JPH0353597A - Soldering of electronic component to printed board - Google Patents
Soldering of electronic component to printed boardInfo
- Publication number
- JPH0353597A JPH0353597A JP1189826A JP18982689A JPH0353597A JP H0353597 A JPH0353597 A JP H0353597A JP 1189826 A JP1189826 A JP 1189826A JP 18982689 A JP18982689 A JP 18982689A JP H0353597 A JPH0353597 A JP H0353597A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- board
- cream
- soldering
- solder cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 239000006071 cream Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000010936 titanium Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（概 要〕
表面実装型電子部品のプリ
け方法に関し、
プリント基板のフットプリ
ント基板への半田付
ント上に予備半田層
が平坦な状態で形成される方法を目的とし、プリント基
板に設けたフ７トプリントに半田クリームを塗布した後
、該基板を加熱炉内を通過させて前記半田クリームを溶
融させて該フットプリント上に予備半田層を形成ずる工
程を有する半田付け方法に於いて、
前記基板を加熱炉内に通過させる際に、前記基板上に半
田が被着しない平板状部材を設置して前記溶融した半田
を平坦化することで構威する。[Detailed Description of the Invention] (Summary) This invention relates to a method for soldering surface-mounted electronic components, and the present invention aims at a method in which a preliminary solder layer is formed in a flat state on a solder patch of a printed circuit board to a footprint board. , soldering comprising the step of applying solder cream to a footprint provided on a printed circuit board, and then passing the substrate through a heating furnace to melt the solder cream and form a preliminary solder layer on the footprint. In this method, when the substrate is passed through a heating furnace, a flat member to which solder does not adhere is placed on the substrate to flatten the molten solder.
本発明は表面実装型電子部品のプリント基板への半田付
け方法に関する。The present invention relates to a method for soldering surface-mounted electronic components to a printed circuit board.
表面実装型電子部品をプリント基板に半田付けする際、
プリント基板に設けたフットプリントに半田クリームを
塗布した後、該半田クリームに電子部品の接続端子を接
触させた状態で、該電子部品を基板に接着剤で仮止めし
て、加熱炉内を通過させて前記半田クリームを溶融させ
て電子部品に半田付けを行っている。When soldering surface-mounted electronic components to a printed circuit board,
After applying solder cream to the footprint provided on the printed circuit board, with the connection terminal of the electronic component in contact with the solder cream, the electronic component is temporarily fixed to the board with adhesive and passed through a heating furnace. The solder cream is melted and soldered to electronic components.
従来、このような表面実装型電子部品をプリント基板に
半田付けする際、上記電子部品の接続端子がフントプリ
ントよりも半田の濡れ性が良いので、電子部品の接続端
子を半田クリームに接触させた状態で加熱炉内を通過さ
せると、接続端子に溶融半田が吸い上げられる現象が生
じ、フットプリント上に半田が無くなり、半田付けが充
分できない問題がある。Conventionally, when soldering such surface-mounted electronic components to a printed circuit board, the connection terminals of the electronic components were brought into contact with solder cream because the solder wettability of the connection terminals of the electronic components was better than that of Hundprint. If the device is passed through a heating furnace in this condition, a phenomenon occurs in which molten solder is sucked up to the connection terminal, and there is a problem in that there is no solder on the footprint, and sufficient soldering cannot be performed.
そのため、従来の方法として第２図（ａｌに示すように
、プリント基板１のフットプリント２上に半田クリーム
３を塗布した後、該基板をコンベアベルト４上に載せ、
赤外線ランプ５から発生する熱をファン６で送風する赤
外線の加熱炉７内を通過させて半田クリームを溶融する
。Therefore, as shown in FIG. 2 (al), the conventional method is to apply solder cream 3 onto the footprint 2 of the printed circuit board 1, and then place the board on the conveyor belt 4.
Heat generated from an infrared lamp 5 is passed through an infrared heating furnace 7 blown by a fan 6 to melt the solder cream.
或いは沸点が２１５℃のフロリナート（商品名；住友ス
ＩＪ−Ｍ社製）の蒸気の雰囲気内の加熱炉内を通過させ
て前記半田クリームを溶融する。Alternatively, the solder cream is melted by passing through a heating furnace in an atmosphere of Fluorinert (trade name; manufactured by Sumitomo IJ-M) steam having a boiling point of 215°C.
次いで第２図（ｂ）に示すように、加熱炉内を通過して
該溶融半田が固化して形或された半田層８上を、プレス
９にて加圧して上記半田層を平坦化し、該半田層上に搭
載される電子部品の接続端子が位置ずれしないようにし
て予備半田層を形成している。Next, as shown in FIG. 2(b), the molten solder passed through a heating furnace and solidified, and the formed solder layer 8 was pressurized with a press 9 to flatten the solder layer. The preliminary solder layer is formed in such a way that connection terminals of electronic components mounted on the solder layer are not displaced.
然し、上記した予備半田層は、一枚のプリント基板上に
一辺が０．６ ｍの方形の断面積を有して２５６個程度
形成されており、このような予備半田層を平坦化するに
は、常温で約１トンの荷重のプレスで加圧する必要があ
り、そのためプリント基板に歪が発生する。However, about 256 of the above-mentioned preliminary solder layers are formed on one printed circuit board, each having a rectangular cross-sectional area of 0.6 m on a side, and it is difficult to planarize such preliminary solder layers. It is necessary to apply pressure with a press with a load of about 1 ton at room temperature, which causes distortion in the printed circuit board.
また溶融した半田を有するプリント基板を室温まで放置
した後、溶融して固化した予備半田層をプレスで加圧す
る工程が必要となり、余分な工数が掛かる問題がある。Furthermore, after the printed circuit board containing the molten solder is left to reach room temperature, it is necessary to press the molten and solidified preliminary solder layer with a press, which poses the problem of requiring extra man-hours.
本発明は上記した問題点を除去し、上記した予備半田層
をプレスで加工する余分な工程を必要とせずに、プリン
ト基板に予備半田層が形成できる半田付け方法を目的と
する。The object of the present invention is to provide a soldering method that eliminates the above-mentioned problems and can form a preliminary solder layer on a printed circuit board without requiring the extra step of processing the preliminary solder layer with a press.
上記目的を達或する本発明の方法は、第１図（ａ）に示
すように、プリント基＃ｉ！１に設けたフットプリント
２に半田クリーム３を塗布した後、該基板を加熱炉７内
を通過させて前記半田クリーム３を溶融させて該フット
プリント２上に予備半田層を形或する工程を有する半田
付け方法に於いて、前記基板を加熱炉内に通過させる際
に、前記基板上に半田が被着しない平板状部材１１を設
置して前記溶融した半田を平坦化することにある。As shown in FIG. 1(a), the method of the present invention achieves the above object, as shown in FIG. After applying solder cream 3 to the footprint 2 provided in step 1, the substrate is passed through a heating furnace 7 to melt the solder cream 3 and form a preliminary solder layer on the footprint 2. In this soldering method, when the substrate is passed through a heating furnace, a flat member 11 to which solder does not adhere is installed on the substrate to flatten the molten solder.
半田クリーム３をフットプリント２に塗布したプリント
基板ｌを加熱炉７内を通過させる時点で、該半田クリー
ムを塗布した基板上に半田と濡れ性の悪いチタン（Ｔｉ
）等の金属で形成された平板状部材１１を設置した状態
で加熱炉内を通過させると、溶融した半田が平坦な状態
で固化する。この平板状部材は一辺が３３報程度で厚さ
が１．５ｕ程度で、この部材による加圧力は前記半田が
溶融しているので、数グラム程度で済み、簡単な方法で
余分なプレス工程を必要としないで容易に塗布された半
田の表面が平坦に仕上げられる。When the printed circuit board l whose footprint 2 is coated with solder cream 3 is passed through the heating furnace 7, titanium (Ti), which has poor wettability with solder, is placed on the board coated with the solder cream.
) When the flat member 11 made of a metal such as ) is passed through a heating furnace, the molten solder solidifies in a flat state. This flat plate-like member has a side of about 33 mm and a thickness of about 1.5 u, and since the solder is melted, the pressing force applied by this member is only about a few grams. The surface of the applied solder can be easily finished flat without the need for it.
以下、図面を用いて本発明の一実施例につき詳細に説明
する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図（ａ）および第１図山》は本発明の方法の説明図
で、図示するようにプリント基板ｌに設けたフットプリ
ント２上に半田クリーム３を塗布した後、該基板を赤外
線加熱炉７内を通過させる際に、該半田クリーム上に平
板状部材１１を設置する。FIG. 1(a) and FIG. When passing through the furnace 7, a flat member 11 is placed on top of the solder cream.
この平板状部材は一辺が３３１１で厚さが１．５ ｔａ
で半田が被着しないＴｉで形成され、この平板状部材を
プリント基板上に設置した状態で赤外線加熱炉内を通過
させる。This flat plate member has a side of 3311 mm and a thickness of 1.5 ta.
This flat plate member is made of Ti to which solder does not adhere, and is passed through an infrared heating furnace while being placed on a printed circuit board.
このようにすると、第１図（ｂ）に示すように半田クリ
ーム３が溶融しているので僅かな加圧力で容易に溶融し
た半田クリームの表面が平坦になり、溶融した半田クリ
ームが固化した後、プレスで加圧するような余分な工程
を必要としないでプリント基板上に予備半田層が形成さ
れる。By doing this, as shown in Figure 1(b), since the solder cream 3 is molten, the surface of the molten solder cream can be easily flattened by a slight pressure, and after the molten solder cream has solidified. , a preliminary solder layer is formed on the printed circuit board without the need for extra steps such as pressurization.
なお、本実施例では錘となる平板状部材にＴｉの金属部
材を用いたが、平板状部材を半田が被着されないセラミ
ックを用いて形成しても良い。In this embodiment, a Ti metal member is used for the flat plate-shaped member serving as the weight, but the flat plate-shaped member may be formed of ceramic to which no solder is applied.
以上の説明から明らかなように本発明によれば、簡単な
方法で余分な工程を必要とせずに予備半田層の表面を平
坦に仕上げることが可能であり、半田付けの工数が低下
する効果がある。As is clear from the above description, according to the present invention, it is possible to flatten the surface of the preliminary solder layer by a simple method without requiring any extra steps, and it has the effect of reducing the number of soldering steps. be.
第ｌ図ｆａｔおよび第１図（ｂｌは本発明の方法の説明
図、
第２図（ａ）および第２図（ｂ）は従来の方法の説明図
である。
図において、
ｌはプリント基板、２はフットプリント、３は半田クリ
ーム、
７
は加熱炉、
１ｌは平板状部材を示
す。
（Ｑ）
ノト号各Ｏ月錦方）ゑ／Ｉ竃ｔ日Ｅ氏ゴ第
１
図
（Ｑ）
（ｂ》
従未の方５ｉｚイ？Ｉ明間
第２図
４つ〉Ａ′７べ゜ルトFigures 1 and 1 (bl are explanatory diagrams of the method of the present invention, and Figures 2 (a) and 2 (b) are explanatory diagrams of the conventional method. In the figures, l is a printed circuit board, 2 is the footprint, 3 is the solder cream, 7 is the heating furnace, and 1l is the flat plate member. b》 Non-conformist 5iz I?I Akima Figure 2 4〉A'7 Belt
Claims (1)
田クリーム（３）を塗布した後、該基板を加熱炉（７）
内を通過させて前記半田クリームを溶融させて該フット
プリント上に予備半田層を形成する工程を有する半田付
け方法に於いて、 前記基板を加熱炉内に通過させる際に、前記基板上に半
田が被着しない平板状部材（１１）を設置して前記溶融
した半田を平坦化することを特徴とするプリント基板へ
の電子部品の半田付け方法。[Claims] After applying solder cream (3) to the footprint (2) provided on the printed circuit board (1), the board is placed in a heating furnace (7).
In a soldering method comprising the step of melting the solder cream by passing the solder cream through a heating furnace and forming a preliminary solder layer on the footprint, when the board is passed through a heating furnace, the solder cream is melted on the substrate. A method of soldering electronic components to a printed circuit board, characterized in that the molten solder is flattened by installing a flat member (11) to which no solder adheres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189826A JPH0353597A (en) | 1989-07-20 | 1989-07-20 | Soldering of electronic component to printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189826A JPH0353597A (en) | 1989-07-20 | 1989-07-20 | Soldering of electronic component to printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353597A true JPH0353597A (en) | 1991-03-07 |
Family
ID=16247858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1189826A Pending JPH0353597A (en) | 1989-07-20 | 1989-07-20 | Soldering of electronic component to printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0681416A3 (en) * | 1994-05-06 | 1996-07-03 | Seiko Epson Corp | Printed circuit board and method of connecting electronic parts. |
-
1989
- 1989-07-20 JP JP1189826A patent/JPH0353597A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0681416A3 (en) * | 1994-05-06 | 1996-07-03 | Seiko Epson Corp | Printed circuit board and method of connecting electronic parts. |
| US5943217A (en) * | 1994-05-06 | 1999-08-24 | Seiko Epson Corporation | Printed circuit board for mounting at least one electronic part |
| US6201193B1 (en) | 1994-05-06 | 2001-03-13 | Seiko Epson Corporation | Printed circuit board having a positioning marks for mounting at least one electronic part |
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