JPH0357939U - - Google Patents

Info

Publication number
JPH0357939U
JPH0357939U JP11768989U JP11768989U JPH0357939U JP H0357939 U JPH0357939 U JP H0357939U JP 11768989 U JP11768989 U JP 11768989U JP 11768989 U JP11768989 U JP 11768989U JP H0357939 U JPH0357939 U JP H0357939U
Authority
JP
Japan
Prior art keywords
adhesive
layer
paper
double
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11768989U
Other languages
Japanese (ja)
Other versions
JP2507897Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11768989U priority Critical patent/JP2507897Y2/en
Publication of JPH0357939U publication Critical patent/JPH0357939U/ja
Application granted granted Critical
Publication of JP2507897Y2 publication Critical patent/JP2507897Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係る両面粘着シー
トを示す一部省略斜視図、第2図は第1図におけ
る―線に沿う拡大断面図、第3図は本考案の
他の実施例に係る両面粘着シートを示す斜視図、
第4図は第3図の―線に沿う拡大断面図、第
5図A〜Cは本考案の両面粘着シートを用いて封
筒の封印を行なう場合の封印手順を示す封筒の斜
視図、第6図Aは第5図Cにおける―線に沿
う拡大断面図、第6図Bは開封状態を示す第6図
Aに相当する拡大断面図である。 2a,2b……フイルム層、3……接合層、4
a,4b……粘着層、5……両面粘着シート本体
、6a,6b……剥離紙、10……封筒(被粘着
紙)。
Fig. 1 is a partially omitted perspective view showing a double-sided adhesive sheet according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view taken along the line - in Fig. 1, and Fig. 3 is another embodiment of the present invention. A perspective view showing a double-sided adhesive sheet according to
FIG. 4 is an enlarged sectional view taken along the line - in FIG. 3, FIGS. FIG. 6A is an enlarged sectional view taken along the line - in FIG. 5C, and FIG. 6B is an enlarged sectional view corresponding to FIG. 6A showing an unsealed state. 2a, 2b...film layer, 3...bonding layer, 4
a, 4b...Adhesive layer, 5...Double-sided adhesive sheet body, 6a, 6b...Release paper, 10...Envelope (adhesive paper).

Claims (1)

【実用新案登録請求の範囲】 (1) プラスチツク、アルミ箔、或いは紙等のシ
ート材によりそれぞれ形成されかつそれぞれの内
面に塗布された接合層を介して剥離自在に接合さ
れた第1と第2のフイルム層と、前記第1と第2
のフイルム層の外面それぞれに塗布され前記接合
層よりも粘着強度が強い粘着層とにより両面粘着
シート本体を形成し、前記それぞれの粘着層を覆
う剥離紙を前記粘着層から剥して二枚の被粘着紙
の間に前記粘着層の部分で粘着した状態から前記
二枚の被粘着紙相互を剥すと前記それぞれのフイ
ルム層が前記粘着層の部分で前記被粘着紙に付着
したまま前記接合層の部分から前記フイルム層が
相互に剥離するようにしたことを特徴とする両面
粘着シート。 (2) 前記接合層の剥離力が80〜30g/5cm
となる熱可塑性樹脂により形成してなる両面粘着
シート。
[Scope of Claim for Utility Model Registration] (1) First and second parts each formed of a sheet material such as plastic, aluminum foil, or paper and releasably joined via a joining layer coated on the inner surface of each part. a film layer, and the first and second film layers.
A double-sided adhesive sheet body is formed by an adhesive layer having adhesive strength stronger than the bonding layer applied to each of the outer surfaces of the film layer, and a release paper covering each of the adhesive layers is peeled off from the adhesive layer to separate the two sheets. When the two sheets of adhesive paper are stuck together at the adhesive layer between the adhesive papers, the respective film layers remain attached to the adhesive paper at the adhesive layer and the bonding layer is removed. A double-sided pressure-sensitive adhesive sheet, characterized in that the film layers are mutually peeled from each other. (2) The peeling force of the bonding layer is 80 to 30 g/5 cm
A double-sided adhesive sheet made of thermoplastic resin.
JP11768989U 1989-10-06 1989-10-06 IC supply device Expired - Fee Related JP2507897Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11768989U JP2507897Y2 (en) 1989-10-06 1989-10-06 IC supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11768989U JP2507897Y2 (en) 1989-10-06 1989-10-06 IC supply device

Publications (2)

Publication Number Publication Date
JPH0357939U true JPH0357939U (en) 1991-06-05
JP2507897Y2 JP2507897Y2 (en) 1996-08-21

Family

ID=31665899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11768989U Expired - Fee Related JP2507897Y2 (en) 1989-10-06 1989-10-06 IC supply device

Country Status (1)

Country Link
JP (1) JP2507897Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008150190A (en) * 2006-12-19 2008-07-03 Yukito Miura Code reel
CN110208648A (en) * 2019-05-28 2019-09-06 国家电网有限公司 A kind of seal for electric field preventing ground fault
CN110466972A (en) * 2018-05-11 2019-11-19 格力电器(重庆)有限公司 Doffer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008150190A (en) * 2006-12-19 2008-07-03 Yukito Miura Code reel
CN110466972A (en) * 2018-05-11 2019-11-19 格力电器(重庆)有限公司 Doffer
CN110208648A (en) * 2019-05-28 2019-09-06 国家电网有限公司 A kind of seal for electric field preventing ground fault
CN110208648B (en) * 2019-05-28 2024-04-09 国家电网有限公司 Insulation device for preventing ground fault on electric power site

Also Published As

Publication number Publication date
JP2507897Y2 (en) 1996-08-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees