JPH0357937U - - Google Patents

Info

Publication number
JPH0357937U
JPH0357937U JP1989119444U JP11944489U JPH0357937U JP H0357937 U JPH0357937 U JP H0357937U JP 1989119444 U JP1989119444 U JP 1989119444U JP 11944489 U JP11944489 U JP 11944489U JP H0357937 U JPH0357937 U JP H0357937U
Authority
JP
Japan
Prior art keywords
cushioning material
rust preventive
adhesive containing
thermoplastic resin
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989119444U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989119444U priority Critical patent/JPH0357937U/ja
Publication of JPH0357937U publication Critical patent/JPH0357937U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の防錆剤含有粘着剤付き緩衝性
材料の一実施例の断面図であり、第２図は他の実
施例の断面図である。 １：防錆剤含有粘着剤付き緩衝性材料、２：緩
衝性材料、３：熱可塑性樹脂フイルム、４：凸状
突起、５：防錆剤含有粘着剤、６：第二の熱可塑
性樹脂フイルム。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 熱可塑性樹脂フイルムの一面に、多数の独
    立した空気室を形成する凸状突起が設けられた緩
    衝性材料であつて、該緩衝性材料の少なくとも一
    面に、錆止油を含有した粘着剤が塗布された防錆
    剤含有粘着剤付き緩衝性材料。 (2) 熱可塑性樹脂フイルムの一面に、多数の独
    立した空気室を形成する凸状突起が設けられ、該
    凸状突起の頂面に於いて、更に、第二の熱可塑性
    樹脂フイルムが積層されている緩衝性材料であつ
    て、該緩衝性材料の少なくとも一面に、錆止油を
    含有した粘着剤が塗布された防錆剤含有粘着剤付
    き緩衝性材料。
JP1989119444U 1989-10-12 1989-10-12 Pending JPH0357937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989119444U JPH0357937U (ja) 1989-10-12 1989-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989119444U JPH0357937U (ja) 1989-10-12 1989-10-12

Publications (1)

Publication Number Publication Date
JPH0357937U true JPH0357937U (ja) 1991-06-05

Family

ID=31667571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989119444U Pending JPH0357937U (ja) 1989-10-12 1989-10-12

Country Status (1)

Country Link
JP (1) JPH0357937U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184654A (ja) * 2015-03-26 2016-10-20 シャープ株式会社 半導体素子フリップチップ接合構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184654A (ja) * 2015-03-26 2016-10-20 シャープ株式会社 半導体素子フリップチップ接合構造体

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