JPH0360328B2 - - Google Patents
Info
- Publication number
- JPH0360328B2 JPH0360328B2 JP8455184A JP8455184A JPH0360328B2 JP H0360328 B2 JPH0360328 B2 JP H0360328B2 JP 8455184 A JP8455184 A JP 8455184A JP 8455184 A JP8455184 A JP 8455184A JP H0360328 B2 JPH0360328 B2 JP H0360328B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- group
- weight
- aromatic
- polyethylene terephthalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 27
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- -1 polyethylene terephthalate Polymers 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 125000002091 cationic group Chemical group 0.000 claims description 9
- 239000011342 resin composition Substances 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 6
- 239000012954 diazonium Substances 0.000 claims description 3
- 239000011968 lewis acid catalyst Substances 0.000 claims description 3
- 125000000466 oxiranyl group Chemical group 0.000 claims description 3
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920003319 Araldite® Polymers 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000008188 pellet Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 125000000962 organic group Chemical group 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 238000007757 hot melt coating Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- WFVKIANRKSZMGB-UHFFFAOYSA-M 2,2-diethoxyacetate Chemical compound CCOC(C([O-])=O)OCC WFVKIANRKSZMGB-UHFFFAOYSA-M 0.000 description 1
- SFJRUJUEMVAZLM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxymethyl]oxirane Chemical compound CC(C)(C)OCC1CO1 SFJRUJUEMVAZLM-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229930015698 phenylpropene Natural products 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Description
〔発明の分野〕
本発明は冷却延伸処理を施さないポリエチレン
テレフタレート樹脂の成型物が比較的低温例えば
150℃で数時間の加熱により脆化する現象を改善
した紫外線硬化型樹脂組成物に関する。
〔従来技術〕
ポリエチレンテレフタレート樹脂(以下PET
と呼ぶ)は主として、繊維、フイルム等の形状で
電気絶縁および繊維産業用に多量に使用されてい
る。これらはすべて冷却延伸処理およびヒートセ
ツト処理により結晶構造が配向、規制され、強靭
かつ柔軟であり、200℃程度の温度では簡単には、
結晶構造が変化せず、柔軟性を保持することは周
知の通りである。
しかし、このPETを金属等の構成材料と一体
成型した場合は事後の冷却延伸処理は不可能であ
り、帰結するところPETは熱脆化が烈しく、実
用に耐えない。
本発明者等はこのような点に鑑み、長年の使用
実績のあるこの有用なPETを金属等の他の構成
材料と一体成型し、しかも事後の冷却延伸処理を
行なわなくても熱脆化しないPET系樹脂組成物
を得ることに成功した。
PET成型物は冷却延伸処理を施さなくても、
その冷却速度等の調整により柔軟性に富むが、加
工温度に比べて相対的に低温である150℃でも数
時間で、結晶構造が変化し、脆化する。そこで結
晶構造の変化を阻止すべく各種の官能性樹脂を混
合し、各種の架橋剤による架橋を行うことを検討
したが、PETの成型加工温度により架橋が部分
的または完全に進行し、加工中にゲル化して成型
物自体を安定に得ることができなかつた。
しかるに本発明者等は、ある種の官能性樹脂と
該官能性樹脂の重合を開始しうるルイス酸遊離型
光重合剤を配合した組成物のみが熱に安定であ
り、かつPETの押出加工温度でも殆んど分解せ
ず、自由に成型加工し得るのみならず、事後の紫
外線重合機能を保持することをついに発見した。
かくして、PETを主成分とする樹脂にエポキ
シ樹脂を混合しルイス酸遊離型光重合剤を配合す
ることにより、自由に成型可能であり、事後の紫
外線処理のみで熱脆化を生じないすぐれた画期的
樹脂組成物を得ることに成功した。
〔発明の概要〕
本発明は、ポリエチレンテレフタレート樹脂を
主成分とする樹脂と、1分子中にオキシラン環を
2個以上有するエポキシ樹脂を主成分とするカチ
オン重合性化合物の1種以上を前記ポリエチレン
テレフタレート樹脂に対して50重量パーセント以
下と、更に紫外線照射によりルイス酸触媒を遊離
する前記カチオン重合性化合物の光重合開始剤を
前記カチオン重合性化合物に対して0.1〜10重量
パーセント含むことを特徴とする紫外線硬化型樹
脂組成物である。
本発明に用いるPETはフイルムまたは繊維用
のグレード、あるいは固相重合法により重合度を
上げたボトル用グレード等の市販のものが好まし
いが、軟化点170℃以上であればイソフタル酸成
分が入つたものでも使用可能である。又同系統の
樹脂であるポリブチレンテレフタレート樹脂並び
に特願昭57−198113号によりPETとの相溶性の
あることが知られているポリアリレート樹脂、更
には特開昭57−138706号公報により相溶性のある
ことが知られているポリカーボネート樹脂を
PETの30重量パーセント以下置換したものであ
つても良い。
本発明に用いられるカチオン重合性化合物は、
1分子中にオキシラン環を2個以上有するエポキ
シ樹脂を主成分とするカチオン重合性化合物の1
種以上であり、このエポキシ樹脂としてはビスフ
エノールA型エポキシ樹脂、ノボラツク型エポキ
シ樹脂、脂環式エポキシ樹脂などが好ましい。
かかるビスフエノールA型エポキシ樹脂として
は、たとえばエピコート828、エピコート834、エ
ピコート836、エピコート1001、エピコート1004、
エピコート1007(以上、シエル化学社製、商品
名)、DER331、DER332、DER661、DER664、
DER667(以下、ダウケミカル社製、商品名)、ア
ラルダイト260、アラルダイト280、アラルダイト
6071、アラルダイト6084、アラルダイト6097(以
上、チバガイギー社製、商品名)などがあげら
れ、それらが単独または混合して用いられる。
また前記ノボラツク型エポキシ樹脂としては、
たとえばエピコート152、エピコート154(以上、
シエル化学社製、商品名)、アラルダイト
EPN1138、アラルダイトEPN1139、アラルダイ
トECN1235、アラルダイトECN1273、アラルダ
イトECN1280、アラルダイトECN1299(以上、チ
バガイギー社製、商品名)、DEN431、DEN438
(以上、ダウケミカル社製、商品名)などがあげ
られ、それらが単独または混合して用いられる。
さらに前記脂環式エポキシ樹脂としては、たと
えばアラルダイトCY175、アラルダイトCY177、
アラルダイトCY179、アラルダイトCY184、アラ
ルダイトCY192(以上、チバガイギー社製、商品
名)、ERL−4221、ERL−4299、ERL−4234(以
下、ユニオンカーバイト社製、商品名)などがあ
げられ、それらが単独または混合して用いられ
る。
その他ブタジエン系エポキシ樹脂などの使用も
可能であり、前記各種エポキシ樹脂を混合したも
のも使用しうる。
前記カチオン重合性化合物には硬化特性がわる
くならない範囲内で1官能エポキシ希釈剤を使用
してもよい。
かかる1官能エポキシ希釈剤としては、たとえ
ばフエニルグリシジルエーテル、t−ブチルグリ
シジルエーテルなどがあげられる。
さらにカチオン重合性ビニル化合物を前記エポ
キシ樹脂に混合して使用することも可能であり、
かかるカチオン重合性ビニル化合物としては、た
とえばスチレン、アリルベンゼン、トリアリルイ
ソシアネート、トリアリルシアネート、ビニルエ
ーテル、N−ビニルカルバゾール、N−ビニルビ
ロリドンなどがあげられる。
本発明に使用される紫外線照射によりカチオン
重合性化合物の重合を開始するルイス酸触媒を遊
離する光重合開始剤としては、芳香族ジアゾニウ
ム塩、芳香族ハロニウム塩、第a族または第
a族元素の光感応性芳香族オニウム塩などがあげ
られる。
かかる芳香族ジアゾニウム塩としては一般式
():
(式中、R1、R2は水素原子、アルキル基または
アルコキシ基、R3は水素原子、芳香族基または
アミド基やイオウ原子により連結された芳香族
基、Mは金属または半金属およびQはハロゲン原
子を表わし、またa=(b−c)が成立し、かつ
cは2〜7の整数でMの原子価に等しく、bはc
よりも大きい8以下の整数を表わす)で示される
化合物であつて、たとえば
[Field of the Invention] The present invention relates to a molded product of polyethylene terephthalate resin that is not subjected to cooling stretching treatment at a relatively low temperature, e.g.
This invention relates to an ultraviolet curable resin composition that has improved the phenomenon of embrittlement caused by heating at 150°C for several hours. [Conventional technology] Polyethylene terephthalate resin (hereinafter referred to as PET)
) are used in large quantities mainly in the form of fibers, films, etc. for electrical insulation and textile industries. All of these materials have their crystal structures oriented and regulated by cooling stretching treatment and heat setting treatment, making them strong and flexible, and at temperatures around 200°C,
It is well known that the crystal structure does not change and flexibility is maintained. However, if this PET is integrally molded with a constituent material such as metal, subsequent cooling and stretching treatment is impossible, and as a result, PET is severely thermally embrittled and cannot be put to practical use. In view of these points, the inventors of the present invention have developed a method of integrally molding this useful PET, which has been used for many years, with other constituent materials such as metal, and that it does not become thermally embrittled even without a subsequent cooling and stretching process. We succeeded in obtaining a PET-based resin composition. PET molded products do not need to be subjected to cooling stretching treatment.
Although it is highly flexible by adjusting the cooling rate, etc., the crystal structure changes and becomes brittle within a few hours even at 150°C, which is relatively low compared to the processing temperature. Therefore, in order to prevent changes in the crystal structure, we considered mixing various functional resins and performing crosslinking with various crosslinking agents, but the crosslinking progressed partially or completely depending on the PET molding temperature. The molded product itself could not be stably obtained due to gelation. However, the present inventors have found that only compositions containing a certain type of functional resin and a Lewis acid-releasing photopolymerizer capable of initiating polymerization of the functional resin are stable to heat, and are stable at a temperature of PET extrusion processing. However, they have finally discovered that it not only hardly decomposes and can be freely molded, but also retains its UV polymerization function after the process. Thus, by mixing an epoxy resin with a PET-based resin and adding a Lewis acid-releasing photopolymerization agent, it is possible to create an excellent image that can be freely molded and does not cause thermal embrittlement with only subsequent ultraviolet treatment. We succeeded in obtaining a novel resin composition. [Summary of the Invention] The present invention provides a method for combining a resin whose main component is polyethylene terephthalate resin and one or more cationically polymerizable compounds whose main component is an epoxy resin having two or more oxirane rings in one molecule into the polyethylene terephthalate resin. It is characterized by containing 50% by weight or less based on the resin, and further containing 0.1 to 10% by weight based on the cationic polymerizable compound of a photopolymerization initiator for the cationic polymerizable compound that releases the Lewis acid catalyst by irradiation with ultraviolet rays. It is an ultraviolet curable resin composition. The PET used in the present invention is preferably commercially available, such as a film or fiber grade, or a bottle grade with an increased degree of polymerization using solid phase polymerization, but if the softening point is 170°C or higher, it may contain an isophthalic acid component. It can also be used. In addition, polybutylene terephthalate resin, which is a resin of the same type, and polyarylate resin, which is known to be compatible with PET according to Japanese Patent Application No. 57-198113, and also compatible with PET, according to Japanese Patent Application No. 57-138706. polycarbonate resin known to have
It may be substituted with 30% by weight or less of PET. The cationic polymerizable compound used in the present invention is
A cationic polymerizable compound whose main component is an epoxy resin having two or more oxirane rings in one molecule
The epoxy resin is preferably a bisphenol A type epoxy resin, a novolak type epoxy resin, an alicyclic epoxy resin, or the like. Such bisphenol A type epoxy resins include, for example, Epicote 828, Epicote 834, Epicote 836, Epicote 1001, Epicote 1004,
Epicote 1007 (manufactured by Ciel Chemical Co., Ltd., product name), DER331, DER332, DER661, DER664,
DER667 (hereinafter manufactured by Dow Chemical Company, product name), Araldite 260, Araldite 280, Araldite
6071, Araldite 6084, Araldite 6097 (trade names, manufactured by Ciba Geigy), etc., and these may be used alone or in combination. Further, as the novolak type epoxy resin,
For example, Epicote 152, Epicote 154 (and above,
Manufactured by Ciel Chemical Co., Ltd., trade name), Araldite
EPN1138, Araldite EPN1139, Araldite ECN1235, Araldite ECN1273, Araldite ECN1280, Araldite ECN1299 (manufactured by Ciba Geigy, product name), DEN431, DEN438
(all manufactured by Dow Chemical Company, trade name), etc., and these can be used alone or in combination. Further, examples of the alicyclic epoxy resin include Araldite CY175, Araldite CY177,
Araldite CY179, Araldite CY184, Araldite CY192 (manufactured by Ciba Geigy, product name), ERL-4221, ERL-4299, ERL-4234 (manufactured by Union Carbide, product name), etc. Or used in combination. Other butadiene-based epoxy resins can also be used, and mixtures of the various epoxy resins mentioned above can also be used. A monofunctional epoxy diluent may be used in the cationic polymerizable compound within a range that does not deteriorate the curing properties. Examples of such monofunctional epoxy diluents include phenyl glycidyl ether and t-butyl glycidyl ether. Furthermore, it is also possible to use a cationically polymerizable vinyl compound mixed with the epoxy resin,
Examples of such cationically polymerizable vinyl compounds include styrene, allylbenzene, triallyl isocyanate, triallylcyanate, vinyl ether, N-vinylcarbazole, and N-vinylpyrrolidone. The photopolymerization initiator used in the present invention, which releases a Lewis acid catalyst that initiates polymerization of a cationically polymerizable compound by ultraviolet irradiation, includes aromatic diazonium salts, aromatic halonium salts, group a or group a element Examples include photosensitive aromatic onium salts. Such an aromatic diazonium salt has the general formula (): (In the formula, R 1 and R 2 are hydrogen atoms, alkyl groups, or alkoxy groups, R 3 is a hydrogen atom, an aromatic group, or an aromatic group connected by an amide group or a sulfur atom, M is a metal or semimetal, and Q represents a halogen atom, a=(b-c) holds, and c is an integer from 2 to 7 and equal to the valence of M, and b is c
(representing an integer greater than or equal to 8), for example,
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
などがあげられる。
また前記芳香族ハロニウム塩としては一般式
():
〔(R4)d(R5)eX〕+ f〔MQg〕-(g-h) ()
(式中、R4は1価の芳香族有機基、R5は2価の
芳香族有機基、XはたとえばI、Br、Clなどの
ハロゲン原子、Mは金属または半金属およびQは
ハロゲン原子を表わし、dは0または2、eは0
または1であり、かつ(d+e)は2またはXの
原子価に等しく、gはhよりも大きい8以下の整
数を表わす)で示される化合物であつて、たとえ
ば
などがあげられる。
さらに第a族元素または第a族元素の光感
応性芳香族オニウム塩としては一般式():
〔(R6)i i(R7)j(R8)kY〕+ l〔MQn〕-(m-n) ()
(式中、R6は1価の芳香族有機基、R7はアルキ
ル基、シクロアルキル基、置換アルキル基よりな
る群からえらばれた1価の脂肪族有機基、R8は
脂肪族有機基および芳香族有機基からえらばれた
複素環基または縮合環構造を構成する多価有機
基、YはS、Se、Teの第a族元素またはN、
P、As、SbおよびBiからえらばれた第a族元
素、Mは金属または半金属およびQはハロゲン原
子を表わし、iは0〜4の整数、jは0〜2の整
数、kは0〜2の整数であり、かつ(i+j+
k)はYの原子価に等しく、Yが第a族元素の
ときは3、Yが第a族元素のときは4に等し
く、i=(m−n)が成立し、かつnは2〜7の
整数でMの原子価に等しく、mはnよりも大きい
8以下の整数を表わす)で示される化合物であつ
て、第a族元素のオニウム塩としては、たとえ
ば etc. Further, the aromatic halonium salt has the general formula (): [(R 4 ) d (R 5 ) e X] + f [MQ g ] -(gh) () (wherein, R 4 is a monovalent aromatic organic group, R 5 is a divalent aromatic organic group, X is a halogen atom such as I, Br, Cl, M is a metal or metalloid and Q is a halogen atom, d is 0 or 2, e is 0
or 1, and (d+e) is equal to 2 or the valence of etc. Further, as a group a element or a photosensitive aromatic onium salt of a group a element, the general formula (): [(R 6 ) i i (R 7 ) j (R 8 ) k Y] + l [MQ n ] -(mn) () (wherein R 6 is a monovalent aromatic organic group, R 7 is a monovalent aliphatic organic group selected from the group consisting of an alkyl group, a cycloalkyl group, and a substituted alkyl group, R 8 is a heterocyclic group selected from an aliphatic organic group and an aromatic organic group or a polyvalent organic group constituting a condensed ring structure, Y is a group a element of S, Se, Te or N,
Group A element selected from P, As, Sb and Bi; M is a metal or metalloid; Q is a halogen atom; i is an integer of 0 to 4; j is an integer of 0 to 2; k is an integer of 0 to 2; is an integer of 2, and (i+j+
k) is equal to the valence of Y, equal to 3 when Y is a group a element, equal to 4 when Y is a group a element, i=(m-n) holds, and n is 2 to A compound represented by an integer of 7 equal to the valence of M, where m represents an integer greater than n and less than or equal to 8), and as an onium salt of a group a element, for example,
【式】【formula】
などがあげられ、第a族元素のオニウム塩とし
ては、たとえば
Examples of onium salts of group a elements include
【式】【formula】
などがあげられる。
カチオン重合性化合物に対して添加される前記
ルイス酸遊離型光重合開始剤の量は、カチオン重
合性化合物の0.1〜10重量%好ましくは1〜5重
量%であり、0.1重量%未満になると紫外線によ
る架橋反応速度が遅くなり、処理時間が長くなり
すぎる傾向があり、10重量%をこえると触媒コス
トが高価であるため樹脂組成物の価格が高くな
る。
本発明の組成物はインジエクシヨン、押出、プ
レス等の成型加工により金属等と一体となつた構
成材料、すなわち防蝕金属材、電子回路用基板、
絶縁電線などに用いることができる。また、成型
加工後の紫外線架橋処理には低圧水銀灯、高圧水
銀灯、キセノンランプ、カーボンアーク灯などの
光源による照射や電子線照射などが用いられる。
〔発明の実施例〕
つぎに本発明の組成物について実施例および比
較例にもとづいて詳細に説明するが、本発明は下
記実施例のみに限定されるものではない。
実施例 1
PETのペレツト70重量部を冷凍粉砕しバルク
状(塊状)とし、エピコート828(ビスフエノール
A型エポキシ樹脂)30重量部およびトリフエニル
スルホニウムヘキサフルオロアンチモネート0.5
重量部を混合し、ニーダーにて280℃で10分間混
練し、次いで冷却、ペレツト化し、このペレツト
をバレル250℃、ヘツド280℃に保持したL/D=
28の押出機のホツパーに投入し、T型ダイスによ
り0.25mm厚巾50mmの銅条の上に組成物の厚さ50μ
mにて押出被覆し、片面一体成型の銅条を得た。
この成型物の3mm径180゜折曲げ特性と、被覆面
上に1.6mm径の鋼球を置き、その上に1Kgの荷重
をかけ、鋼球と銅条間に交流100Vを印荷し、恒
温槽中にて約2℃/分の割合で昇温することによ
り測定した軟化点を第一表に示す。
実施例 2
実施例1と同様にして得られたペレツトをバレ
ル250℃、ヘツド280℃に保持したL/D=28の押
出機のホツパーに投入し、クロスヘツドにより
1.0mm径の銅線上に厚さ40μmにて押出し、絶縁電
線を得た。JISC3003に従つた巻付可撓性と軟化
点の測定結果を第一表に表す。
実施例 3
PETのペレツト80重量部を冷凍粉砕してバル
ク状とし、エピコート152(ノボラツク型エポキシ
樹脂)20重量部およびジフエニルヨードニウムヘ
キサフルオロフオスフエート0.3重量部を混合し、
ニーダーにて280℃で10分間混練し、次いで冷却、
ペレツト化し、このペレツトをバレル260℃、ク
ロスヘツド280℃に保持したL/D=28の押出機
のホツパーに投入し、1.0mm径の銅線に厚さ40μm
にて押出し、絶縁電線を得た。JIS C3003に従つ
た巻付可撓性と軟化点の測定結果を第一表に示
す。
実施例 4
PETのペレツト70重量部をp−クロルフエノ
ール397重量部に溶解し、20重量部のエピコート
828、および10重量部のエピコート152を溶解分散
させ、次いでトリフエニルスルホニウムヘキサフ
ルオロアンチモネートのプロピレンカーボネート
50%溶液1.0重量部を追加溶解し、透明な均一溶
液を得た。
この溶液を100℃、減圧にて溶剤分を充分に除
去し、窒素ガス加圧下にて下部孔より吐出可能な
構造を有する溶融槽にて280℃で融解せしめ吐出
孔を通常の電線被覆用と同一機構のクロスヘツド
に接続し、ダイス、ニツプルを使用し、1.0mm径
の銅線上に厚さ40μmにて被覆した。この時クロ
スヘツドの温度は290℃であつた。なお、この被
覆方法は一般にホツトメルトコーテイング法と呼
ばれているものである。
得られた絶縁電線のJIS C3003に従つた巻付可
撓性と軟化点の測定結果を第一表に示す。
比較例 1
PETのペレツトをバレル250℃、ヘツド290℃
に保持したL/D=28の押出機のホツパーに投入
し、T型ダイスにより0.25mm厚、巾50mmの銅条の
上に厚さ50μmにて押出被覆し、片面一体成型の
銅条を得た。実施例1と同じ方法により得られた
曲げ特性と軟化点を第一表に示す。
比較例 2
PETのペレツトをバレル250℃、ヘツド290℃
に保持した実施例2と同一押出機に投入し、1.0
mm銅線上に厚さ40μmにて押出し、絶縁電線を得
た。
JIS C3003に従つた巻付可撓性と軟化点の測定
結果を第一表に示す。
比較例 3
PETのペレツト80重量部をp−クロルフエノ
ール453重量部に溶解し、ビスフエノールAのグ
リシジルエーテル(粘度120〜150ポイズ/25℃、
エポキシ当量184〜194)をジアクリレート化した
ものでGramdic FC−0511(大日本インキ化学工
業社製、商品名)20重量部を溶解分散させ、次い
で光重合開始剤として2,2−ジエトキシアセト
フエノン0.2重量部を追加溶解し、透明な均一溶
液を得た。
この溶液を実施例4と同一の方法、条件にて溶
剤分を除去し、所謂ホツトメルトコーテイング法
にて1.0mm径の銅線上に被覆を試みた。しかし、
溶融組成物はゲル化し、絶縁電線は得られなかつ
た。
〔発明の効果〕
第一表に示す実験結果から明らかな如く、比較
例1〜2に示すPETのみの成型物は熱脆化が烈
しく、実用に耐えない。また、アクリレート系架
橋剤の使用は比較例3に示す如く、成型加工中に
ゲル化、成型物が得られない。これに対し、本発
明の実施例1〜4においては成型加工中にゲル化
を生じることなく、得られた成型物は紫外線未照
射では配合されたエポキシ樹脂が可塑剤的に働き
軟化点は低く、熱脆化の現象も認められるが、こ
れを紫外線照射処理することにより、軟化点も改
善され、200℃熱劣化による脆化についてはほぼ
完全に改良されることが判る。
なお、本発明による組成物を用いた成型物の紫
外線照射処理を行つたものは機械的強度、電気絶
縁性、耐溶剤性等に於ても優れており、極めて有
用な組成物であることが確認された。 etc. The amount of the Lewis acid free photopolymerization initiator added to the cationic polymerizable compound is 0.1 to 10% by weight, preferably 1 to 5% by weight of the cationic polymerizable compound, and if it is less than 0.1% by weight, UV rays The crosslinking reaction rate tends to be slow and the treatment time tends to be too long, and if the amount exceeds 10% by weight, the catalyst cost is high, which increases the price of the resin composition. The composition of the present invention can be applied to constituent materials that are integrated with metal etc. by molding processes such as injection, extrusion, and pressing, i.e., corrosion-resistant metal materials, substrates for electronic circuits,
Can be used for insulated wires, etc. Further, for the ultraviolet cross-linking treatment after the molding process, irradiation with a light source such as a low-pressure mercury lamp, high-pressure mercury lamp, xenon lamp, or carbon arc lamp, or electron beam irradiation is used. [Examples of the Invention] Next, the composition of the present invention will be described in detail based on Examples and Comparative Examples, but the present invention is not limited to the following Examples. Example 1 70 parts by weight of PET pellets were freeze-pulverized into bulk form (clumps), and 30 parts by weight of Epicote 828 (bisphenol A type epoxy resin) and 0.5 parts by weight of triphenylsulfonium hexafluoroantimonate were added.
The parts by weight were mixed, kneaded in a kneader at 280°C for 10 minutes, then cooled and pelletized, and the pellets were maintained at 250°C in the barrel and 280°C in the head.L/D=
The composition was put into the hopper of a No. 28 extruder, and the composition was placed on a copper strip of 0.25 mm thick and 50 mm thick using a T-type die to a thickness of 50 μm.
The copper strip was coated by extrusion at M to obtain a single-sided integrally molded copper strip. This molded product has a bending property of 180° with a diameter of 3 mm, a steel ball with a diameter of 1.6 mm is placed on the coated surface, a load of 1 kg is applied thereto, 100 V AC is applied between the steel ball and the copper strip, and the temperature is constant. Table 1 shows the softening points measured by increasing the temperature in a bath at a rate of about 2° C./min. Example 2 Pellets obtained in the same manner as in Example 1 were charged into the hopper of an extruder with L/D = 28, which was maintained at a barrel temperature of 250°C and a head temperature of 280°C.
It was extruded onto a 1.0 mm diameter copper wire to a thickness of 40 μm to obtain an insulated wire. Table 1 shows the measurement results of winding flexibility and softening point according to JISC3003. Example 3 80 parts by weight of PET pellets were frozen and crushed into a bulk form, and 20 parts by weight of Epicote 152 (novolac type epoxy resin) and 0.3 parts by weight of diphenyliodonium hexafluorophosphate were mixed,
Kneaded in a kneader at 280℃ for 10 minutes, then cooled.
The pellets were made into pellets, and the pellets were put into the hopper of an extruder with L/D = 28, which maintained the barrel at 260℃ and the crosshead at 280℃.
An insulated wire was obtained by extrusion. Table 1 shows the measurement results of winding flexibility and softening point according to JIS C3003. Example 4 70 parts by weight of PET pellets were dissolved in 397 parts by weight of p-chlorophenol, and 20 parts by weight of Epicoat was dissolved in 397 parts by weight of p-chlorophenol.
828, and 10 parts by weight of Epicote 152 are dissolved and dispersed, and then triphenylsulfonium hexafluoroantimonate propylene carbonate is dissolved and dispersed.
1.0 part by weight of the 50% solution was further dissolved to obtain a transparent homogeneous solution. The solvent was sufficiently removed from this solution at 100℃ under reduced pressure, and the solution was melted at 280℃ in a melting tank with a structure that allows it to be discharged from the lower hole under nitrogen gas pressure. It was connected to a crosshead of the same mechanism and coated on a 1.0 mm diameter copper wire to a thickness of 40 μm using a die and a nipple. At this time, the crosshead temperature was 290°C. Note that this coating method is generally called a hot melt coating method. Table 1 shows the results of measuring the winding flexibility and softening point of the obtained insulated wire according to JIS C3003. Comparative example 1 PET pellets were heated at 250°C in the barrel and at 290°C in the head.
It was put into the hopper of an extruder with L/D = 28 held at Ta. The bending properties and softening points obtained by the same method as in Example 1 are shown in Table 1. Comparative example 2 PET pellets were heated at 250°C in the barrel and 290°C in the head.
1.0
It was extruded onto mm copper wire to a thickness of 40 μm to obtain an insulated wire. Table 1 shows the measurement results of winding flexibility and softening point according to JIS C3003. Comparative Example 3 80 parts by weight of PET pellets were dissolved in 453 parts by weight of p-chlorophenol, and glycidyl ether of bisphenol A (viscosity 120-150 poise/25°C,
20 parts by weight of Gramdic FC-0511 (manufactured by Dainippon Ink & Chemicals Co., Ltd., trade name) was dissolved and dispersed in diacrylate of epoxy equivalent (184 to 194), and then 2,2-diethoxyacetate was added as a photopolymerization initiator. 0.2 parts by weight of phenone was additionally dissolved to obtain a transparent homogeneous solution. The solvent was removed from this solution using the same method and conditions as in Example 4, and an attempt was made to coat a copper wire with a diameter of 1.0 mm using the so-called hot melt coating method. but,
The molten composition gelled and no insulated wire was obtained. [Effects of the Invention] As is clear from the experimental results shown in Table 1, the molded products made only of PET shown in Comparative Examples 1 and 2 suffer from severe thermal embrittlement and cannot be put to practical use. Furthermore, as shown in Comparative Example 3, when an acrylate crosslinking agent is used, gelation occurs during the molding process, and a molded product cannot be obtained. In contrast, in Examples 1 to 4 of the present invention, gelation did not occur during the molding process, and the molded products obtained had a low softening point as the epoxy resin acted as a plasticizer when not irradiated with ultraviolet rays. The phenomenon of thermal embrittlement is also observed, but by UV irradiation treatment, the softening point is also improved, and it can be seen that the embrittlement caused by thermal deterioration at 200°C is almost completely improved. In addition, molded products using the composition according to the present invention that have been subjected to ultraviolet irradiation treatment have excellent mechanical strength, electrical insulation properties, solvent resistance, etc., and are therefore extremely useful compositions. confirmed.
【表】【table】
Claims (1)
する樹脂と、1分子中にオキシラン環を2個以上
有するエポキシ樹脂を主成分とするカチオン重合
性化合物の1種以上を前記ポリエチレンテレフタ
レート樹脂に対して50重量パーセント以下と、更
に紫外線照射によりルイス酸触媒を遊離する前記
カチオン重合性化合物の光重合開始剤を前記カチ
オン重合性化合物に対して0.1〜10重量パーセン
ト含むことを特徴とする紫外線硬化型樹脂組成
物。 2 光重合開始剤が芳香族ジアゾニウム塩、芳香
族ハロニウム塩、および第a族元素または第
a族元素の光感応性芳香族オニウム塩よりなる群
からえらばれた1種または2種以上の混合物であ
る特許請求の範囲第1項記載の紫外線硬化型樹脂
組成物。 3 ポリエチレンテレフタレート樹脂の30重量パ
ーセント以下をポリブチレンテレフタレート樹
脂、ポリアリレート樹脂、又はポリカーボネート
樹脂で置換した特許請求の範囲第1項記載の紫外
線硬化型樹脂組成物。[Scope of Claims] 1. A resin whose main component is a polyethylene terephthalate resin, and one or more cationic polymerizable compounds whose main component is an epoxy resin having two or more oxirane rings in one molecule are added to the polyethylene terephthalate resin. Ultraviolet curing characterized by containing 0.1 to 10 weight percent of the cationic polymerizable compound photopolymerization initiator, which releases the Lewis acid catalyst by ultraviolet irradiation. mold resin composition. 2. The photopolymerization initiator is one or a mixture of two or more selected from the group consisting of aromatic diazonium salts, aromatic halonium salts, and group a elements or photosensitive aromatic onium salts of group a elements. An ultraviolet curable resin composition according to claim 1. 3. The ultraviolet curable resin composition according to claim 1, wherein 30 weight percent or less of the polyethylene terephthalate resin is replaced with a polybutylene terephthalate resin, a polyarylate resin, or a polycarbonate resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8455184A JPS60228527A (en) | 1984-04-26 | 1984-04-26 | Ultraviolet-curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8455184A JPS60228527A (en) | 1984-04-26 | 1984-04-26 | Ultraviolet-curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60228527A JPS60228527A (en) | 1985-11-13 |
JPH0360328B2 true JPH0360328B2 (en) | 1991-09-13 |
Family
ID=13833777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8455184A Granted JPS60228527A (en) | 1984-04-26 | 1984-04-26 | Ultraviolet-curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60228527A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0768439B2 (en) * | 1987-10-13 | 1995-07-26 | 三菱電機株式会社 | UV curable resin composition |
JPH0684446B2 (en) * | 1988-10-31 | 1994-10-26 | 三菱油化株式会社 | Heat-resistant photo-crosslinked polyethylene terephthalate film |
DE69120732T2 (en) * | 1990-04-26 | 1996-12-05 | Mitsubishi Chem Corp | Polyethylene terephthalate composition |
CA2115888A1 (en) | 1993-04-15 | 1994-10-16 | Clayton A. George | Epoxy/polyester hot melt compositions |
US7575653B2 (en) | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
US6077601A (en) | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
US6274643B1 (en) | 1998-05-01 | 2001-08-14 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
US6136398A (en) * | 1998-05-01 | 2000-10-24 | 3M Innovative Properties Company | Energy cured sealant composition |
US6228133B1 (en) | 1998-05-01 | 2001-05-08 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
US6057382A (en) * | 1998-05-01 | 2000-05-02 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
-
1984
- 1984-04-26 JP JP8455184A patent/JPS60228527A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60228527A (en) | 1985-11-13 |
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