JPH035414B2 - - Google Patents
Info
- Publication number
- JPH035414B2 JPH035414B2 JP56159308A JP15930881A JPH035414B2 JP H035414 B2 JPH035414 B2 JP H035414B2 JP 56159308 A JP56159308 A JP 56159308A JP 15930881 A JP15930881 A JP 15930881A JP H035414 B2 JPH035414 B2 JP H035414B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- reaction
- amine
- molecular weight
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 150000001875 compounds Chemical class 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 10
- 125000004193 piperazinyl group Chemical group 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 15
- 150000003335 secondary amines Chemical class 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 150000004985 diamines Chemical class 0.000 description 9
- 238000009826 distribution Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 239000003973 paint Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 8
- -1 cyclic tertiary amine Chemical class 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000003141 primary amines Chemical class 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000007591 painting process Methods 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OIVLITBTBDPEFK-UHFFFAOYSA-N 5,6-dihydrouracil Chemical compound O=C1CCNC(=O)N1 OIVLITBTBDPEFK-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical class OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- QUWAJPZDCZDTJS-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfonylphenol Chemical class OC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1O QUWAJPZDCZDTJS-UHFFFAOYSA-N 0.000 description 1
- JOBYTHHZLJPOLW-UHFFFAOYSA-N 2-(chloromethyl)-2-ethyloxirane Chemical compound CCC1(CCl)CO1 JOBYTHHZLJPOLW-UHFFFAOYSA-N 0.000 description 1
- VVHFXJOCUKBZFS-UHFFFAOYSA-N 2-(chloromethyl)-2-methyloxirane Chemical compound ClCC1(C)CO1 VVHFXJOCUKBZFS-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- REFDOIWRJDGBHY-UHFFFAOYSA-N 2-bromobenzene-1,4-diol Chemical compound OC1=CC=C(O)C(Br)=C1 REFDOIWRJDGBHY-UHFFFAOYSA-N 0.000 description 1
- TUJHKTMBIVIOOV-UHFFFAOYSA-N 3-(4-hydroxyphenyl)-1,1,3-trimethyl-2h-inden-5-ol Chemical compound C12=CC(O)=CC=C2C(C)(C)CC1(C)C1=CC=C(O)C=C1 TUJHKTMBIVIOOV-UHFFFAOYSA-N 0.000 description 1
- GRLQBYQELUWBIO-UHFFFAOYSA-N 4,6-dichlorobenzene-1,3-diol Chemical compound OC1=CC(O)=C(Cl)C=C1Cl GRLQBYQELUWBIO-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 1
- YXVSYZRICGNXIH-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-2-phenylethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)CC1=CC=CC=C1 YXVSYZRICGNXIH-UHFFFAOYSA-N 0.000 description 1
- KWQRQJQLSQOJFN-UHFFFAOYSA-N 4-[4-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C)(C)C1=CC=C(O)C=C1 KWQRQJQLSQOJFN-UHFFFAOYSA-N 0.000 description 1
- 101710179734 6,7-dimethyl-8-ribityllumazine synthase 2 Proteins 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 101710186609 Lipoyl synthase 2 Proteins 0.000 description 1
- 101710122908 Lipoyl synthase 2, chloroplastic Proteins 0.000 description 1
- 101710101072 Lipoyl synthase 2, mitochondrial Proteins 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000007039 two-step reaction Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
【発明の詳細な説明】
本発明は耐衝撃性、耐食性にすぐれた被膜を与
える被覆用樹脂の製法に関する。さらに詳しく
は、耐衝撃性、耐食性、密着性、性熱性、機械的
物性に優れたピペラジン環含有ポリヒドロキシポ
リエーテルアミンの製法に関する。
エポキシ樹脂及びエポキシ変成ポリオール樹脂
は金属に対する密着性、耐食性などの点に於いて
すぐれて居り、広く下塗り塗料として使用されて
いる。しかし、近年塗装工程の合理化、そして省
資源化などの要望から、塗装工程の省略もしくは
削減または作業性の向上などといつた傾向が強ま
り、次第に高性能の塗料が求められる様になつて
きた。一般に常温硬化のエポキシ樹脂は、アミン
系の硬化剤を必要とし、二液系となる。又エポキ
シ変成ポリオール樹脂の場合も硬化剤としててポ
リイソシアネートを必要とし、二液系である。二
液系の場合可使時間と言う制限と、計量の必要と
言つた欠点があつた。この欠点をある程度カバー
するものとして、分子量30000〜40000のフエノキ
シ樹脂と称されるポリヒドロキシポリエーテル樹
脂があるが、の系は架橋していないため二次密着
性が劣る傾向にある。一般のエポキシい比較して
フエノキシ樹脂は耐衝撃性は優れているのである
が、それでも耐衝撃後の二次密着には満足な結果
が得られていない。前述の如く、塗装工程の合理
化のため、あらかじめ塗装された金属素材が、切
断加工や曲げ加工時に於ける強い変形や衝撃に耐
え尚且つ、加工部の耐食性等塗膜特性を維持する
ことが必要である。本発明者等は本質的にはフエ
ノキシ系に属するが、前記の欠点を充分に補つた
極めてすぐれた耐食性と強靭性、密着性さらには
耐衝撃性を兼ね具えた新しい被覆材料を提供すべ
く鋭意研究を重ねた結果、本発明を完成させたも
のである。
すなわち本発明は、Nアミノエチルピペラジン
と二塩基酸若しくは二塩基酸低級アルキルエステ
ルとの反応生成物であ1分子中に2個のピペラジ
ン環と2個の2級アミンを含有する有機アミンと
ジエポキシ化合物とを、アミノ基とエポキシ基が
実質的に等モル若しくはアミノ基少過剰モルにて
反応させることを特徴とするピペラジン環含有ポ
リヒドロキシポリエーテルアミンの製法である。
本発明のポリヒドロキシポリエーテルアミンの分
子内にはピペラジン環が導入されて居り、この環
状3級アミンの窒素の作用によつて下地金属との
密着性が著しく改善される。又分子内にはエステ
ル結合を含んでいないので耐アルカリ性及び耐水
性が優れる。又環状化合物は線状化合物よりも耐
熱性が良いことが知られて居り、耐熱性の向上が
期待出来る。又本発明のポリヒドロキシポリエー
テルアミンは耐衝撃性が非常に良好である事が判
つた。これは本発明の有機アミンである2級アミ
ンとエポキシ基の反応が均一かつスムーズに分子
量が増大し、分子量分布がシヤープであり、且つ
低分子量領域の成分が少ないと言う事に起因する
ものと思われる。本発明の前記ポリヒドロキシポ
リエーテルアミンに類似した化合物として、2官
能エポキシ化合物と1級モノアミンとの反応によ
りポリヒドロキシポリエーテルアミンを製造する
方法も提案(特公昭35−11796号、同36−1993号、
同51−18973号)されているが、1級アミンとエ
ポキシとの反応による高分子化は実際には2段反
応となる。すなわち、1級アミンとエポキシが反
応して2級アミンを生成させ、生成した2級アミ
ンとエポキシが反応する。ところが、1級アミン
と2級アミンのエポキシとの反応速度には大きな
差があり、1級アミンは2級アミンの50〜100倍
の反応速度を待つ。さらに1級アミンが付加して
生成して出来た2級アミンは、アミンに由来する
アルキル基で置換されて居り、これが立体障害と
なつて2級アミンのエポキシへの付加反応が著し
く遅くなつりする。その結果ジエポキシ化合物と
1級アミンとの反応により得られるポリヒドロキ
シポリエーテルアミンは分子量がスムーズに上が
りづらく、分子量分布も広くなり、低分子側が多
くそれ自身では自己造膜性がなく、架橋剤を用い
て造膜させる必要がある。当然耐衝撃性に劣る。
本発明のエポキシとピペラジン環の2級アミンと
の反応は実質的に立体障害は起らないし、又初め
から2級アミンのみを用いるので、反応速度の違
いによる弊害が起らず、したがつて分子量分布の
シヤープなポリマーを作ることが出来る。先に述
べたビスフエノールAとエピクロルヒドリンから
合成されるポリヒドロキシポリエーテルでも分子
量分布を比較的シヤープに作ることは出来るけれ
ども、このポリマー系はアルカリ触媒で高分子化
するために25時間〜30時間といつた長時間の反応
となる。もし反応時間の短縮をねらつて高濃度の
アルカリ触媒を使用すると、ペンダントにある2
級水酸基とエポキシとの反応による枝分れしたポ
リマーとなり好ましくない。またこの系はアルカ
リ触媒の除去に多大の労力と時間エネルギーを消
費するため製造コストが増大する。又特公昭53−
20080号には、2,5−ピペラジン、2,6−ピ
ペラジン、2,4−イミダゾリジオン、5,6−
ジヒドロウラシル、バルビツール酸等の窒素含有
複素環式化合物とエポキシ化合物の反応により被
覆及び成型用熱可塑性樹脂の製造方法が開示され
ている。上記窒素含有複素環式化合物はいずれも
環中にカルボニル基が入つて居り、しかもそのカ
ルボニルは窒素(2級アミン)の隣りの炭素元子
である。つまり−CONH−で表わされる如く、
この窒素に結合する水素は言わゆるアミド態水素
の性質に近く、一般の2級アミン態水素と比較し
てエポキシ基との反応性は著しく悪い。事実特公
昭53−20080号に記載のある実施例全てが、触媒
(4級アンモニウム塩)を使用して居り、しかも
反応時間も100〜110℃で35〜60時間と言う長時間
を要し、著しく生産性が悪い。又触媒を使用して
居り、これは除去されないので性能上問題を生ず
る可能性があり満足すべきものではない。これに
反して本発明による方法は本質的に線状のポリマ
ーのみで、反応時間も5〜6時間で充分であり、
触媒の除去も不用であり、全ての面で従来のポリ
マー系よりもすぐれていると言える。本発明に使
用される有機アミンとは下記式〔〕で表わされ
るもので、
ただし、Rcは二塩基酸残基
Nアミノエチルピペラジンと二塩基酸又は二塩
基酸低級アルキルエステルからアミド反応により
合成されるもので、使用出来る二塩基酸又はその
エステルとしては、アジピン酸、セバチン酸、
1・10デカカルボン酸、トール油脂肪酸の重合に
より得られる高純度ダイマー酸や、イソフタル
酸、テレフタル酸の如き芳香族ジカルボン酸、又
末端カルボン酸を持つブタジエン−アクリルニト
リル液状ゴム、末端カルボン酸低分子ポリエステ
ルオリゴー等が使用出来る。
又、本発明に使用されるジエポキシ化合物とし
ては2価フエノールとエピハロヒドリンとを常法
により反応させることにより得られる。2価フエ
ノールとしては、1個の芳香族核を有する単核2
価フエノール及び2個以上の芳香族核を有する多
核2価フエノールがある。単核2価フエノールの
例としては、例えばレゾルシノール、4,6−ジ
クロロ−レゾルシノール、ハイドロキノン、2−
ブロモ−ハイドロキノン、バイロカテコール、フ
ロログルシノール、1,5−ジヒドロキシナフタ
レン、2,7−ジヒドロキシナフタレン、2,6
−ジヒドロキシナフタレなどがあげられる。又多
核2価フエノールとしては例えば2,2−ビス−
(4−ヒドロキシフエニル)プロパン(ビスフエ
ノールA)に代表される各種のビス(ヒドロキシ
フエニル)アルカン、或いは4,4′−ジヒドロキ
シフエニルに代表される各種のジヒドロキシビフ
エニル、或いはビス−(4−ヒドロキシフエニル)
スルホンに代表される各種のジ(ヒドロキシフエ
ニル)スルホン、或いはビス(4−ヒドロキシフ
エニル)エーテルに代表される各種のジ(ヒドロ
キシフエニル)エーテル等があげられる。更に
1,1−ビス(4−ヒドロキシフエニル)−2−
フエニルエタン、1,3,3−トリメチル−1−
(4−ヒドロキシフエニル)−6−ヒドロキシイン
ダン、2,4−ビス(p−ヒドロキシフエニル)
−4−メチルペンタンも使用出来る。又エピハロ
ヒドリンとしては、例えばエピクロヒドリン、エ
ピブロムヒドリン、1,2−エポキシ−2−メチ
ル−3−クロルプロパン、1,2−エポキシ−2
−エチル−3−クロルプロパンなどがあげられ
る。
上記エピハロヒドリンと2価フエノールとの反
応を促進する触媒としては、三弗化硼素、塩化第
二錫、塩化亜鉛、塩化第二鉄の如きルイス酸、こ
れらの活性を示す誘導体(例:三弗化硼素−エー
テル錯化合物)或いはこれらの混合物等の酸性触
媒及びアルカリ金属水酸化物、アルカリ金属アル
コラート、第3級アミン化合物、第4級アンモニ
ウム化合物或いはこれらの混合物等の塩基性触媒
があげられる。かかる反応と同時に前記エポキシ
化合物を生成せしめるか、或いは反応の結果生成
したポリハロヒドリンエーテルを脱ハロゲン化水
素反応によつて閉環せしめて前記エポキシ化合物
を生成せしめる。この脱ハロゲン化水素反応に用
いる塩基性化合物としてはアルカリ金属酸化物、
アルミン酸アルカル金属塩等が用いられる。これ
らの触媒乃至塩基性化合物はそのまま或いは適当
な無機、有機溶媒溶液として使用することができ
るものである。
しかして本発明のピペラジン環含有ポリヒドロ
キシポリエーテルアミンの製造方法は以下の如き
方法で実施することができる。即ち、上記本発明
有機アミンとエポキシ化合物を実質的に等モル若
しくは少過剰仕込み、所望によりケトン系、エー
テル系、エステル系、フエノール系、芳香族炭化
水素/アルコール混合系等を溶媒として用いても
よい。かくして得られたピペラジン環含有ポリヒ
ドロキシポリエーテルアミンは、単独で用いるこ
とができるが、エポキシ樹脂、尿素メラミン樹
脂、ポリウレタン樹脂、ポリウレタンプレポリマ
ー、フエノール樹脂、アルキツト樹脂、ポリエス
テル樹脂などから選ばれた1種又は2種以上の樹
脂を所望の目的範囲で含有せしめることができ
る。また必要に応じて稀釈剤、染料、顔料、充填
剤、可塑剤、架橋剤等を含有せしめることも出来
る。本発明の効果は、得られるピペラジン含有ポ
リヒドロキシポリエーテルアミンが高分子量であ
ためラツカータイプの塗料として用いられるほ
か、架橋用樹脂と併用してプレコートメタルの下
地塗料、電線被覆塗料、磁性塗料、罐用塗料等に
も有用である。
以下実施例を示して本発明を説明するが、本発
明はこれら実施例に限定されるものではない。
実施例 1
N−アミノエチルピペラジン130.3部(1.01モ
ル)、アジピン酸73部(0.5モル)を1セパラブ
ルフラスコに仕込み、窒素ガスでパージしながら
脱水し200℃で4時間加熱した。水約18mlを回収
して、1分子当りピペラジン環2個含有したジア
ミン(A−1)を合成した。このものは淡黄色の
ワツクス状であつた。このジアミン(A−1)
184g(0.5モル)にビスフエノールAとエピクロ
ルヒドリンから合成され、エポキシ当量188g/
eqのエポキシ樹脂188g(0.5モル)および溶剤と
してメチルエチルケトン93gを加えて60℃にて反
応させた。30分後メチルエチルケトン100gを加
えた。同様に逐次希釈しながら60℃で5時間反応
させた。最終固形分濃度は40%であつた。得られ
たワニスは色相ガードナー1、25℃での粘度Z6、
ゲル浸透クロマトグラフ法(以下GPCと称す)
にて測定した分子量分布は、数平均分子量
(Mn)31000、重量平均分子量(Mw)96000、分
散度Mw/Mn=3.1であつた。
実施例 2
実施例1で合成したジアミン(A−1)184g
(0.5モル)にビスフエノールAとエピクロルヒド
リンから合成され、エポキシ当量650g/eqの固
形エポキシ樹脂648.7g(0.499モル)およびメチ
ルエチルケトン555gを加えて、50℃にて反応さ
せた。増粘に伴つて逐次希釈して、6時間後固形
分35%のワニスを得た。色相ガードナー1、25℃
での粘度Z2−Z3、GPC法にて測定した分子量分
布は、Mn=28000、Mw=78000、Mw/Mn=
2.78であつた。
実施例 3
N−アミノエチルピペラジン130.3部(1.01モ
ル)、ジメチルテレフタレート97部(0.5モル)を
実施例1と同様に加熱し、メタノールを除去しな
がら220℃で3時間アミド化してジアミン(A−
2)を合成した。このジアミン(A−2)を38.8
g、ビスフエノールAとエピクロルヒドリンから
合成され、エポキシ当量475g/eqのエポキシ樹
脂95g、シクロヘキサノン89.2gを加えて80℃に
加熱した。30分後に固形分40%になる様に希釈し
さらに3時間反応させた。得られたワニスは色相
ガードナー2、25℃での粘度Z5−Z6、GPC法に
て測定した分子量分布は、Mn=17000、Mw=
43000、Mw/Mn=2.53であつた。
比較例 1
アニリン93g(1.0モル)、ビスフエノールAと
エピクロルヒドリンから合成され、エポキシ当量
188g/eqのエポキシ樹脂376g(1.0モル)、シク
ロヘキサノン312.6gを加えて120〜140℃で撹拌
しながら16時間反応させた。固形分60%、色相ガ
ードナー2、25℃での粘度U−V、GPC法にて
測定した分子量分布はMn=2800、Mw=18000、
Mw/Mn=6.43であつた。
比較例 2
ベンジルアミン94g(1.0モル)、ビスフエノー
ルAとエピクロルヒドリンから合成され、エポキ
シ当量475g/eqのエポキシ樹脂950g(1.0モ
ル)、メチルエチルケトン696gを60℃で撹拌反応
させた。逐次希釈しながら24時間反応を行つた。
得られたワニスは固形分40%、色相ガードナー
1、25℃での粘度Y−Z、GPC法にて測定した
分子量分布はMn=5900、Mw=30500、Mw/
Mn=5.17であつた。
比較例 3
ビスフエノールAとエピクロルヒドリンから合
成されたフエノキシ樹脂(米国UCC社PKHH)
40gをメチルエチルケトン60gに溶解せしめて40
%ワニスを得た。色相ガードナー1、25℃での粘
度Z4−Z5、GPC法にて測定した分子量分布はMn
=9500、Mw=42200、Mw/Mn=4.44であつた。
応用例
実施例及び比較例に於いて得られた樹脂を下記
の如き配合及び操作を通して調整一液性ジンクリ
ツチ塗り塗料を、予めサンドブラスト、脱脂処理
した0.8×70×150m/mの軟鋼板上にバーコータ
ーを用いて、乾燥塗膜で約30ミクロンに塗布せし
めた。塗膜の試験は20℃、7日間乾燥後テストし
た。
一液性ジンクリツチプライマーの配合ポリヒド
ロキシポリエーテルアミン又はフエノキシ樹脂
15部
亜鉛末(三井金属(株)製LS−2) 84部
ベントン#
38 1部
希釈溶剤※
適量
固形分 66.7%、顔料重量濃度 85%
分散はペイントコンデイシヨナーで30分間行つ
た。
※ トルエン/セロアセ/IPA=50/30/20の
混合系
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a coating resin that provides a coating with excellent impact resistance and corrosion resistance. More specifically, the present invention relates to a method for producing a piperazine ring-containing polyhydroxypolyetheramine having excellent impact resistance, corrosion resistance, adhesion, thermal properties, and mechanical properties. Epoxy resins and epoxy-modified polyol resins have excellent adhesion to metals and corrosion resistance, and are widely used as undercoat paints. However, in recent years, due to the desire to streamline the painting process and save resources, there has been a growing trend to omit or reduce the painting process or improve workability, and there has been a growing demand for high-performance paints. Generally, epoxy resins that cure at room temperature require an amine-based curing agent and are a two-component type. Also, in the case of epoxy modified polyol resin, polyisocyanate is required as a curing agent, and it is a two-component system. Two-component systems have drawbacks such as limited pot life and the need for measuring. Polyhydroxypolyether resins called phenoxy resins with a molecular weight of 30,000 to 40,000 are available to compensate for this drawback to some extent, but these systems tend to have poor secondary adhesion because they are not crosslinked. Although phenoxy resin has superior impact resistance compared to general epoxy resins, it still does not provide satisfactory secondary adhesion after impact resistance. As mentioned above, in order to streamline the painting process, it is necessary for pre-painted metal materials to withstand strong deformation and impact during cutting and bending, and to maintain coating properties such as corrosion resistance on processed parts. It is. The present inventors have worked diligently to provide a new coating material that essentially belongs to the phenoxy type, but has extremely excellent corrosion resistance, toughness, adhesion, and impact resistance that fully compensates for the above-mentioned drawbacks. As a result of repeated research, the present invention was completed. That is, the present invention is a reaction product of N-aminoethylpiperazine and a dibasic acid or a dibasic acid lower alkyl ester, which is an organic amine containing two piperazine rings and two secondary amines in one molecule, and a diepoxy This is a method for producing a piperazine ring-containing polyhydroxypolyetheramine, which is characterized by reacting a compound with an amino group and an epoxy group in substantially equal moles or in a small excess mole of amino groups.
A piperazine ring is introduced into the molecule of the polyhydroxy polyether amine of the present invention, and the adhesion to the underlying metal is significantly improved by the action of nitrogen of this cyclic tertiary amine. Furthermore, since the molecule does not contain an ester bond, it has excellent alkali resistance and water resistance. Furthermore, it is known that cyclic compounds have better heat resistance than linear compounds, and improvement in heat resistance can be expected. It was also found that the polyhydroxypolyetheramine of the present invention has very good impact resistance. This is due to the fact that the reaction between the secondary amine, which is the organic amine of the present invention, and the epoxy group increases the molecular weight uniformly and smoothly, the molecular weight distribution is sharp, and there are few components in the low molecular weight region. Seem. As a compound similar to the polyhydroxypolyetheramine of the present invention, a method for producing polyhydroxypolyetheramine by reacting a bifunctional epoxy compound with a primary monoamine has also been proposed (Japanese Patent Publication No. 35-11796, No. 36-1993). issue,
No. 51-18973), however, polymerization by the reaction between a primary amine and an epoxy is actually a two-step reaction. That is, the primary amine and epoxy react to generate a secondary amine, and the generated secondary amine and epoxy react. However, there is a large difference in the reaction rate of primary amines and secondary amines with epoxy, with primary amines having a reaction rate 50 to 100 times faster than secondary amines. Furthermore, the secondary amine produced by addition of the primary amine is substituted with an alkyl group derived from the amine, and this acts as a steric hindrance, significantly slowing down the addition reaction of the secondary amine to the epoxy. do. As a result, the molecular weight of the polyhydroxypolyetheramine obtained by the reaction between a diepoxy compound and a primary amine is difficult to increase smoothly, the molecular weight distribution is wide, and many of the molecules are on the low molecular side, and they do not have self-forming properties on their own and do not require crosslinking agents. It is necessary to use it to form a film. Naturally, it has poor impact resistance.
The reaction between the epoxy and the secondary amine of the piperazine ring of the present invention does not substantially cause steric hindrance, and since only the secondary amine is used from the beginning, there are no adverse effects due to differences in reaction rates. It is possible to create polymers with sharp molecular weight distribution. Although it is possible to make the molecular weight distribution relatively sharp with the polyhydroxy polyether synthesized from bisphenol A and epichlorohydrin mentioned above, this polymer system takes 25 to 30 hours to polymerize with an alkaline catalyst. This is a long-lasting reaction. If you use a highly concentrated alkaline catalyst to shorten the reaction time, the
This is undesirable because it results in a branched polymer due to the reaction between the class hydroxyl group and the epoxy. In addition, this system requires a great deal of labor, time and energy to remove the alkali catalyst, which increases production costs. Mata Tokuko Showa 53-
No. 20080 lists 2,5-piperazine, 2,6-piperazine, 2,4-imidazolidione, 5,6-
A method for producing a thermoplastic resin for coating and molding by reacting a nitrogen-containing heterocyclic compound such as dihydrouracil or barbituric acid with an epoxy compound is disclosed. All of the above nitrogen-containing heterocyclic compounds have a carbonyl group in the ring, and the carbonyl is the carbon atom adjacent to nitrogen (secondary amine). In other words, as expressed by -CONH-,
This hydrogen bonded to nitrogen has properties similar to so-called amide hydrogen, and has significantly lower reactivity with epoxy groups than general secondary amine hydrogen. In fact, all of the examples described in Japanese Patent Publication No. 53-20080 use a catalyst (quaternary ammonium salt), and the reaction time is long, 35 to 60 hours at 100 to 110°C. Productivity is extremely poor. Also, since a catalyst is used, which is not removed, it may cause performance problems and is therefore unsatisfactory. In contrast, the method according to the invention uses only essentially linear polymers and a reaction time of 5 to 6 hours is sufficient;
There is no need to remove the catalyst, and it can be said to be superior to conventional polymer systems in all aspects. The organic amine used in the present invention is represented by the following formula [], However, R c is synthesized by an amide reaction from the dibasic acid residue N-aminoethylpiperazine and the dibasic acid or dibasic acid lower alkyl ester, and the usable dibasic acids or their esters include adipic acid, sebatin acid,
1.10 decacarboxylic acid, high purity dimer acid obtained by polymerization of tall oil fatty acids, aromatic dicarboxylic acids such as isophthalic acid and terephthalic acid, butadiene-acrylonitrile liquid rubber with terminal carboxylic acid, and low molecular weight terminal carboxylic acid. Polyester oligo etc. can be used. The diepoxy compound used in the present invention can be obtained by reacting divalent phenol and epihalohydrin in a conventional manner. As a divalent phenol, mononuclear 2 having one aromatic nucleus is used.
There are polyvalent phenols and polynuclear divalent phenols having two or more aromatic nuclei. Examples of mononuclear divalent phenols include, for example, resorcinol, 4,6-dichloro-resorcinol, hydroquinone, 2-
Bromo-hydroquinone, birocatechol, phloroglucinol, 1,5-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,6
-Dihydroxynaphthalene, etc. In addition, examples of polynuclear divalent phenols include 2,2-bis-
Various bis(hydroxyphenyl) alkanes represented by (4-hydroxyphenyl)propane (bisphenol A), various dihydroxybiphenyl represented by 4,4'-dihydroxyphenyl, or bis-( 4-hydroxyphenyl)
Examples include various di(hydroxyphenyl) sulfones represented by sulfones, and various di(hydroxyphenyl) ethers represented by bis(4-hydroxyphenyl) ether. Furthermore, 1,1-bis(4-hydroxyphenyl)-2-
Phenylethane, 1,3,3-trimethyl-1-
(4-hydroxyphenyl)-6-hydroxyindan, 2,4-bis(p-hydroxyphenyl)
-4-Methylpentane can also be used. Examples of epihalohydrin include epichlorohydrin, epibromohydrin, 1,2-epoxy-2-methyl-3-chloropropane, 1,2-epoxy-2
-Ethyl-3-chloropropane and the like. Catalysts that promote the reaction between the epihalohydrin and divalent phenol include Lewis acids such as boron trifluoride, stannic chloride, zinc chloride, and ferric chloride, and derivatives exhibiting these activities (e.g., trifluoride). Examples include acidic catalysts such as boron-ether complex compounds) or mixtures thereof, and basic catalysts such as alkali metal hydroxides, alkali metal alcoholates, tertiary amine compounds, quaternary ammonium compounds, or mixtures thereof. The epoxy compound is produced simultaneously with this reaction, or the polyhalohydrin ether produced as a result of the reaction is ring-closed by a dehydrohalogenation reaction to produce the epoxy compound. The basic compounds used in this dehydrohalogenation reaction include alkali metal oxides,
An alkali metal aluminate or the like is used. These catalysts and basic compounds can be used as they are or as a solution in an appropriate inorganic or organic solvent. The method for producing the piperazine ring-containing polyhydroxypolyetheramine of the present invention can be carried out as follows. That is, the organic amine of the present invention and the epoxy compound may be charged in substantially equal molar amounts or in slight excess, and if desired, a ketone type, ether type, ester type, phenol type, aromatic hydrocarbon/alcohol mixed type, etc. may be used as a solvent. good. The thus obtained piperazine ring-containing polyhydroxypolyetheramine can be used alone, but it can be used in combination with one selected from epoxy resins, urea melamine resins, polyurethane resins, polyurethane prepolymers, phenolic resins, alkite resins, polyester resins, etc. A species or two or more kinds of resins can be contained within a desired objective range. Further, if necessary, diluents, dyes, pigments, fillers, plasticizers, crosslinking agents, etc. can be included. The effects of the present invention are that the piperazine-containing polyhydroxypolyetheramine obtained has a high molecular weight and can be used as a warming lacquer type paint, and can also be used in combination with a crosslinking resin to create base paints for pre-coated metals, wire coating paints, magnetic paints, and cans. It is also useful for paints, etc. The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples. Example 1 130.3 parts (1.01 mol) of N-aminoethylpiperazine and 73 parts (0.5 mol) of adipic acid were charged into a separable flask, dehydrated while purging with nitrogen gas, and heated at 200°C for 4 hours. Approximately 18 ml of water was collected to synthesize a diamine (A-1) containing two piperazine rings per molecule. This substance was pale yellow and waxy. This diamine (A-1)
Synthesized from bisphenol A and epichlorohydrin in 184g (0.5 mol), epoxy equivalent 188g/
188 g (0.5 mol) of the epoxy resin of eq and 93 g of methyl ethyl ketone as a solvent were added and reacted at 60°C. After 30 minutes, 100 g of methyl ethyl ketone was added. The reaction was carried out at 60° C. for 5 hours while diluting the mixture successively in the same manner. The final solids concentration was 40%. The resulting varnish had a hue of Gardner 1, a viscosity at 25°C of Z 6 ,
Gel permeation chromatography (hereinafter referred to as GPC)
The molecular weight distribution measured by the method was as follows: number average molecular weight (Mn) was 31,000, weight average molecular weight (Mw) was 96,000, and dispersity Mw/Mn was 3.1. Example 2 184g of diamine (A-1) synthesized in Example 1
(0.5 mol), 648.7 g (0.499 mol) of a solid epoxy resin synthesized from bisphenol A and epichlorohydrin and having an epoxy equivalent of 650 g/eq, and 555 g of methyl ethyl ketone were added, and the mixture was reacted at 50°C. The mixture was diluted successively as the viscosity increased, and after 6 hours, a varnish with a solid content of 35% was obtained. Hue Gardner 1, 25℃
The viscosity Z 2 - Z 3 at
It was 2.78. Example 3 130.3 parts (1.01 mol) of N-aminoethylpiperazine and 97 parts (0.5 mol) of dimethyl terephthalate were heated in the same manner as in Example 1 and amidated at 220°C for 3 hours while removing methanol to form diamine (A-
2) was synthesized. This diamine (A-2) is 38.8
g, 95 g of an epoxy resin synthesized from bisphenol A and epichlorohydrin and having an epoxy equivalent of 475 g/eq, and 89.2 g of cyclohexanone were added and heated to 80°C. After 30 minutes, the mixture was diluted to a solid content of 40% and reacted for an additional 3 hours. The obtained varnish had a hue of Gardner 2, a viscosity at 25°C of Z 5 −Z 6 , and a molecular weight distribution measured by the GPC method: Mn=17000, Mw=
43000, Mw/Mn=2.53. Comparative Example 1 Synthesized from 93 g (1.0 mol) of aniline, bisphenol A and epichlorohydrin, with epoxy equivalent
376 g (1.0 mol) of a 188 g/eq epoxy resin and 312.6 g of cyclohexanone were added and reacted at 120 to 140° C. with stirring for 16 hours. Solid content 60%, hue Gardner 2, viscosity UV at 25℃, molecular weight distribution measured by GPC method: Mn = 2800, Mw = 18000,
Mw/Mn=6.43. Comparative Example 2 94 g (1.0 mol) of benzylamine, 950 g (1.0 mol) of an epoxy resin synthesized from bisphenol A and epichlorohydrin and having an epoxy equivalent of 475 g/eq, and 696 g of methyl ethyl ketone were stirred and reacted at 60°C. The reaction was carried out for 24 hours with successive dilutions.
The obtained varnish had a solid content of 40%, a hue of Gardner 1, a viscosity of Y-Z at 25°C, and a molecular weight distribution measured by GPC method: Mn = 5900, Mw = 30500, Mw/
Mn=5.17. Comparative Example 3 Phenoxy resin synthesized from bisphenol A and epichlorohydrin (PKHH, UCC, USA)
Dissolve 40g in 60g of methyl ethyl ketone and make 40
% varnish was obtained. Hue Gardner 1, viscosity at 25℃ Z 4 −Z 5 , molecular weight distribution measured by GPC method is Mn
= 9500, Mw = 42200, Mw/Mn = 4.44. Application Example A one-component zinc-rich paint prepared using the resins obtained in the Examples and Comparative Examples through the following formulation and operation was barred onto a 0.8 x 70 x 150 m/m mild steel plate that had been sandblasted and degreased in advance. A coater was used to coat the film to a dry film thickness of approximately 30 microns. The coating film was tested after drying at 20°C for 7 days. One-component zinc-rich primer formulation polyhydroxypolyetheramine or phenoxy resin
15 parts Zinc dust (LS-2 manufactured by Mitsui Kinzoku Co., Ltd.) 84 parts Bentone #38 1 part Diluent solvent* Appropriate amount Solid content 66.7%, Pigment weight concentration 85% Dispersion was performed for 30 minutes using a paint conditioner. * Mixed system of toluene/celloacetate/IPA=50/30/20 [Table]
Claims (1)
は二塩基酸低級アルキルエステルとの反応生成物
である1分子中に2個のピペラジン環と2個の2
級アミンを含有する有機アミンとジエポキシ化合
物とを、アミノ基とエポキシ基が実質的に等モル
若しくはアミノ基少過剰モルにて反応させること
を特徴とするピペラジン環含有ポリヒドロキシポ
リエーテルアミンの製法。Two piperazine rings and two
1. A method for producing a piperazine ring-containing polyhydroxypolyether amine, which comprises reacting an organic amine containing a grade amine with a diepoxy compound in substantially equal moles of amino groups and epoxy groups or in a slight excess mole of amino groups.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15930881A JPS5859220A (en) | 1981-10-05 | 1981-10-05 | Production of coating resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15930881A JPS5859220A (en) | 1981-10-05 | 1981-10-05 | Production of coating resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5859220A JPS5859220A (en) | 1983-04-08 |
JPH035414B2 true JPH035414B2 (en) | 1991-01-25 |
Family
ID=15690959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15930881A Granted JPS5859220A (en) | 1981-10-05 | 1981-10-05 | Production of coating resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5859220A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601225A (en) * | 1983-06-18 | 1985-01-07 | Konishiroku Photo Ind Co Ltd | Curable composition |
JP6601605B2 (en) * | 2014-12-04 | 2019-11-06 | 日産化学株式会社 | Liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element |
-
1981
- 1981-10-05 JP JP15930881A patent/JPS5859220A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5859220A (en) | 1983-04-08 |
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