23.

The jig main body 21 has a guide groove 21a that is open upward.
is formed along the longitudinal direction. The guide groove 21a has a cross-sectional shape that follows the cross-sectional shape of the upper flat part of the 'F conductor device 11, and the guide groove 21a
An alignment mark 21c is formed on the other end side of the bottom surface of a, following the outer circumferential shape of the upper surface of the package body 12. Furthermore, a guide? A protrusion 21b corresponding to the chamfered portion 14 of the semiconductor device 11 is formed along one of the two large corners formed by the bottom surface and both side surfaces of M 21 a.

Further, the connecting member 22 arranged to cover one end side of the jig main body 21 from above is formed with four parts 22a corresponding to the guide grooves 21a of the jig main body 21. The connecting member 22 is fixed to the jig main body 21 so that the concave portion 22a covers the upper side of one end of the guide groove 21a. As a result, a connecting portion 22b surrounded by the guide groove 21a and the recess 22a is formed, and one end of the IC tube 16 can be detachably fitted into the connecting portion 22b. In this case, when one end of the IC tube 16 is fitted into the connecting portion 22b, the inner circumferential lower surface of the IC tube 16 is configured to lie on the same plane as the bottom surface of the guide groove 21a.

On the other hand, the stopper member 23 has four IC passage portions 23a formed on its lower surface side corresponding to the guide grooves 21a, and these IC passage recesses 23a form the guide '1m 21a.
The stopper member 23
is attached to the jig main body 21.

Next, how to use this IC tube insertion jig 20 will be explained. First, as described above, the IC tube insertion jig 20 is attached to one end of the IC tube 16 via its connecting portion 22b. Next, the other end of the IC tube 16 is tilted upward as shown in FIG. Install it on stand 17.

In this state, turn the semiconductor device 11 over and insert the semiconductor device 11 into the guide groove while aligning the outer periphery of the upper surface with the alignment mark 21c, that is, so that the insertion direction P (FIG. 3) faces the IC tube 16 side. Mounted on the bottom of 21aρ. Thereby, the chamfered portion 14 corresponds to the protrusion 21b of the guide groove 21a. In this manner, when the insertion direction of the semiconductor device 11 is set correctly, the chamfered portion 14 corresponds to the protrusion 21b, and the entire upper half of the semiconductor device 11 is accurately placed within the guide groove 1a. be accommodated.

Next, the semiconductor device 11 is lightly pushed toward the IC tube 16 side. Then, the semiconductor device 11 moves into the guide groove 21a.
The four IC passing portions 23 of the stopper member 23 slide along the guide groove 1a while being guided by the self-m.
a and the four parts 22a of the connecting member 22, respectively, and is accommodated in the IC tube 16. In this case, while the semiconductor device 11 is guided by the guide groove 21a, the IC
In order to be inserted into the tube 16, the stopper portion 23. The semiconductor device 11 is prevented from shifting in the vertical and horizontal directions with respect to the connecting member 22 and the IC tube 16, and the leads 1
3 is a stopper member 23. There is no contact with the connecting member 22 and the IC tube 16, and bending of the lead 13 is reliably prevented.

On the other hand, when inserting the semiconductor device 11 into the IC tube 16 in the above-described procedure, if the operator inserts the semiconductor device 11 in the wrong direction due to carelessness, etc., the semiconductor device 11 is is not inserted into the IC tube 16.

That is, if the semiconductor device 11 is inserted in the wrong direction and placed on the guide groove 21, one of the remaining three sides of the package body 12 on which the chamfered part 14 is not formed will engage the protrusion 21b of the guide groove 21a. Semiconductor device 1
1 is not accurately accommodated in the guide groove 21a and is slightly lifted upward. At this stage, the operator usually realizes that the insertion direction is wrong, but due to further negligence, the operator inserts the semiconductor device 11 into the IC tube in that state.
Even if the semiconductor device 11 is pushed toward the guide groove 2, the semiconductor device 11 remains lifted upward by the protrusion 21b.
1H, and is eventually engaged with the end face of the stopper member 23, thereby restricting further sliding. Therefore, the semiconductor device 11 will not be housed in the IC tube 16 in the wrong insertion direction.

In this way, by simply placing the semiconductor device 11 into the guide groove 1a and pushing it in without paying particular attention to the insertion direction, the semiconductor device 11 can be accurately inserted into the IC tube 16 without bending the leads 13. work efficiency is improved.

〔Effect of the invention〕

As described above, according to this IC tube insertion jig for a semiconductor device, a protrusion is formed on one side of the guide groove provided in the jig body to correspond to the chamfered portion of the semiconductor device, and
A stopper is formed in the middle of the guide groove so as to cross above the groove, so if the insertion direction of the semiconductor device is set correctly, the semiconductor device can be inserted in an accurately positioned state to prevent bending of the leads. While the device can be inserted into the IC tube along the guide groove, if the insertion direction of the semiconductor device is set incorrectly, the semiconductor device will be lifted by the protrusion and locked by the stopper, preventing insertion into the IC tube. The effect of being regulated can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an IC tube insertion jig for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view showing a PLCC package type semiconductor device, and FIG. 5 is a front view of the same semiconductor device, FIG. 6 is a side view for explaining an example of use of the IC tube insertion jig of these two embodiments, and FIG. 7 is a conventional semiconductor device. FIG. 3 is a perspective view for explaining a method of inserting the device into an IC tube. In the figure, 11 is a semiconductor device, 12 is a package body, 13 is a lead, 14 is a chamfered part, 16 is an IC tube,
20 is 1. C tube insertion jig, 21 is the jig body, 21
a is a guide groove, 21b is a protrusion, 22 is a connecting member, 22b
23 is a connecting portion, and 23 is a stopper member. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) An IC tube insertion jig for a semiconductor device, which is used when inserting a semiconductor device having a chamfer formed on one of the four sides of the top surface of a package body into an IC tube through an opening at one end thereof. , a guide groove for guiding the slide of the semiconductor device when the semiconductor device is turned over is formed along the longitudinal direction with the groove opening facing upward, and has a protrusion corresponding to the chamfer on one side of the guide groove. a jig main body, and the guide groove provided at one end of the jig main body and the IC
a connecting portion that removably connects the jig body to the IC tube so as to be continuous with the tube hole of the tube; and a connecting portion that is provided in the middle of the guide groove so as to cross above the guide groove, and When the semiconductor device is slid from the other end side of the guide groove toward the one end side with a portion corresponding to the protrusion, the semiconductor device is allowed to slide along the inside of the guide groove; When the semiconductor device is slid from the other end of the guide groove toward the one end without making the chamfer correspond to the protrusion, the semiconductor device lifted by the protrusion is locked. an IC tube insertion jig for a semiconductor device, comprising: a stopper for restricting sliding of the semiconductor device along the guide groove;