JPH0361371U - - Google Patents

Info

Publication number

JPH0361371U

JPH0361371U JP12190989U JP12190989U JPH0361371U JP H0361371 U JPH0361371 U JP H0361371U JP 12190989 U JP12190989 U JP 12190989U JP 12190989 U JP12190989 U JP 12190989U JP H0361371 U JPH0361371 U JP H0361371U

Authority

JP

Japan

Prior art keywords

molded part

heat dissipation

plating layer

power system

dissipation fin

Prior art date

1989-10-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000017525 heat dissipation Effects 0.000 claims description 3
• 238000007747 plating Methods 0.000 claims description 3
• 239000011347 resin Substances 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)