JPH0353845U - - Google Patents
Info
- Publication number
- JPH0353845U JPH0353845U JP11554789U JP11554789U JPH0353845U JP H0353845 U JPH0353845 U JP H0353845U JP 11554789 U JP11554789 U JP 11554789U JP 11554789 U JP11554789 U JP 11554789U JP H0353845 U JPH0353845 U JP H0353845U
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper foil
- thickness
- hole
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11554789U JPH0353845U (en)van) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11554789U JPH0353845U (en)van) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353845U true JPH0353845U (en)van) | 1991-05-24 |
Family
ID=31663874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11554789U Pending JPH0353845U (en)van) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353845U (en)van) |
-
1989
- 1989-09-29 JP JP11554789U patent/JPH0353845U/ja active Pending