JPH0356672A - Thin film forming device - Google Patents

Abstract

PURPOSE:To accurately control a film thickness and to extend the life of a film thickness sensor by imposing the sensor on a movable type support and placing the sensor between a substrate and a target at the time of film formation. CONSTITUTION:A movable shutter 8 in a vacuum chamber 7 is opened and the film is formed on the substrate 10 by a film forming material flying from the target 9. The film thickness sensor 12 is previously imposed on the movable support 13 at this time and the film thickness is measured by positioning the film thickness sensor 12 between the substrate 10 and the target 9 only at the time of measurement of the film thickness. The film thickness accuracy is improved in this way and since the sensor 12 is used only when needed, the life of the sensor is prolonged.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thin film forming apparatus that accurately controls the film thickness during film formation using a film thickness sensor.

2. Description of the Related Art A conventional thin film forming apparatus will be described below with reference to the drawings. FIG. 4 is a block diagram of a conventional sputtering device. In the figure, 1 is a vacuum chamber, and 2 is a movable shutter that covers the film forming material flying from the target 3.

4 is the substrate held by the substrate head 5, 6 is the target 3
This is a film thickness sensor that measures the amount of film-forming material that has flown away.

The operation of the sputtering apparatus configured as described above will be described below.

The film forming material flying from the target 3 is sputtered onto the substrate 4 by opening the shutter 2 (moving to a position not facing the target 3).

The thickness of the film formed on the substrate 4 is detected by measuring the thickness of the film forming material adhering to the film thickness sensor 6.

Problems to be Solved by the Invention However, in the above configuration, the film thickness sensor 6 is not fixed at a position between the substrate 4 and the target 2, but at a laterally shifted position. Therefore, it is not possible to measure the actual thickness of the film that has flown onto the substrate 4, and the film thickness must be controlled by a method that calibrates accordingly. As a result, variations occur due to the decrease in the number of targets 3, and it is very difficult to maintain reproducibility when the mounting angle and position of the film thickness sensor 6 are replaced. Furthermore, during film formation, the film forming material flying from the target 3 always adheres to the target 3, resulting in a short service life.

Therefore, in order to solve this problem, it is an object of the present invention to provide a thin film forming apparatus in which the film thickness of the substrate can be controlled with high precision and there is no problem in the life of the sensor.

Means for Solving the Problems In order to achieve this object, the first invention of the present invention is such that a film thickness sensor is attached to a movable support and placed between a substrate and a film forming material during film formation. be.

A second aspect of the present invention is a vacuum thin film forming apparatus in which a film thickness sensor large enough to cover the entire substrate is attached to a movable shutter and can be placed between the substrate and the film forming material during film forming.

Furthermore, a third aspect of the present invention is a vacuum thin film forming apparatus in which a film thickness sensor and a substrate head are held by a support having a rotation mechanism, and can be placed between a substrate and a film forming material during film formation.

According to the first aspect of the present invention, the film thickness sensor can be attached to a movable support and placed between the substrate and the film forming material during film formation, so that the film thickness accuracy is improved and it can be used when necessary. Since it can only be used, its lifespan is extended.

Further, according to the second aspect of the present invention, the film thickness sensor can be attached to a part of the movable shutter and placed between the substrate and the film forming material during film formation and within the range of the substrate area. Accuracy is improved, lifespan is extended because it can be used only when necessary, and the substrate can be shielded during film thickness measurement.

Furthermore, according to the third aspect of the present invention, the film thickness sensor and the substrate head are held by a support having a rotating mechanism, so that they can be placed between the substrate and the film forming material during film formation and within the area of the substrate. , the film thickness accuracy has been improved, and the product can be used only when necessary, extending its lifespan. By locating the film thickness sensor and the substrate at the same distance from the film forming material, measurement accuracy has been further improved.
The thickness of the film becomes easier.

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment 1 FIG. 1 shows a sputtering apparatus in a first embodiment of the present invention.

In the figure, 7 is a vacuum chamber, and 8 is a movable shutter that covers film forming materials flying from a target 9. Reference numeral 10 denotes a substrate held by a substrate head 11, and reference numeral 12 denotes a film thickness sensor for measuring the film forming material flying from the target 9, which is placed on a movable support 13.

The operation of the thin film forming apparatus configured as described above will be explained below.

By opening the shutter 8, the film forming material flying from the target 9 is measured to adhere to the film thickness sensor 12 disposed between the substrate 10 and the target 9.The rate at which the film thickness is measured is measured. The film thickness sensor 12 is set as desired, and the film thickness sensor 12 is placed directly under the substrate 10 only when measuring.Then, when a film is to be formed on the plate 10, the support 13 is opened.

As described above, according to this embodiment, the film thickness sensor 12 can be attached to the movable support 13 and placed between the substrate 10 and the target 9 and within the area of the substrate during film formation. It is more durable and can be used only when necessary, extending its lifespan and making it easier to control the thickness of the print.

Embodiment 2 FIG. 2 is a 414 diagram of a thin film forming apparatus in a second embodiment of the present invention.

In this figure, the same parts as those in FIG. 1 are given the same numbers, and the explanation will be omitted.

The difference between this figure and FIG. 1 is that the film thickness sensor l4
is attached to a part of the movable shutter 15.

Therefore, according to this embodiment, in addition to the effects of Embodiment 1, it is possible to block the substrate lO with the movable shutter 14 while the film thickness sensor 15 is measuring the film thickness of the film forming material. , no film material is formed on the substrate.

Embodiment 3 FIG. 3 is a block diagram of a thin film forming apparatus in a third embodiment of the present invention.

In this figure, the same parts as those in FIG.

In this figure, the difference from FIG.
This is the point that was held.

In this embodiment, when it is desired to form a film material on the substrate 10, the substrate head 11 is placed above the target 9 by the rotating drive unit 1.
6 to place it. Further, when measuring the film thickness with the film thickness sensor 18, the film thickness sensor 18 is placed above the target 9.

Therefore, according to this embodiment, in addition to the effects of embodiment 1,
Since the film thickness sensor can be placed at the same location as the substrate, measurement accuracy is further improved.

In the above embodiments, a sputtering apparatus was used as an example, but this can be applied to other vacuum thin film forming apparatuses for measuring film thickness.

Effects of the Invention According to the first aspect of the present invention, the film thickness sensor →1- can be attached to a movable support and placed between the substrate and the film forming material during film formation and within the range of the substrate area. , the film thickness is improved and can be used only when necessary, extending the lifespan and making it easier to manage the film thickness.

In addition, the second aspect of the present invention is that the thickness sensor can be attached to a part of the movable shutter and placed between the substrate and the film forming material during film formation, and within the area of the substrate. Accuracy is improved, the product can be used only when necessary, extending its life, making it easier to manage film thickness, and making it possible to shield the substrate when measuring film thickness, thereby preventing film formation on the board.

Furthermore, according to the third aspect of the present invention, the film thickness sensor and the substrate head are held by a support having a rotating mechanism, so that they can be placed between the substrate and the film forming material during film formation and within the area of the substrate. , the film thickness accuracy is improved, the product can be used only when necessary, extending the lifespan, and the film thickness sensor can be placed in the same position as the substrate, which further improves measurement accuracy and facilitates film thickness management.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a thin film forming apparatus according to a first embodiment of the present invention, FIG. 2 is a block diagram of a thin film forming apparatus according to a second embodiment of the present invention, and FIG. 3 is a block diagram of a thin film forming apparatus according to a second embodiment of the present invention. FIG. 4 is a block diagram of a thin film forming apparatus in an embodiment, and FIG. 4 is a block diagram of a conventional thin film forming apparatus. 9...Target, 10...Substrate, l
2...Film thickness sensor, 13...Support.

Claims (4)

[Claims] (1) A thin film forming apparatus in which a film thickness sensor provided on a movable support is placed between a substrate and a target during film formation. (2) The thin film forming apparatus according to claim 1, wherein the film thickness sensor is attached to a part of a movable shutter having a size that covers the entire substrate. (3) The thin film forming apparatus according to claim 1, wherein the film thickness sensor and the substrate head are held by a support having a rotational drive section. (4) The thin film forming apparatus according to claim 3, wherein the film thickness sensor and the substrate are arranged at the same distance from the film forming material.