JPH0355311B2 - - Google Patents
Info
- Publication number
- JPH0355311B2 JPH0355311B2 JP57014572A JP1457282A JPH0355311B2 JP H0355311 B2 JPH0355311 B2 JP H0355311B2 JP 57014572 A JP57014572 A JP 57014572A JP 1457282 A JP1457282 A JP 1457282A JP H0355311 B2 JPH0355311 B2 JP H0355311B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl acetate
- ethylene
- acetate copolymer
- resin
- easy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 29
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 16
- 239000000565 sealant Substances 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 9
- 230000004927 fusion Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 8
- -1 polypropylene Polymers 0.000 description 6
- 238000007765 extrusion coating Methods 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920000092 linear low density polyethylene Polymers 0.000 description 3
- 239000004707 linear low-density polyethylene Substances 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000009820 dry lamination Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002102 polyvinyl toluene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
本発明は、ボイル処理用容器の易開封性蓋材の
製造方法に関する。
従来、包装内容物を保存又は運搬中には完全に
内容物を保護し、内容物を取り出したい場合に
は、該包装の密封部を容易に開封し得る様なヒー
トシールに関しては、種々の方法が提案されてい
る。例えば、シーラント層として、エチレン−酢
酸ビニル共重合体やポリスチレンをベースとし、
これにスチレン−ブタジエンラバーなどをブレン
ドしたものを使用する方法、また別の方法として
は、ホツトメルトタイプのピーラブル包材がある
が、それらはエチレン−酢酸ビニル共重合体とワ
ツクスを主成分として、これにロジンやテルペン
系樹脂などの粘結剤をブレンドするものである。
しかし前記２つのタイプは、耐熱性がないため、
ボイル使用にむかないものである。また近年、シ
ーラント層として、エチレン−酢酸ビニル共重合
体樹脂及びこれをベースにスチレン系重合体、テ
ルペン系重合体等をブレンドした樹脂がボイル処
理に耐えられることで使用され始めている。しか
し、これら樹脂を使用してシーラント層を構成す
るには、押出しコーテイングによるもので、ドラ
イラミネートができず、小ロツトに対しては、コ
スト的に非常に不利となり、実用上問題が有る。
さらに押出しコーテイングによるものだと、接着
強度がドライラミネートに比べ極めて弱い為、ボ
イル処理した場合耐えられないことが多い。
本発明は、前記のようなボイル処理可能な包材
で、かつコスト的に有利となる易開封性蓋材につ
き種々研究の結果、エチレン−酢酸ビニル共重合
体系ピーラブル樹脂を、低密度ポリエチレン、直
鎖状低密度ポリエチレン、エチレン−酢酸ビニル
共重合体等の製膜しやすい樹脂と共に多層製膜す
ることにより、エチレン−酢酸ビニル共重合体系
ピーラブル樹脂の製膜が容易となることを見い出
し、かかる知見にもとづいて本発明を完成したも
のである。
即ち、本発明の要旨は、エチレン−酢酸ビニル
共重合体系ピーラブル樹脂と、製膜しやすく、且
つ該エチレン−酢酸ビニル共重合体系ピーラブル
樹脂との熱融着性の良好な樹脂とを、Ｔダイ方式
又はインフレーシヨン方式により共押出し製膜し
て、エチレン−酢酸ビニル共重合体系ピーラブル
樹脂からなる厚み10〜100μのシーラント層とそ
れを支持する、厚みがシーラント層の厚みと同等
かそれ以上の支持層とからなる積層フイルムを得
る工程と、該積層フイルムを基材に、支持層側を
基材側に向けてドライラミネートする工程とから
なることを特徴とするボイル処理用容器の易開封
性蓋材の製造方法である。
以下、本発明につき、図面を参照しながら、詳
細に説明する。
先ず、エチレン−酢酸ビニル共重合体系ピーラ
ブル樹脂を、製膜しやすく、且つ、該エチレン−
酢酸ビニル共重合体系ピーラブル樹脂との熱融着
性の良好な樹脂と共に押出して、Ｔダイ方式又は
インフレーシヨン方式により製膜して第１図示の
ようなエチレン−酢酸ビニル共重合体系ピーラブ
ル樹脂からなるシーラント層２とそれを支持する
支持層１とからなる積層フイルム３を得る。
次いでこの積層フイルム３を第２図示の如く、
基材４に、支持層１側を基材４に向けて貼合する
ことにより本発明の易開封性蓋材５が得られるも
のである。
上記の本発明において、エチレン−酢酸ビニル
共重合体系ピーラブル樹脂としては、エチレン−
酢酸ビニル共重合体樹脂及びこれをベースにポリ
スチレン、ポリ−α−メチルスチレン、ポリビニ
ルトルエンなどのスチレン系重合体やジペンテン
重合体、α−ピネン重合体、β−ピネン重合体な
どのテルペン系重合体等がブレンドされた樹脂を
適用し得る。このエチレン−酢酸ビニル共重合体
系ピーラブル樹脂からなるシーラント層の厚み
は、10〜100μが適当であり、10μ以下のときは、
熱融着後の剥離強度が実用強度以下であるので望
ましくなく、100μ以上のときはコストアツプと
なるばかりか製膜性が極度に悪化し望ましくな
い。
次に本発明において、製膜しやすく、且つ前記
のエチレン−酢酸ビニル共重合体系ピーラブル樹
脂との熱融着性の良好な樹脂としては、ポリプロ
ピレン、ポリエチレン、エチレン−αオレフイン
共重合体、エチレン−酢酸ビニル共重合体、エチ
レン−酢酸ビニル共重合体けん化物、アイオノマ
ー樹脂、ポリアミド、ポリ塩化ビニリデンなどの
樹脂を使用することができる。
尚、支持層を一層ないし二層以上の樹脂層で構
成しても良い。
而して、本発明において、エチレン−酢酸ビニ
ル共重合体系ピーラブル樹脂と共に押出す製膜し
やすく、且つエチレン−酢酸ビニル共重合体系ピ
ーラブル樹脂との熱融着性の良好な樹脂として
は、特に、密度0.91〜0.93ｇ/cm2、メルトインデ
ツクス0.1〜10、融点100〜110℃の低密度ポリエ
チレン、密度0.91〜0.94ｇ/cm2、メルトインデツ
クス0.5〜10ｇ/cm2、融点110〜130℃の直鎖状低密
度ポリエチレン、密度0.92〜0.95ｇ/cm2、メルト
インデツクス0.1〜10、融点90〜105℃の酢酸ビニ
ル含量が６％以下のエチレン−酢酸ビニル共重合
体が望ましい。
この支持層の厚みはシーラント層の厚みと同等
か、それ以上が適当である。支持層の厚みがシー
ラント層の厚み以下であると、共押出し製膜が不
安定となり、ドライラミネートし得る積層フイル
ムが得られない。
次に本発明において、基材としては、ポリカー
ボネート、ポリ塩化ビニル、ポリエチレンテレフ
タレート、ポリブチレンテレフタレート、ポリプ
ロピレン、ポリアミド、４メチルペンテンポリマ
ーなどの熱可塑性樹脂、アルミニウム箔などの金
属箔もしくは、これらの複合材料を適用し得る。
本発明の易開封性積層材は蓋材として使用し得
るものはもちろんであるが、又、シート成形容器
の材料としても適用し得る。
以上詳記した通り、本発明によれば、エチレン
−酢酸ビニル共重合体系ピーラブル樹脂を従来法
のように押し出しコーテイングする必要がなくド
ライラミネート法により基材と貼合することが可
能となる。
つまり、従来法では、エチレン−酢酸ビニル共
重合体系ピーラブル樹脂をコーテイングする場
合、基材との溶融密着性が悪いため、一担、基材
にポリエチレン等の橋渡し的な樹脂を押し出しコ
ーテイングしさらにその上にエチレン−酢酸ビニ
ル共重合体系ピーラブル樹脂を押し出しコーテイ
ングするという２工程で製造を行つている。
又これらを一工程で押し出しコーテイングする
タンデム方式では高価な押し出しコーテイング装
置を必要とする。これら押し出しコーテイング法
では、複雑な工程を経て製造するか、又は高価な
装置を必要とする欠点を有している。これらの方
法ではコスト的に不利となる。特に小ロツト品に
ついては顕著である。一方本発明によれば小ロツ
ト品についてもコスト的に有利となる。
さらに、本発明の製造方法によれば、蓋材と容
器との層間だけでなく、蓋材自体の各層間の接着
強度をボイル処理に充分に耐えることができるよ
うな強度にすることができるのである。
次に実施例をあげて本発明につき具体的に説明
する。
〈実施例〉
インフレーシヨン法で、支持層である低密度ポ
リエチレン、直鎖状低密度ポリエチレン、エチレ
ン−酢酸ビニル共重合体とシーラント層であるエ
チレン−酢酸ビニル共重合体系ピーラブル樹脂を
多層成膜（積層フイルム〜）した。表−１参
照。
The present invention relates to a method for manufacturing an easy-to-open lid for a boiling container. Conventionally, various methods have been used for heat sealing, which completely protects the package contents during storage or transportation, and allows the sealed portion of the package to be easily opened when the contents are removed. is proposed. For example, as a sealant layer, ethylene-vinyl acetate copolymer or polystyrene is used as a base,
There is a method of using a blend of styrene-butadiene rubber, etc., and another method is hot-melt type peelable packaging materials, which are mainly composed of ethylene-vinyl acetate copolymer and wax. This is blended with a binder such as rosin or terpene resin.
However, the above two types are not heat resistant, so
It is not suitable for boiling. Furthermore, in recent years, ethylene-vinyl acetate copolymer resins and resins made by blending styrene polymers, terpene polymers, etc. based on ethylene-vinyl acetate copolymer resins have begun to be used as sealant layers because they can withstand boiling treatment. However, in order to construct a sealant layer using these resins, extrusion coating is used, and dry lamination is not possible, which is very disadvantageous in terms of cost for small lots, and there are practical problems.
Furthermore, extrusion coatings have extremely weak adhesive strength compared to dry laminates, so they often cannot withstand boiling treatment. As a result of various research into an easy-to-open lid material that is a boilable packaging material and cost-effective as described above, the present invention has developed an ethylene-vinyl acetate copolymer peelable resin using low-density polyethylene, direct It was discovered that film formation of peelable resin based on ethylene-vinyl acetate copolymer becomes easy by forming a multilayer film together with resins that are easy to form into films, such as linear low-density polyethylene and ethylene-vinyl acetate copolymer. The present invention has been completed based on this. That is, the gist of the present invention is to combine an ethylene-vinyl acetate copolymer-based peelable resin and a resin that is easy to form into a film and has good thermal fusion properties with the ethylene-vinyl acetate copolymer-based peelable resin. A sealant layer with a thickness of 10 to 100μ made of an ethylene-vinyl acetate copolymer peelable resin and a supporting layer with a thickness equal to or greater than the thickness of the sealant layer are formed by coextrusion using a coextrusion method or an inflation method. An easy-to-open container for boiling processing characterized by comprising a step of obtaining a laminated film comprising a support layer, and a step of dry laminating the laminated film with the support layer side facing the base material side. This is a method for manufacturing a lid material. Hereinafter, the present invention will be explained in detail with reference to the drawings. First, a peelable resin based on ethylene-vinyl acetate copolymer is easy to form into a film, and the ethylene-vinyl acetate copolymer
A peelable ethylene-vinyl acetate copolymer resin as shown in Figure 1 is made by extruding it with a resin that has good thermal fusion properties with the vinyl acetate copolymer peelable resin and forming a film by a T-die method or an inflation method. A laminated film 3 consisting of a sealant layer 2 and a support layer 1 supporting the sealant layer 2 is obtained. Next, this laminated film 3 is processed as shown in the second figure.
The easily openable lid material 5 of the present invention is obtained by laminating the support layer 1 side to the base material 4 with the support layer 1 side facing the base material 4. In the above invention, the ethylene-vinyl acetate copolymer peelable resin includes ethylene-vinyl acetate copolymer.
Vinyl acetate copolymer resins and styrenic polymers based on this, such as polystyrene, poly-α-methylstyrene, and polyvinyltoluene, and terpene-based polymers such as dipentene polymers, α-pinene polymers, and β-pinene polymers. A resin blended with the following can be applied. The appropriate thickness of the sealant layer made of this ethylene-vinyl acetate copolymer peelable resin is 10 to 100μ, and when it is less than 10μ,
The peel strength after heat fusion is undesirable because it is below the practical strength, and when it is 100μ or more, it not only increases the cost but also extremely deteriorates the film formability, which is undesirable. Next, in the present invention, examples of resins that are easy to form into a film and have good thermal fusion properties with the above-mentioned ethylene-vinyl acetate copolymer peelable resin include polypropylene, polyethylene, ethylene-α olefin copolymer, ethylene- Resins such as vinyl acetate copolymer, saponified ethylene-vinyl acetate copolymer, ionomer resin, polyamide, and polyvinylidene chloride can be used. Note that the support layer may be composed of one, two or more resin layers. Therefore, in the present invention, resins that are easy to extrude together with the ethylene-vinyl acetate copolymer peelable resin and have good heat fusion properties with the ethylene-vinyl acetate copolymer peelable resin include: Low density polyethylene with density 0.91-0.93g/ cm2 , melt index 0.1-10, melting point 100-110°C, density 0.91-0.94g/ cm2 , melt index 0.5-10g/ cm2 , melting point 110-130°C A linear low density polyethylene having a density of 0.92 to 0.95 g/cm 2 , a melt index of 0.1 to 10, a melting point of 90 to 105°C, and an ethylene-vinyl acetate copolymer having a vinyl acetate content of 6% or less are desirable. The thickness of this support layer is suitably equal to or greater than the thickness of the sealant layer. If the thickness of the support layer is less than the thickness of the sealant layer, coextrusion film formation becomes unstable and a laminated film that can be dry laminated cannot be obtained. Next, in the present invention, the base material is a thermoplastic resin such as polycarbonate, polyvinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polypropylene, polyamide, 4-methylpentene polymer, metal foil such as aluminum foil, or a composite material thereof. can be applied. The easily openable laminated material of the present invention can be used not only as a lid material, but also as a material for sheet-formed containers. As described in detail above, according to the present invention, it is possible to bond the ethylene-vinyl acetate copolymer peelable resin to the base material by dry lamination without the need for extrusion coating as in the conventional method. In other words, in the conventional method, when coating a peelable resin based on ethylene-vinyl acetate copolymer, the melt adhesion to the base material is poor, so a bridging resin such as polyethylene is extruded and coated on the base material. The manufacturing process involves two steps: extruding and coating an ethylene-vinyl acetate copolymer peelable resin on top. Furthermore, the tandem method in which these are extruded and coated in one step requires an expensive extrusion coating device. These extrusion coating methods have the drawback of requiring complicated manufacturing steps or expensive equipment. These methods are disadvantageous in terms of cost. This is especially noticeable for small lot products. On the other hand, according to the present invention, it is also advantageous in terms of cost for small lot products. Furthermore, according to the manufacturing method of the present invention, the adhesive strength not only between the layers of the lid material and the container but also between each layer of the lid material itself can be made strong enough to withstand boiling treatment. be. Next, the present invention will be specifically explained with reference to Examples. <Example> Using the inflation method, a multilayer film of low density polyethylene, linear low density polyethylene, and ethylene-vinyl acetate copolymer as a support layer and a peelable resin based on ethylene-vinyl acetate copolymer as a sealant layer was formed. (Laminated film). See Table-1.
【表】
これらを基材のポリエステルフイルム12μにイ
ソシアネート系接着剤を用い支持層側と貼り合せ
た。そして蓋材を形成した。
これをポリスチレン製容器にヒートシールした
所、層間の剥離がなく良好な易開封性を示した。
又80℃−60分のボイル処理後もピール強度がほと
んど変わらず良好であつた。表−２参照。[Table] These were bonded to the support layer side using an isocyanate adhesive to a 12 μm polyester film as a base material. Then, a lid material was formed. When this was heat-sealed in a polystyrene container, there was no peeling between the layers and it showed good ease of opening.
Furthermore, even after boiling at 80°C for 60 minutes, the peel strength remained good with almost no change. See Table-2.
第１図は、本発明における積層フイルムの断面
図、第２図は、本発明の易開封性蓋材の断面図で
ある。
１…支持層、２…シーラント層、３…積層フイ
ルム、４…基材、５…易開封性蓋材。
FIG. 1 is a cross-sectional view of the laminated film of the present invention, and FIG. 2 is a cross-sectional view of the easy-to-open lid material of the present invention. DESCRIPTION OF SYMBOLS 1... Support layer, 2... Sealant layer, 3... Laminated film, 4... Base material, 5... Easy-open lid material.
Claims (1)
樹脂と、製膜しやすく、且つ該エチレン−酢酸ビ
ニル共重合体系ピーラブル樹脂との熱融着性の良
好な樹脂とを、Ｔダイ方式又はインフレーシヨン
方式により共押出し製膜して、エチレン−酢酸ビ
ニル共重合体系ピーラブル樹脂からなる厚み10〜
100μのシーラント層とそれを支持する、厚みが
シーラント層の厚みと同等かそれ以上の支持層と
からなる積層フイルムを得る工程と、該積層フイ
ルムを基材に、支持層側を基材側に向けてドライ
ラミネートする工程とからなることを特徴とする
ボイル処理用容器の易開封性蓋材の製造方法。1. An ethylene-vinyl acetate copolymer-based peelable resin and a resin that is easy to form into a film and have good heat fusion properties with the ethylene-vinyl acetate copolymer-based peelable resin are combined by a T-die method or an inflation method. Co-extrusion film made of ethylene-vinyl acetate copolymer peelable resin with a thickness of 10~
A step of obtaining a laminated film consisting of a 100 μm sealant layer and a support layer supporting it and having a thickness equal to or greater than the thickness of the sealant layer, and using the laminated film as a base material, with the support layer side facing the base material side. 1. A method for producing an easy-to-open lid for a boiling container, the method comprising the step of dry laminating the lid for a boiling container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57014572A JPS58132552A (en) | 1982-02-01 | 1982-02-01 | Manufacture of easily unsealed cover material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57014572A JPS58132552A (en) | 1982-02-01 | 1982-02-01 | Manufacture of easily unsealed cover material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58132552A JPS58132552A (en) | 1983-08-06 |
| JPH0355311B2 true JPH0355311B2 (en) | 1991-08-22 |
Family
ID=11864872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57014572A Granted JPS58132552A (en) | 1982-02-01 | 1982-02-01 | Manufacture of easily unsealed cover material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58132552A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015058981A (en) * | 2013-09-17 | 2015-03-30 | 陞一 山並 | Mitigation method of heat seal of container opening part |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584659A (en) * | 1978-12-22 | 1980-06-26 | Denki Kagaku Kogyo Kk | Film capable of being thermally sealed up |
-
1982
- 1982-02-01 JP JP57014572A patent/JPS58132552A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584659A (en) * | 1978-12-22 | 1980-06-26 | Denki Kagaku Kogyo Kk | Film capable of being thermally sealed up |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58132552A (en) | 1983-08-06 |
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