JPH0359692U - - Google Patents
Info
- Publication number
- JPH0359692U JPH0359692U JP12151389U JP12151389U JPH0359692U JP H0359692 U JPH0359692 U JP H0359692U JP 12151389 U JP12151389 U JP 12151389U JP 12151389 U JP12151389 U JP 12151389U JP H0359692 U JPH0359692 U JP H0359692U
- Authority
- JP
- Japan
- Prior art keywords
- shield frame
- solder layer
- frequency
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000004512 die casting Methods 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12151389U JPH0359692U (no) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12151389U JPH0359692U (no) | 1989-10-16 | 1989-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359692U true JPH0359692U (no) | 1991-06-12 |
Family
ID=31669547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12151389U Pending JPH0359692U (no) | 1989-10-16 | 1989-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359692U (no) |
-
1989
- 1989-10-16 JP JP12151389U patent/JPH0359692U/ja active Pending