JPH0357937U - - Google Patents
Info
- Publication number
- JPH0357937U JPH0357937U JP1989119444U JP11944489U JPH0357937U JP H0357937 U JPH0357937 U JP H0357937U JP 1989119444 U JP1989119444 U JP 1989119444U JP 11944489 U JP11944489 U JP 11944489U JP H0357937 U JPH0357937 U JP H0357937U
- Authority
- JP
- Japan
- Prior art keywords
- cushioning material
- rust preventive
- adhesive containing
- thermoplastic resin
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 7
- 230000003449 preventive effect Effects 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の防錆剤含有粘着剤付き緩衝性
材料の一実施例の断面図であり、第2図は他の実
施例の断面図である。 1:防錆剤含有粘着剤付き緩衝性材料、2:緩
衝性材料、3:熱可塑性樹脂フイルム、4:凸状
突起、5:防錆剤含有粘着剤、6:第二の熱可塑
性樹脂フイルム。
材料の一実施例の断面図であり、第2図は他の実
施例の断面図である。 1:防錆剤含有粘着剤付き緩衝性材料、2:緩
衝性材料、3:熱可塑性樹脂フイルム、4:凸状
突起、5:防錆剤含有粘着剤、6:第二の熱可塑
性樹脂フイルム。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 熱可塑性樹脂フイルムの一面に、多数の独
立した空気室を形成する凸状突起が設けられた緩
衝性材料であつて、該緩衝性材料の少なくとも一
面に、錆止油を含有した粘着剤が塗布された防錆
剤含有粘着剤付き緩衝性材料。 (2) 熱可塑性樹脂フイルムの一面に、多数の独
立した空気室を形成する凸状突起が設けられ、該
凸状突起の頂面に於いて、更に、第二の熱可塑性
樹脂フイルムが積層されている緩衝性材料であつ
て、該緩衝性材料の少なくとも一面に、錆止油を
含有した粘着剤が塗布された防錆剤含有粘着剤付
き緩衝性材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989119444U JPH0357937U (ja) | 1989-10-12 | 1989-10-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989119444U JPH0357937U (ja) | 1989-10-12 | 1989-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0357937U true JPH0357937U (ja) | 1991-06-05 |
Family
ID=31667571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989119444U Pending JPH0357937U (ja) | 1989-10-12 | 1989-10-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0357937U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |
-
1989
- 1989-10-12 JP JP1989119444U patent/JPH0357937U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |
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