JPH0357937U - - Google Patents
Info
- Publication number
- JPH0357937U JPH0357937U JP1989119444U JP11944489U JPH0357937U JP H0357937 U JPH0357937 U JP H0357937U JP 1989119444 U JP1989119444 U JP 1989119444U JP 11944489 U JP11944489 U JP 11944489U JP H0357937 U JPH0357937 U JP H0357937U
- Authority
- JP
- Japan
- Prior art keywords
- cushioning material
- rust preventive
- adhesive containing
- thermoplastic resin
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 7
- 230000003449 preventive effect Effects 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119444U JPH0357937U (US07652168-20100126-C00068.png) | 1989-10-12 | 1989-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119444U JPH0357937U (US07652168-20100126-C00068.png) | 1989-10-12 | 1989-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357937U true JPH0357937U (US07652168-20100126-C00068.png) | 1991-06-05 |
Family
ID=31667571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989119444U Pending JPH0357937U (US07652168-20100126-C00068.png) | 1989-10-12 | 1989-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357937U (US07652168-20100126-C00068.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |
-
1989
- 1989-10-12 JP JP1989119444U patent/JPH0357937U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |
