JPH0356135U - - Google Patents

Info

Publication number
JPH0356135U
JPH0356135U JP11726589U JP11726589U JPH0356135U JP H0356135 U JPH0356135 U JP H0356135U JP 11726589 U JP11726589 U JP 11726589U JP 11726589 U JP11726589 U JP 11726589U JP H0356135 U JPH0356135 U JP H0356135U
Authority
JP
Japan
Prior art keywords
soft solder
float
container
detecting
absence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11726589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11726589U priority Critical patent/JPH0356135U/ja
Publication of JPH0356135U publication Critical patent/JPH0356135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP11726589U 1989-10-04 1989-10-04 Pending JPH0356135U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11726589U JPH0356135U (enrdf_load_stackoverflow) 1989-10-04 1989-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11726589U JPH0356135U (enrdf_load_stackoverflow) 1989-10-04 1989-10-04

Publications (1)

Publication Number Publication Date
JPH0356135U true JPH0356135U (enrdf_load_stackoverflow) 1991-05-30

Family

ID=31665486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11726589U Pending JPH0356135U (enrdf_load_stackoverflow) 1989-10-04 1989-10-04

Country Status (1)

Country Link
JP (1) JPH0356135U (enrdf_load_stackoverflow)

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