JPH0354334B2 - - Google Patents
Info
- Publication number
- JPH0354334B2 JPH0354334B2 JP7212583A JP7212583A JPH0354334B2 JP H0354334 B2 JPH0354334 B2 JP H0354334B2 JP 7212583 A JP7212583 A JP 7212583A JP 7212583 A JP7212583 A JP 7212583A JP H0354334 B2 JPH0354334 B2 JP H0354334B2
- Authority
- JP
- Japan
- Prior art keywords
- poly
- alkyl group
- ketone
- image forming
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 2
- 239000004480 active ingredient Substances 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 1
- 238000003384 imaging method Methods 0.000 claims 1
- -1 poly(2-butyne) Polymers 0.000 description 47
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- DXVYLFHTJZWTRF-UHFFFAOYSA-N Ethyl isobutyl ketone Chemical compound CCC(=O)CC(C)C DXVYLFHTJZWTRF-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WENNKWXPAWNIOO-UHFFFAOYSA-N undecan-5-one Chemical compound CCCCCCC(=O)CCCC WENNKWXPAWNIOO-UHFFFAOYSA-N 0.000 description 2
- TUIWMHDSXJWXOH-UHFFFAOYSA-N 2,5-dimethylhexan-3-one Chemical compound CC(C)CC(=O)C(C)C TUIWMHDSXJWXOH-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical class CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- XYYMFUCZDNNGFS-UHFFFAOYSA-N 2-methylheptan-3-one Chemical compound CCCCC(=O)C(C)C XYYMFUCZDNNGFS-UHFFFAOYSA-N 0.000 description 1
- AKRJXOYALOGLHQ-UHFFFAOYSA-N 2-methylheptan-4-one Chemical compound CCCC(=O)CC(C)C AKRJXOYALOGLHQ-UHFFFAOYSA-N 0.000 description 1
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 1
- DPLGXGDPPMLJHN-UHFFFAOYSA-N 6-Methylheptan-2-one Chemical compound CC(C)CCCC(C)=O DPLGXGDPPMLJHN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- IYTXKIXETAELAV-UHFFFAOYSA-N Nonan-3-one Chemical compound CCCCCCC(=O)CC IYTXKIXETAELAV-UHFFFAOYSA-N 0.000 description 1
- TYBCSQFBSWACAA-UHFFFAOYSA-N Nonan-4-one Chemical compound CCCCCC(=O)CCC TYBCSQFBSWACAA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 1
- MKJDUHZPLQYUCB-UHFFFAOYSA-N decan-4-one Chemical compound CCCCCCC(=O)CCC MKJDUHZPLQYUCB-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WSGCRAOTEDLMFQ-UHFFFAOYSA-N nonan-5-one Chemical compound CCCCC(=O)CCCC WSGCRAOTEDLMFQ-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- PJGSXYOJTGTZAV-UHFFFAOYSA-N pinacolone Chemical compound CC(=O)C(C)(C)C PJGSXYOJTGTZAV-UHFFFAOYSA-N 0.000 description 1
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
Description
【発明の詳細な説明】
この発明は輻射線を用いて画像を形成する所謂
リソグラフイーに関する新規な材料およびこの材
料を用いて画像を形成する方法に係わるものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel material related to so-called lithography in which images are formed using radiation, and a method for forming images using this material.
リングラフイー技術は微細加工、印刷、写真、
半導体、染色等、広範囲にわたる技術分野におい
て応用されている。本発明の新規材料およびその
画像形成方法はそれら各分野に使用可能である
が、半導体素子や集積回路などの固体デバイスを
製造するプロセスに利用し、ポジ型レジストとし
て特に有用である。最近集積回路の高密度化、高
速化、小型化の要求に応じて、より一層の微細パ
ターンの形成が必要となり、可視光から紫外光を
用いる通常のフオトリソグラフイーに代る新しい
技術の開発が急務となつている。そこで光より更
に波長の短い遠紫外光、X−線、電子線等を用い
るリソグラフイー技術が研究されている。この中
心となるレジスト材料に対する要求性能として感
度、解像力、エツチング耐性、現像許容度、安定
性等、広範な要求があるが、従来開発された材料
およびプロセスはこれらの全ての性能を充分に満
足するものではなく、性能向上が強く望まれてい
た。例えばポリメタクリル酸メチルのようなポジ
型レジストでは解像力は良好であるが、感度やエ
ツチング耐性が劣り、実用上問題があつた。また
ポリメタクリル酸グリシジルのようなネガ型レジ
ストは高感度であり、良好なスループツトを示す
が、解像力や耐ドライエツチング性が劣り、改善
が強く要望されている。特にポジ型レジストでは
一般的に感度が劣り、新規材料の開発が望まれて
いた。 Lingraphie technology is used for microfabrication, printing, photography,
It is applied in a wide range of technical fields such as semiconductors and dyeing. Although the novel material and image forming method of the present invention can be used in each of these fields, it is particularly useful as a positive resist for use in processes for manufacturing solid-state devices such as semiconductor elements and integrated circuits. In response to the recent demands for higher density, higher speed, and smaller integrated circuits, it has become necessary to form even finer patterns, and new technologies have been developed to replace conventional photolithography using visible to ultraviolet light. It has become an urgent matter. Therefore, lithography techniques using far ultraviolet light, X-rays, electron beams, etc., which have shorter wavelengths than light, are being researched. There are a wide range of performance requirements for this core resist material, including sensitivity, resolution, etching resistance, development tolerance, and stability, but conventionally developed materials and processes fully satisfy all of these performances. There was a strong desire for improved performance. For example, positive resists such as polymethyl methacrylate have good resolution, but have poor sensitivity and etching resistance, which poses practical problems. Further, negative resists such as polyglycidyl methacrylate have high sensitivity and exhibit good throughput, but have poor resolution and dry etching resistance, and improvements are strongly desired. In particular, positive resists generally have poor sensitivity, and the development of new materials has been desired.
本発明者等は鋭意研究を重ねた結果、特異な繰
り返し単位を含有するポリマーおよびそれを用い
るプロセスが前記輻射線に対し優れた特性を示す
ことが判明し、本発明に到達した。 As a result of extensive research, the present inventors discovered that a polymer containing a unique repeating unit and a process using the same exhibit excellent properties against the radiation, and thus arrived at the present invention.
即ち、本発明の要旨は一般式()
−C(R1)=C(R2)− ()
(式中R1は水素又はC1からC3のアルキル基、R2
はC1からC10のアルキル基を表わす。)で示される
繰り返し単位を含有するポリマーを有効成分とす
ることを特徴とする輻射線感応性画像形成材料お
よびこの新規材料を用いて薄膜を形成し、遠紫外
光、X線、電子線等の像照射後、有機溶媒で現像
することを特徴とする画像形成方法であり、特に
その現像用溶媒として一般式()
(式中R3およびR4はC1からF6のアルキル基を表
わすか、又は脂環式基を形成しても良い。)で示
される溶媒を主成分として用いる画像形成方法で
あり、更に薄膜を形成するプロセスにおいてベン
ゼン、トルエン、キシレンから選択された少くと
も一種を主成分とする溶媒を用いて溶液とし、こ
の溶液から製膜する画像形成方法に存する。 That is, the gist of the present invention is the general formula () -C(R 1 )=C(R 2 )- () (wherein R 1 is hydrogen or a C 1 to C 3 alkyl group, R 2
represents a C 1 to C 10 alkyl group. ) A radiation-sensitive image-forming material characterized by containing a polymer containing the repeating unit represented by It is an image forming method characterized by developing with an organic solvent after image irradiation, and in particular, as the developing solvent, the general formula () (In the formula, R 3 and R 4 represent an alkyl group of C 1 to F 6 or may form an alicyclic group.) An image forming method using a solvent represented by the following as a main component, and further The image forming method consists in forming a solution using a solvent containing at least one selected from benzene, toluene, and xylene as a main component in the process of forming a thin film, and forming a film from this solution.
以下本発明の説明するに、本発明に用いる輻射
線感応性画像形式材料としては、前記一般式
()で示される繰り返し単位を含有するポリマ
ーを有効成分とする。 In the following description of the present invention, the radiation-sensitive image-forming material used in the present invention contains a polymer containing a repeating unit represented by the above general formula () as an active ingredient.
かかるポリマーとしては前記一般式()で表
わされる繰り返し単位一種のみからなる高分子、
即ちポリ(2−ブチン)、ポリ(2−ペンチン)、
ポリ(2−ヘキシン)、ポリ(2−ヘプチン)、ポ
リ(2−オクチン)、ポリ(2−ノニン)、ポリ
(2−デシン)、ポリ(2−ウンデシン)、ポリ
(2−ドデシン)、ポリ(2−トリデシン)、ポリ
(3,3−ジメチル−1−ブチン)、ポリ(3−ヘ
キシン)、ポリ(3−ヘプチン)、ポリ(3−オク
チン)、ポリ(3−ノニン)、ポリ(3−デシン)、
ポリ(3−ウンデシン)、ポリ(3−ドデシン)、
ポリ(3−トリデシン)、ポリ(3−テトラデシ
ン)、ポリ(4−オクチン)、ポリ(4−ノニン)、
ポリ(4−デシン)、ポリ(4−ウンデシン)、ポ
リ(4−ドデシン)、ポリ(4−トリデシン)、ポ
リ(4−テトラデシン)、ポリ(4−ペンタデシ
ン)等、或いは上記ホモポリマーを形成する各種
モノマーから選ばれた2種以上のモノマーからの
共重合体を挙げることができる。これらのポリマ
ーはおよび族遷移金属触媒例えば塩化モリブ
テン(MoCl5)系により置換アセチレンを公知の
方法に準じて重合することにより合成できる〔本
発明者等の中の一部のものによる発明(特開昭58
−32608号、特願昭57−162398号)〕。 Such polymers include polymers consisting of only one type of repeating unit represented by the general formula (),
That is, poly(2-butyne), poly(2-pentyne),
Poly(2-hexyne), poly(2-heptyne), poly(2-octyne), poly(2-nonine), poly(2-decyne), poly(2-undecyne), poly(2-dodecyne), poly (2-tridecine), poly(3,3-dimethyl-1-butyne), poly(3-hexyne), poly(3-heptyne), poly(3-octyne), poly(3-nonine), poly(3-heptyne) -Decine),
poly(3-undecyne), poly(3-dodecyne),
Poly(3-tridecine), poly(3-tetradecine), poly(4-octyne), poly(4-nonine),
Poly(4-decyne), poly(4-undecyne), poly(4-dodecyne), poly(4-tridecyne), poly(4-tetradecine), poly(4-pentadecyne), etc., or the above homopolymers are formed. Copolymers of two or more monomers selected from various monomers can be mentioned. These polymers can be synthesized by polymerizing substituted acetylene using a group transition metal catalyst such as molybten chloride (MoCl 5 ) according to a known method. Showa 58
-32608, Patent Application No. 162398 (1983)].
本発明においては、一般に上述のポリマー、好
ましくは、数平均分子量1万以上(GPC法、ス
チレン換算)のポリマー更に必要に応じて公知の
種々の添加剤等をベンゼン、トルエン、キシレン
から選択された1種以上を主成分とする溶媒に溶
解して塗布液を調整し、シリコンウエハー、ガラ
ス、プリント基板等の基板上に、種々の方法例え
ばスピンナーにより回転塗布し、必要な膜厚の薄
膜を形成する。かかる画像形成材料上に目的に応
じ、遠紫外光、X−線、電子線等から選択された
輻射線を像状に一定量照射する。 In the present invention, the above-mentioned polymer is generally used, preferably a polymer having a number average molecular weight of 10,000 or more (GPC method, styrene equivalent), and, if necessary, various known additives selected from benzene, toluene, and xylene. Prepare a coating solution by dissolving it in a solvent containing one or more of these as the main component, and apply it on a substrate such as a silicon wafer, glass, or printed circuit board using various methods, such as a spinner, to form a thin film of the required thickness. do. A certain amount of radiation selected from deep ultraviolet light, X-rays, electron beams, etc. is irradiated onto the image forming material in an imagewise manner depending on the purpose.
次いで前記一般式()で示される溶媒を主成
分とする現像液を用いて常法により現像すること
ができる。 Next, it can be developed by a conventional method using a developer containing a solvent represented by the above general formula () as a main component.
かかる現像液としてぱ前記一般式()で表わ
される溶媒即ちアセント、メチルエチルケトン、
メチル−n−プロピルケトン、メチル−イソ−プ
ロピルケトン、メチル−n−ブチルケトン、メチ
ル−イソ−ブチルケトン、メチル−sec−ブチル
ケトン、メチル−t−ブチルケトン、メチル4−
メチルペンチルケトン、メチル−n−ヘキシルケ
トン、ジエチルケトン、エチル−n−プロピルケ
トン、エチル−n−ブチルケトン、エチル−iso
−ブチルケトン、エチル−n−ヘキシルケトン、
ジ−n−プロピルケトン、ジ−iso−プロピルケ
トン、n−プロピル−isoブチルケトン、iso−プ
ロピル−n−ブチルケトン、isoプロピル−iso−
ブチルケトン、n−プロピル−n−ペンチルケト
ン、n−プロピル−n−ヘキシルケトン、ジーn
−ブチルケトン、ジ−iso−ブチルケトン、n−
ブチル−n−ヘキシルケトン、ジ−n−ペンチル
ケトン、シクロヘキサノン、シクロペンタノン、
シクロヘプタノン等を単独、或いはこれらから選
択された2種以上を混合したものを挙げることが
できる。また、これらの溶媒を主成分として、更
に酢酸エチルのようなエステル類、n−BnOHの
様なアルコール類、n−プロピルセロソルブのよ
うなセロソルブ類、エチルセロソルブアセテート
のようなセロソルブエステル類等を混合したもの
を用いることもできる。しかし好ましくはアセト
ン、メチルエチルケトン、メチル−iso−ブチル
ケトン等を挙げることができる。 As such a developer, a solvent represented by the above general formula (), ie, ascent, methyl ethyl ketone,
Methyl-n-propyl ketone, methyl-iso-propyl ketone, methyl-n-butyl ketone, methyl-iso-butyl ketone, methyl-sec-butyl ketone, methyl-t-butyl ketone, methyl 4-
Methylpentylketone, methyl-n-hexylketone, diethylketone, ethyl-n-propylketone, ethyl-n-butylketone, ethyl-iso
-butyl ketone, ethyl-n-hexyl ketone,
Di-n-propyl ketone, di-iso-propyl ketone, n-propyl-isobutyl ketone, iso-propyl-n-butyl ketone, isopropyl-iso-
Butyl ketone, n-propyl-n-pentyl ketone, n-propyl-n-hexyl ketone, di-n
-butyl ketone, di-iso-butyl ketone, n-
Butyl-n-hexyl ketone, di-n-pentyl ketone, cyclohexanone, cyclopentanone,
Examples include cycloheptanone and the like alone or a mixture of two or more selected from these. In addition, with these solvents as the main components, esters such as ethyl acetate, alcohols such as n-BnOH, cellosolves such as n-propyl cellosolve, cellosolve esters such as ethyl cellosolve acetate, etc. are mixed. It is also possible to use a However, preferred examples include acetone, methyl ethyl ketone, methyl-iso-butyl ketone, and the like.
このようにして形成した画像は解像力が良く、
ミクロンからサブミクロンのフアインパターンが
再現できた。 Images formed in this way have good resolution;
Fine patterns from microns to submicrons could be reproduced.
また感度についても通常用いられているポジ型
ポリマーであるポリメタクリル酸メチルに比べて
約2倍以上の高感度を示し、極めて高性能を示す
ことが見出された。 It was also found that the sensitivity is about twice as high as that of polymethyl methacrylate, which is a commonly used positive type polymer, and exhibits extremely high performance.
次に本発明およびその効果を実施例により説明
するが、本発明はこれらにより、なんら限定され
るものではない。 EXAMPLES Next, the present invention and its effects will be explained with reference to examples, but the present invention is not limited to these in any way.
実施例 1
MoCl5系触媒により重合したポリ(2−オクチ
ン)(n=7.89×104、w/n=1.8)4.9g
をキシレン100mlに溶解した液を調整し、シリコ
ンウエハー上に4000r.p.mの回転数でスピンコー
テイングをし、0.9μmの薄膜を形成した。表面粗
さ計により表面状態を観察した結果極めて均一な
塗膜を形成できた。Example 1 4.9 g of poly(2-octyne) (n=7.89×10 4 , w/n=1.8) polymerized using a MoCl 5 catalyst
A solution was prepared by dissolving this in 100 ml of xylene, and spin coating was performed on a silicon wafer at a rotation speed of 4000 rpm to form a 0.9 μm thin film. Observation of the surface condition using a surface roughness meter revealed that an extremely uniform coating film could be formed.
Si3N4を基板材料に、金をX線吸収体として作
製したマスクを用いて、AlK線をX線源として
400mJ/cm2の照射を行つた。照射後、メチルエ
チルケトン中に、20℃において1分間浸漬し現像
した。走査型電顕によつて観察した結果、線幅と
間隔が0.5μmのフアインパターンが再現できた。 Using a mask made of Si 3 N 4 as a substrate material and gold as an X-ray absorber, AlK rays are used as an X-ray source.
Irradiation was performed at 400 mJ/cm 2 . After irradiation, it was immersed in methyl ethyl ketone at 20° C. for 1 minute and developed. As a result of observation using a scanning electron microscope, a fine pattern with a line width and spacing of 0.5 μm could be reproduced.
なお、比較のためのポリメチルメタクリレート
(PMMA)を用いて同様に実施したところ800m
J/cm2の照射が必要であつた。 For comparison, a similar test using polymethyl methacrylate (PMMA) resulted in a distance of 800 m.
Irradiation of J/cm 2 was required.
実施例 2
実施例1で調整した溶液を、シリコンアエハー
上に4000r.p.mの回転数でスピンコーテイングし、
0.9μmの薄膜を形成した。90℃において30分プレ
ベークした後、解像力テストパターンを形成した
ガラスマスクを密着させた。Example 2 The solution prepared in Example 1 was spin-coated onto a silicon wafer at a rotation speed of 4000 rpm.
A thin film of 0.9 μm was formed. After prebaking at 90°C for 30 minutes, a glass mask on which a resolution test pattern was formed was placed in close contact.
次に500WXe−Hgランプを光源として遠紫外
線を30秒間照射した。照射後、メチルエチルケト
ン中に20℃、一分間浸漬し現像した。走査型電子
顕微鏡によつて観察した結果0.8μmのシヤープな
像が形成できた。 Next, deep ultraviolet rays were irradiated for 30 seconds using a 500WXe-Hg lamp as a light source. After irradiation, the film was developed by immersing it in methyl ethyl ketone at 20°C for 1 minute. As a result of observation using a scanning electron microscope, a sharp image of 0.8 μm was formed.
実施例 3
実施例2のポリ(2−オクチン)の代りにポリ
(2−デシン)(n=6.05×104、w/n=
1.9)を用いて同様に遠紫外線を30秒間照射した。
同条件で現像した結果シヤープな微小レジストパ
ターンが形成できた。Example 3 Poly(2-decyne) (n=6.05×10 4 , w/n=
1.9) and was similarly irradiated with far ultraviolet rays for 30 seconds.
As a result of developing under the same conditions, a sharp micro resist pattern was formed.
実施例 4
実施例2のキシレンの代りにトルエンを溶媒に
用いて同様にリソグラフイー工程を行つた結果、
実施例2とほぼ同等な微細パターンが再現でき
た。Example 4 As a result of carrying out the same lithography process using toluene as a solvent instead of xylene in Example 2,
A fine pattern almost equivalent to that of Example 2 could be reproduced.
実施例 5
実施例2のメチル・エチル・ケトンの代りにア
セトンを現像液として用い同様に行つた結果、実
施例2とほぼ同等なレジスト像が再現できた。Example 5 As a result of carrying out the same procedure as in Example 2 using acetone as a developer instead of methyl ethyl ketone, a resist image almost equivalent to that of Example 2 was reproduced.
実施例 6
実施例2のメチル・エチル・ケトンの代りにメ
チルイソブチルケトンを現像液として用い、同様
に行つた結果、実施例2とほぼ同等なレジスト像
が得られた。Example 6 The same procedure was carried out using methyl isobutyl ketone as a developer instead of methyl ethyl ketone in Example 2, and as a result, a resist image almost equivalent to that of Example 2 was obtained.
実施例 7
実施例2のメチル・エチル・ケトンの代りにシ
クロヘキサノンを現像液とし用い、同様に行つた
結果、実施例2とほヾ同等なレジスト像が得られ
た。Example 7 The same procedure was carried out using cyclohexanone as a developer instead of methyl ethyl ketone in Example 2, and as a result, a resist image almost equivalent to that of Example 2 was obtained.
実施例 8
実施例2のポリ(2−オクチン)の代りにポリ
(3,3−ジメチル−1−ブチン)(n=2.18×
104、w/n=1.7)を用いて同様に遠紫外線
を50秒間照射した。同様な条件で処理した結果、
シヤープな微小レジストパターンが形成できた。Example 8 Poly(3,3-dimethyl-1-butyne) (n=2.18×
10 4 , w/n=1.7) and was similarly irradiated with deep ultraviolet rays for 50 seconds. As a result of processing under similar conditions,
A sharp micro resist pattern was formed.
Claims (1)
R2はC1からC10のアルキル基を表わす) で示される繰り返し単位を有するポリマーを有効
成分とする輻射線感応性画像形成材料。 2 一般式() (式中、R1は水素又はC1からC3のアルキル基、
R2はC1からC10のアルキル基を表わす) で示される繰り返し単位を有するポリマーを有効
成分とする輻射線感応性画像材料から薄膜を形成
し、これに輻射線による像照射後、有機溶媒で現
像することを特徴とする画像形成方法。 3 有機溶媒は、一般式() (式中、R3およびR4はC1からC6のアルキル基を
表わすか又は脂環式基を形成していてもよい)で
示される溶媒を主成分とするものである特許請求
の範囲第2項記載の画像形成方法 4 薄膜は輻射線感応性画像形成材料をキシレ
ン、トルエンおよびベンゼンの中から選ばれた少
くとも1種類の溶媒に溶かした溶液から製膜され
たものである特許請求の範囲第2項記載の画像形
成方法。[Claims] 1 General formula () (In the formula, R 1 is hydrogen or a C 1 to C 3 alkyl group,
R 2 represents a C 1 to C 10 alkyl group) A radiation-sensitive image-forming material containing a polymer having a repeating unit represented by: 2 General formula () (In the formula, R 1 is hydrogen or a C 1 to C 3 alkyl group,
R 2 represents an alkyl group from C 1 to C 10 ) A thin film is formed from a radiation-sensitive imaging material containing as an active ingredient a polymer having a repeating unit of An image forming method characterized by developing with. 3 The organic solvent has the general formula () (In the formula, R 3 and R 4 may represent a C 1 to C 6 alkyl group or may form an alicyclic group) as a main component. Image forming method 4 according to item 2: A patent claim in which the thin film is formed from a solution of a radiation-sensitive image forming material dissolved in at least one solvent selected from xylene, toluene, and benzene. The image forming method according to item 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58072125A JPS59198447A (en) | 1983-04-26 | 1983-04-26 | Radiation-sensitive image forming material and image forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58072125A JPS59198447A (en) | 1983-04-26 | 1983-04-26 | Radiation-sensitive image forming material and image forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59198447A JPS59198447A (en) | 1984-11-10 |
JPH0354334B2 true JPH0354334B2 (en) | 1991-08-19 |
Family
ID=13480287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58072125A Granted JPS59198447A (en) | 1983-04-26 | 1983-04-26 | Radiation-sensitive image forming material and image forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59198447A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08262738A (en) * | 1995-03-27 | 1996-10-11 | Agency Of Ind Science & Technol | Fine pattern forming method |
-
1983
- 1983-04-26 JP JP58072125A patent/JPS59198447A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59198447A (en) | 1984-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1444551B1 (en) | Photoresist composition for deep uv radiation containing an additive | |
KR100940053B1 (en) | Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds | |
DE60129024T2 (en) | PHOTORESISTIC COMPOSITION SUITABLE FOR DEPOSITING WITH DEEP UV RADIATION AND THIS USE OF THE PICTURE PRODUCTION PROCESS | |
TWI295412B (en) | Positive-working photoimageable bottom antireflective coating | |
JPS61144639A (en) | Radiation sensitive composition and pattern forming method using its composition | |
TWI385487B (en) | Photoresist compositions | |
JP4299670B2 (en) | Negative deep UV photoresist | |
US6919164B2 (en) | Patterning compositions using E-beam lithography and structures and devices made thereby | |
TWI663476B (en) | Radiation-sensitive or actinic ray-sensitive resin composition and resist film using the same, mask blanks, method for forming resist pattern, method for manufacturing electronic device and electronic device | |
CN111948904B (en) | Photoresist composition, method for forming photolithographic pattern using the same, and use thereof | |
KR20040029977A (en) | Thick film photoresists and methods for use thereof | |
KR20000047909A (en) | Itaconic anhydride polymers and photoresist compositions comprising same | |
US6562554B1 (en) | Photoresist compositions with cyclic olefin polymers and hydrophobic non-steroidal multi-alicyclic additives | |
JPH0943848A (en) | Resist material and resist pattern forming method | |
US6251560B1 (en) | Photoresist compositions with cyclic olefin polymers having lactone moiety | |
US5401608A (en) | Negative-working radiation-sensitive mixture and radiation-sensitive recording material produced therewith | |
WO2013070511A1 (en) | Hybrid photoresist composition and pattern forming method using thereof | |
KR102117291B1 (en) | Photoresists comprising amide component | |
JP3901342B2 (en) | Positive photosensitive resin composition | |
US5252430A (en) | Fine pattern forming method | |
EP0410794A2 (en) | Maleimide containing, negative working deep UV photoresist | |
KR20000047910A (en) | Photoresist compositions particularly suitable for short wavelength imaging | |
JP3851440B2 (en) | Positive photosensitive composition | |
JPH05249681A (en) | Acid decomposable compound and positive radiation sensitive resist composition containing the same | |
JPH02248952A (en) | Photosensitive composition |