JPH0359810U - - Google Patents
Info
- Publication number
- JPH0359810U JPH0359810U JP1989119220U JP11922089U JPH0359810U JP H0359810 U JPH0359810 U JP H0359810U JP 1989119220 U JP1989119220 U JP 1989119220U JP 11922089 U JP11922089 U JP 11922089U JP H0359810 U JPH0359810 U JP H0359810U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- resin layer
- volume
- thermosetting resin
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案による成形型の構成、第２図は
本考案に基づく製作工程を示す。 １……キヤビテイ、２……コア、３……エジエ
クタ、４……エジエクタピン、５……ゲート、６
……冷却パイプ、７……金属球、８……型用樹脂
材料、９……成形品、１１……主剤、１２……硬
化剤、１３……樹脂配合品、１４……減圧装置、
１５……真空容器、１６……モデル、１７……枠
、１８……樹脂注型用穴、１９……樹脂硬化用オ
ーブン、２１……キヤビテイ、２２……コア、２
３……アルミニウム球、２４……マトリツクス材
、２５−ａ……樹脂層、２５−ｂ……金属層。
本考案に基づく製作工程を示す。 １……キヤビテイ、２……コア、３……エジエ
クタ、４……エジエクタピン、５……ゲート、６
……冷却パイプ、７……金属球、８……型用樹脂
材料、９……成形品、１１……主剤、１２……硬
化剤、１３……樹脂配合品、１４……減圧装置、
１５……真空容器、１６……モデル、１７……枠
、１８……樹脂注型用穴、１９……樹脂硬化用オ
ーブン、２１……キヤビテイ、２２……コア、２
３……アルミニウム球、２４……マトリツクス材
、２５−ａ……樹脂層、２５−ｂ……金属層。
Claims (1)
- 金属製裏打ち材料の上に、熱硬化性樹脂層を形
成してなる型において、該熱硬化性樹脂層中に、
容積が１０−３〜１０cm3の金属球を、５〜４５
容積％含有し、かつ該金属球が金属製裏打ち材料
の近傍に配置されていることを特徴とする樹脂製
の型。
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11922089U JPH0732011Y2 (ja) | 1989-10-13 | 1989-10-13 | 樹脂製の型 |
| DE69027819T DE69027819T2 (de) | 1989-08-07 | 1990-08-03 | Form aus metallpulvergefülltem Epoxyharz und Verfahren zu deren Herstellung |
| ES90402242T ES2091810T3 (es) | 1989-08-07 | 1990-08-03 | Molde de resina epoxy rellena con polvo metalico y metodo para su fabricacion. |
| US07/562,856 US5156754A (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold |
| CA002022642A CA2022642C (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold and method of producing the same |
| EP90402242A EP0412891B1 (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold and method of producing the same |
| KR1019900012064A KR920005524B1 (ko) | 1989-08-07 | 1990-08-07 | 금속분말이 충전된 에폭시수지금형 및 그 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11922089U JPH0732011Y2 (ja) | 1989-10-13 | 1989-10-13 | 樹脂製の型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359810U true JPH0359810U (ja) | 1991-06-12 |
| JPH0732011Y2 JPH0732011Y2 (ja) | 1995-07-26 |
Family
ID=31667352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11922089U Expired - Fee Related JPH0732011Y2 (ja) | 1989-08-07 | 1989-10-13 | 樹脂製の型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732011Y2 (ja) |
-
1989
- 1989-10-13 JP JP11922089U patent/JPH0732011Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0732011Y2 (ja) | 1995-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |