JPH0357938U - - Google Patents
Info
- Publication number
- JPH0357938U JPH0357938U JP1989118686U JP11868689U JPH0357938U JP H0357938 U JPH0357938 U JP H0357938U JP 1989118686 U JP1989118686 U JP 1989118686U JP 11868689 U JP11868689 U JP 11868689U JP H0357938 U JPH0357938 U JP H0357938U
- Authority
- JP
- Japan
- Prior art keywords
- support
- pressure
- sensitive adhesive
- coated
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000013039 cover film Substances 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案のラベル、或いはマークの材料
の断面図で、第２図、ラベル、マークの表面を被
覆するカバーフイルムの断面図であり、第３図は
カバーフイルムで被覆した状態のの断面図を示す
。
１……支持体、２……感圧接着剤、３……剥離
材、４……印刷層、５……カバーフイルム、６…
…熱溶融型接着剤。
Fig. 1 is a cross-sectional view of the material of the label or mark of the present invention, Fig. 2 is a cross-sectional view of the cover film that covers the surface of the label or mark, and Fig. 3 is a cross-sectional view of the material covered with the cover film. A cross-sectional view is shown. DESCRIPTION OF SYMBOLS 1...Support, 2...Pressure sensitive adhesive, 3...Release material, 4...Printing layer, 5...Cover film, 6...
...Hot melt adhesive.
Claims (1)
て被覆してなる粘着シートの該支持体又は該支持
体上に形成した印刷層の表面に熱溶融型接着剤を
塗布した弗化ビニル系フイルムの熱溶融型接着剤
面を加熱により貼付した構造の耐汚染性粘着シー
ト片。 A fluorinated vinyl coated with a heat-melting adhesive on the surface of the support or the printed layer formed on the support of a pressure-sensitive adhesive sheet in which the surface of the pressure-sensitive adhesive layer laminated on the support is coated with a release material. A stain-resistant adhesive sheet piece with a structure in which the hot-melt adhesive side of a film is attached by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989118686U JPH0357938U (en) | 1989-10-09 | 1989-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989118686U JPH0357938U (en) | 1989-10-09 | 1989-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357938U true JPH0357938U (en) | 1991-06-05 |
Family
ID=31666841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989118686U Pending JPH0357938U (en) | 1989-10-09 | 1989-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357938U (en) |
-
1989
- 1989-10-09 JP JP1989118686U patent/JPH0357938U/ja active Pending