JPH0358805A - Cutting method for slicing machine and its device - Google Patents
Cutting method for slicing machine and its deviceInfo
- Publication number
- JPH0358805A JPH0358805A JP19455789A JP19455789A JPH0358805A JP H0358805 A JPH0358805 A JP H0358805A JP 19455789 A JP19455789 A JP 19455789A JP 19455789 A JP19455789 A JP 19455789A JP H0358805 A JPH0358805 A JP H0358805A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- air
- blade
- slicing machine
- inner peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000007664 blowing Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000002826 coolant Substances 0.000 abstract description 10
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 description 25
- 239000010953 base metal Substances 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、スライシングマシンの切断方法及びその装置
に係り、特に半導体製造工程に於いて、シリコン等の半
導体インゴットをウェハに切断するスライシングマシン
の切断方法及びその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting method using a slicing machine and an apparatus thereof, and particularly to a cutting method using a slicing machine that cuts a semiconductor ingot such as silicon into wafers in a semiconductor manufacturing process. This invention relates to a cutting method and device.
従来、インゴットをウエハに切断する装置として、スラ
イシングマシンが使用されている。Conventionally, a slicing machine has been used as a device for cutting an ingot into wafers.
第４図では、この種のスライシングマシンの内周刃付這
の構造が示され、第４図に於いて、スピンドルｌＯの上
端に設けられたカップ形状の回転体ｌ２には内周刃１４
が所定の張力を持って張設され、インゴッ｝１６は、こ
の内周刃ｌ４によって薄片状に切断される。FIG. 4 shows the structure of this type of slicing machine with an inner peripheral blade, and in FIG.
is stretched with a predetermined tension, and the ingot 16 is cut into thin pieces by the inner peripheral blade l4.
しかしながら、前記内周刃は、クーラント液の粘性抵抗
で内周刃の台金がインゴットの切断面に吸着し反りが発
生するので、内周刃はインゴットの切断加工位置が不安
定になり、ウェハの切断面に反りや歪み等を発生させる
。このような場合、従来は内周刃ｌ４のドレッシングや
増し張り（張力を加えること）で対応していたが、ドレ
ッシングや増し張りは熟練と経験が必要であった。However, due to the viscous resistance of the coolant liquid, the base metal of the inner peripheral blade sticks to the cutting surface of the ingot and warps occur, so the position of the inner peripheral blade becomes unstable when cutting the ingot, and the wafer This causes warping, distortion, etc. on the cut surface. Conventionally, such cases have been dealt with by dressing or retensioning (applying tension) the inner peripheral blade l4, but dressing and retensioning require skill and experience.
本発明はこのような事情に鑑みてなされたもので、内周
刃の切断加工位置を安定することができるスライシング
マシンの切断方法及びその装置を提供することを目的と
する。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cutting method for a slicing machine and an apparatus therefor, which can stabilize the cutting position of the inner peripheral blade.
本発明は、前記目的を達戊する為に、回転するスピンド
ルに切断刃を取付けて柱状体材料を薄片状に切断するス
ライシングマシンの切断方法に於いて、切断した柱状体
材料の切断溝の壁面と切断刃の台金との間の隙間に向け
てエアーを吹き出すことを特徴とする。In order to achieve the above object, the present invention provides a cutting method using a slicing machine that cuts a columnar material into thin pieces by attaching a cutting blade to a rotating spindle. The feature is that air is blown out towards the gap between the blade and the base metal of the cutting blade.
本発明によれば、前記エアー吹出し手段（２４〉からの
エアーを切断溝の壁面（３８Ａ，４０Ａ〉と切断刃（２
２）の台金との間の隙間に向けて吹き出し、クーラント
液の粘性抵抗で切断刃〈２２〉の台金がインゴット切断
面に吸着するのを阻止する。これによって、切断刃（２
２）は切断加工位置を安定することができる。According to the present invention, the air from the air blowing means (24) is directed to the wall surface of the cutting groove (38A, 40A>) and the cutting blade (24).
The coolant is blown toward the gap between the coolant and the base metal of 2), and the viscous resistance of the coolant liquid prevents the base metal of the cutting blade <22> from adhering to the cut surface of the ingot. This allows the cutting blade (2
2) The cutting position can be stabilized.
以下添付図面に従って本発明に係るスライシングマシン
の切断方法及びその装置の好ましい実施例を詳説する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the slicing machine cutting method and apparatus according to the present invention will be described in detail below with reference to the accompanying drawings.
第ｌ図に於いて、スライシングマシン１８の本体２０の
上面には内周刃２２が配置され、この内周刃２２の近傍
には第２図に示すように、エアー吹出しノズル２４、２
５が取付けられている。また、前記内周刃２２は、回転
体２６に所定の張力で張設されている。前記回転体２６
は、スピンドル２８に取付けられ、スピンドル２８は図
示しない回転機構により回転される。In FIG. 1, an inner circumferential blade 22 is arranged on the upper surface of the main body 20 of the slicing machine 18, and air blowing nozzles 24, 2 are disposed near the inner circumferential blade 22, as shown in FIG.
5 is installed. Further, the inner peripheral blade 22 is stretched around the rotating body 26 with a predetermined tension. The rotating body 26
is attached to a spindle 28, and the spindle 28 is rotated by a rotation mechanism (not shown).
また、本体２０の・上面には、切断送りテーブル３０が
矢印Ａ，Ｂ方向に摺勤自在に支持され、図示しない駆Ｄ
源によって往復動される。前記切断送りテーブル３０の
第１図上左端部には支柱３２が立設され、支柱３２の正
面には割出スライダ３４が取付けちれている。前記割出
スライダ３４は、支柱３２の長手方向に取付けられてい
る図示しない送りネジ部と螺合し、この送りネジ部が回
転すると支柱３２の長手方向、即ち上下方向に移動する
ことができる。Further, a cutting feed table 30 is supported on the upper surface of the main body 20 so as to be slidable in the directions of arrows A and B.
reciprocated by the source. A column 32 is erected at the upper left end of the cutting feed table 30 in FIG. 1, and an index slider 34 is attached to the front surface of the column 32. The index slider 34 is threadedly engaged with a feed screw portion (not shown) attached in the longitudinal direction of the support column 32, and when the feed screw portion rotates, it can move in the longitudinal direction of the support column 32, that is, in the vertical direction.
また、割出スライダ３４は、スライスベース３６が固着
されたインゴット３８を支持している。Further, the index slider 34 supports an ingot 38 to which a slice base 36 is fixed.
これによって、インゴット３８は矢印ＡＳＢ方向（切断
方向）及び矢印Ｃ，Ｄ方向（インゴット切断厚さ割り出
し方向〉に移動することができる。As a result, the ingot 38 can be moved in the direction of arrow ASB (cutting direction) and in the direction of arrows C and D (ingot cutting thickness indexing direction).
第３図は、前記内周刃２２付近の要部側面図が示され、
第２図に示したエアー吹出しノズル２４、２５は、内周
刃２２の上側、下側に一対設置されている。また、エア
ー吹出しノズル２４、２５のエアー吹出口２４Ａ、２５
Ａは内周刃２２に対して傾斜して設けられ、上側のエア
ー吹出口２４Ａが切断しているインゴット３８の切断溝
の上壁３８Ａと内周刃２２の台金２３の上面との間に向
けられ、下側のエアー吹出口２５Ａが内周刃２２の台金
２３の下面と切断溝の下９ ４ Ｑ Ａとの間の隙間に
向けられている。FIG. 3 shows a side view of the main part near the inner peripheral blade 22,
A pair of air blowing nozzles 24 and 25 shown in FIG. 2 are installed above and below the inner peripheral blade 22. In addition, the air blowing ports 24A and 25 of the air blowing nozzles 24 and 25
A is provided at an angle with respect to the inner peripheral blade 22, and is between the upper wall 38A of the cutting groove of the ingot 38 cut by the upper air outlet 24A and the upper surface of the base metal 23 of the inner peripheral blade 22. The lower air outlet 25A is directed toward the gap between the lower surface of the base metal 23 of the inner peripheral blade 22 and the lower part 94QA of the cutting groove.
前記エアー吹出しノズル２４、２５は第２図に示したよ
うに、空気圧制御装置４２を介してエアー源に連通され
、吹き出すエアー流量が制御される。また、内周刃２２
に近接して変位検出器４４、４４が所定の間隔で取付け
られ、変位検出器４４の先端から内周刃２２の上表面ま
での距離を非接触で検出し、その信号を非接触式変位計
４６に送っている。前記検出器４４は、公知の非接式セ
ンサが用いられる。非接触式変位計４６からの検出信号
は主制御装置４８に送られる。主制御装Ｗ４８は、前記
検出信号に基づいて前記空気圧制！ＩＩ装置４４に制御
信号を送り、エアー吹出しノズル２４、２５の吹出口２
４Ａ、２５Ａから吹き出すエアー流量を調節する。As shown in FIG. 2, the air blowing nozzles 24 and 25 are communicated with an air source via an air pressure control device 42 to control the flow rate of the air blowing out. In addition, the inner peripheral blade 22
Displacement detectors 44, 44 are installed at a predetermined interval in the vicinity of I am sending it to 46. As the detector 44, a known non-contact sensor is used. A detection signal from the non-contact displacement meter 46 is sent to the main controller 48. The main control unit W48 controls the air pressure based on the detection signal! A control signal is sent to the II device 44, and the air outlet 2 of the air blowing nozzles 24 and 25 is
Adjust the air flow rate blown out from 4A and 25A.
次に、前記の如く構或されたスライシングマシンの切断
装置の作用について説明する。Next, the operation of the cutting device of the slicing machine constructed as described above will be explained.
前述したように前記エアー吹出しノズル２４、２５によ
れば、エアー吹出口２４Ａ，２５Ａからのエアーがイン
ゴット３８、ウエハ４０の各切断溝の壁面３８Ａ，４０
Ａと内周刃２２の台金２３との間の隙間に向けて吹き出
されているので、それらの隙間にあるクーラント液を除
去することができ、それらの隙間にクーラント液を介在
させない。従って、クーラント肢の粘性抵抗で内周刃２
２の台金２３が各切断溝の壁面３８Ａ、４０Ａに吸着す
るのを阻止することができる。As described above, according to the air blowing nozzles 24 and 25, the air from the air blowing ports 24A and 25A is applied to the wall surfaces 38A and 40 of the cutting grooves of the ingot 38 and the wafer 40.
Since it is blown out toward the gap between A and the base metal 23 of the inner peripheral blade 22, the coolant liquid present in those gaps can be removed, and no coolant liquid is interposed in those gaps. Therefore, due to the viscous resistance of the coolant limb, the inner peripheral blade 2
This can prevent the second base metal 23 from adhering to the wall surfaces 38A, 40A of each cutting groove.
また、インゴット３８の切断中に、前記内周刃２２の刃
２２Ａに刃こぼれや目詰まり等が発生して内周刃２２に
回転振れが発生すると、変位検出器４４でその振れ量を
検出して主制御装置４８にこの検出信号を送る。前記振
れ量が許容範囲内を超えている場合は、主制御装Ｗｌ４
８から空気圧制御装置４４に制御信号を送り、内周刃２
２の上側及び下側のエアー吹出しノズル２４、２５から
エアーを吹き出し、エアー流量の差によるエアー圧で内
周刃２２の振れ量を許容範囲内に収める。Further, when the blade 22A of the inner peripheral blade 22 is damaged or clogged and rotational runout occurs in the inner peripheral blade 22 while cutting the ingot 38, the displacement detector 44 detects the amount of the runout. and sends this detection signal to the main controller 48. If the amount of runout exceeds the allowable range, the main control unit Wl4
A control signal is sent from 8 to the pneumatic control device 44, and the inner peripheral blade 2
Air is blown out from the upper and lower air blowing nozzles 24 and 25 of 2, and the amount of deflection of the inner peripheral blade 22 is kept within an allowable range by air pressure due to the difference in air flow rate.
即ち、内屑刃２２が許容範囲内よりも下側に反りを発生
している場合は、内周刃２２の下側のエアー吹出しノズ
ル２５のエアー流量を上側のエアー吹出しノズル２４の
エアー流量よりも多くして吹き出し、エアー流量の差に
よるエアー圧で内周刃２２の反りを修正する。That is, if the inner scrap blade 22 is warped lower than the allowable range, the air flow rate of the lower air blowing nozzle 25 of the inner circumferential blade 22 is set to be lower than the air flow rate of the upper air blowing nozzle 24. The warpage of the inner peripheral blade 22 is corrected by the air pressure caused by the difference in air flow rate.
また、内周刃２２が許容範囲内よりも上側に反りを発生
している場合には、内周刃２２の上側のエアー吹出し／
ズル２４のエアー流量を下側のエアー吹出しノズル２５
のエアー流量よりも多くして吹き出し、エアー流量の差
によるエアー圧によって内周刃２２の反りを修正する。In addition, if the inner peripheral blade 22 is warped upwards than within the allowable range, the upper air blowout/
The air flow rate of the nozzle 24 is controlled by the lower air blowing nozzle 25.
The air is blown out at a flow rate higher than the air flow rate, and the warpage of the inner peripheral blade 22 is corrected by the air pressure caused by the difference in air flow rate.
このように上下のノズル２４、２５の流量差による制御
は、上下いずれかのノズル２４、２５で制御するより制
御し易く、また刃の位置も急激に変動しない利点がある
。In this way, control based on the difference in flow rate between the upper and lower nozzles 24, 25 is easier to control than controlling using either the upper or lower nozzles 24, 25, and has the advantage that the position of the blade does not change rapidly.
尚、本実施例では内周刃２２について説明したが、これ
に限られるものでなく外周刃についても適用することが
できる。In this embodiment, the inner peripheral blade 22 has been described, but the present invention is not limited to this, and the present invention can also be applied to an outer peripheral blade.
以上説明したように本発明に係るスライシングマシンの
切断方法及びその装置によれば、エア一吹出手段から切
断した柱状体Ｈｌ＝ｌの切断溝の壁面と切断刃の台金と
の間の隙間に向けてエアーを吹き出したので、クーラン
ト液の粘性抵抗で切断刃の台金が切断面に吸着するのを
阻止することができる。従って、切断刃は柱状体材料の
切断加工位置を安定することができる。As explained above, according to the cutting method and device for a slicing machine according to the present invention, the air is applied to the gap between the wall surface of the cutting groove of the cut columnar body Hl=l and the base metal of the cutting blade. Since air is blown toward the cutting surface, the viscous resistance of the coolant can prevent the base metal of the cutting blade from adhering to the cutting surface. Therefore, the cutting blade can stabilize the cutting position of the columnar material.
第ｌ図は本発明に係る切断装置が適用されるスライシン
グマシンの斜視図、第２図は本発明に係る切断装置の切
断制御系統図、第３図はエアー吹出しノズルからのエア
ー吹出し状況を示す要部説明図、第４図は従来の切断装
置の実施例を示す断面図である。
２２・・・内周刃、 ２６・・・回転体、 ２４、２
５・・・エアー吹出しノズル、 ３８・・・インゴッ
ト、４４・・・変位検出器，Fig. 1 is a perspective view of a slicing machine to which the cutting device according to the present invention is applied, Fig. 2 is a cutting control system diagram of the cutting device according to the present invention, and Fig. 3 shows the air blowing situation from the air blowing nozzle. FIG. 4 is a sectional view showing an embodiment of a conventional cutting device. 22...Inner peripheral blade, 26...Rotating body, 24, 2
5... Air blowing nozzle, 38... Ingot, 44... Displacement detector,
Claims (2)
料を薄片状に切断するスライシングマシンの切断方法に
於いて、 切断した柱状体材料の切断溝の壁面と切断刃の台金との
間の隙間に向けてエアーを吹き出すことを特徴とするス
ライシングマシンの切断方法。(1) In the cutting method of a slicing machine that attaches a cutting blade to a rotating spindle and cuts columnar material into thin pieces, A cutting method using a slicing machine that blows air toward the gap.
料を薄片状に切断するスライシングマシンの切断装置に
於いて、 切断した柱状体材料の切断溝の壁面と切断刃の台金との
間の隙間に向けてエアーを吹き出すエア吹出手段を設け
たことを特徴とするスライシングマシンの切断装置。(2) In a cutting device of a slicing machine that attaches a cutting blade to a rotating spindle and cuts columnar material into thin pieces, A cutting device for a slicing machine characterized by being provided with an air blowing means for blowing air toward a gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1194557A JP2503275B2 (en) | 1989-07-27 | 1989-07-27 | Slicing machine cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1194557A JP2503275B2 (en) | 1989-07-27 | 1989-07-27 | Slicing machine cutting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0358805A true JPH0358805A (en) | 1991-03-14 |
| JP2503275B2 JP2503275B2 (en) | 1996-06-05 |
Family
ID=16326514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1194557A Expired - Fee Related JP2503275B2 (en) | 1989-07-27 | 1989-07-27 | Slicing machine cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503275B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590899A2 (en) * | 1992-09-29 | 1994-04-06 | Shin-Etsu Handotai Company Limited | Method for production of SOI substrate |
| JPH06166021A (en) * | 1992-11-27 | 1994-06-14 | Shin Etsu Handotai Co Ltd | Internal saw slicing machine |
| EP0734823A1 (en) * | 1995-03-25 | 1996-10-02 | Shin-Etsu Handotai Company Limited | Method and apparatus for slicing workpiece |
| CN115139420A (en) * | 2022-08-31 | 2022-10-04 | 天通控股股份有限公司 | Cutting method of ultrathin sapphire wafer for LED substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01110105A (en) * | 1987-10-23 | 1989-04-26 | Sumitomo Metal Ind Ltd | Method for cutting hard and fragile material |
-
1989
- 1989-07-27 JP JP1194557A patent/JP2503275B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01110105A (en) * | 1987-10-23 | 1989-04-26 | Sumitomo Metal Ind Ltd | Method for cutting hard and fragile material |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590899A2 (en) * | 1992-09-29 | 1994-04-06 | Shin-Etsu Handotai Company Limited | Method for production of SOI substrate |
| EP0590899A3 (en) * | 1992-09-29 | 1994-07-27 | Shinetsu Handotai Kk | Method for production of soi substrate |
| JPH06166021A (en) * | 1992-11-27 | 1994-06-14 | Shin Etsu Handotai Co Ltd | Internal saw slicing machine |
| EP0633086A1 (en) * | 1992-11-27 | 1995-01-11 | Shin-Etsu Handotai Company Limited | Inner diameter saw slicing machine |
| US5413521A (en) * | 1992-11-27 | 1995-05-09 | Shin-Etsu Handotai Company, Ltd. | Inner diameter saw slicing machine |
| EP0734823A1 (en) * | 1995-03-25 | 1996-10-02 | Shin-Etsu Handotai Company Limited | Method and apparatus for slicing workpiece |
| US5667423A (en) * | 1995-03-25 | 1997-09-16 | Shin-Etsu Handotai Co., Ltd. | Method and apparatus for slicing workpiece |
| CN115139420A (en) * | 2022-08-31 | 2022-10-04 | 天通控股股份有限公司 | Cutting method of ultrathin sapphire wafer for LED substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2503275B2 (en) | 1996-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4844047A (en) | Process for sawing crystal rods or blocks into thin wafers | |
| TWI611871B (en) | Abrasive abnormality detecting method of substrate and polishing device | |
| US4668334A (en) | Method and apparatus for applying a layer of photosensitive material to a semiconductor wafer | |
| US5632666A (en) | Method and apparatus for automated quality control in wafer slicing | |
| JP2678245B2 (en) | Device for floating cutting thin film materials by laser irradiation | |
| JPH04211909A (en) | Cutting method of slicing machine | |
| JPH0358805A (en) | Cutting method for slicing machine and its device | |
| EP1582294B1 (en) | Wafer polishing method. | |
| JP4740488B2 (en) | Dicing machine | |
| US5667423A (en) | Method and apparatus for slicing workpiece | |
| KR930024111A (en) | Slicing Method and Apparatus for Semiconductor Wafers | |
| JPH02134212A (en) | Cutting method | |
| JP7253953B2 (en) | Substrate processing equipment | |
| JPH09326378A (en) | Method and equipment for cleaning substrate | |
| JP2599996B2 (en) | Cutting method of slicing machine | |
| JPH07108526A (en) | Slicing machine | |
| JP2965087B2 (en) | Cutting method of slicing machine | |
| JPH05309644A (en) | Cutting device of semiconductor bar | |
| JPH1164834A (en) | Liquid crystal display substrate producing device | |
| JP2713770B2 (en) | Method and apparatus for cutting column material | |
| JPH09109008A (en) | Wafer chamfering machine | |
| JP2612130B2 (en) | Inner circumference dressing method for slicing machine | |
| JPH0778795A (en) | Dicing device | |
| JPH10100138A (en) | Method of slicing semiconductor wafer | |
| JPH06334039A (en) | Reaction product removing system for radical reaction precise cutter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |