JPH0356161U - - Google Patents
Info
- Publication number
- JPH0356161U JPH0356161U JP11609189U JP11609189U JPH0356161U JP H0356161 U JPH0356161 U JP H0356161U JP 11609189 U JP11609189 U JP 11609189U JP 11609189 U JP11609189 U JP 11609189U JP H0356161 U JPH0356161 U JP H0356161U
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- pair
- lead frames
- overhanging
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11609189U JPH0356161U (US08066781-20111129-C00013.png) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11609189U JPH0356161U (US08066781-20111129-C00013.png) | 1989-10-02 | 1989-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0356161U true JPH0356161U (US08066781-20111129-C00013.png) | 1991-05-30 |
Family
ID=31664398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11609189U Pending JPH0356161U (US08066781-20111129-C00013.png) | 1989-10-02 | 1989-10-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356161U (US08066781-20111129-C00013.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055676A (ja) * | 1983-09-07 | 1985-03-30 | Nec Corp | 半導体装置 |
-
1989
- 1989-10-02 JP JP11609189U patent/JPH0356161U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055676A (ja) * | 1983-09-07 | 1985-03-30 | Nec Corp | 半導体装置 |