JPH0353597A - Soldering of electronic component to printed board - Google Patents

Soldering of electronic component to printed board

Info

Publication number
JPH0353597A
JPH0353597A JP18982689A JP18982689A JPH0353597A JP H0353597 A JPH0353597 A JP H0353597A JP 18982689 A JP18982689 A JP 18982689A JP 18982689 A JP18982689 A JP 18982689A JP H0353597 A JPH0353597 A JP H0353597A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
solder
board
cream
plate
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18982689A
Inventor
Takeshi KOMIYAMA
Kenji Koyae
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To make the surface of a spare solder layer flat by a method wherein a plate-like member to which solder does not adhere is placed on a board while the board is made to pass through a heating oven.
CONSTITUTION: After a solder cream is applied onto a foot print 2 provided onto a printed board 1, a plate-like member 11 is installed on the solder cream 3 concerned. The plate-like member 11 is formed of Ti to which solder does not adhere, and the printed board 1 is made to pass through an infrared heating over 7 as the plate-like member 11 is placed on the board 1. By this setup, as the solder cream 3 is molten, the surface of the molten solder can be easily made flat with a very low pressure, and a spare solder layer is formed on the printed board without an additional process in which a pressure is given by a press after the molten solder cream is solidified.
COPYRIGHT: (C)1991,JPO&Japio
JP18982689A 1989-07-20 1989-07-20 Soldering of electronic component to printed board Pending JPH0353597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18982689A JPH0353597A (en) 1989-07-20 1989-07-20 Soldering of electronic component to printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18982689A JPH0353597A (en) 1989-07-20 1989-07-20 Soldering of electronic component to printed board

Publications (1)

Publication Number Publication Date
JPH0353597A true true JPH0353597A (en) 1991-03-07

Family

ID=16247858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18982689A Pending JPH0353597A (en) 1989-07-20 1989-07-20 Soldering of electronic component to printed board

Country Status (1)

Country Link
JP (1) JPH0353597A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0681416A3 (en) * 1994-05-06 1996-07-03 Seiko Epson Corp Printed circuit board and method of connecting electronic parts.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0681416A3 (en) * 1994-05-06 1996-07-03 Seiko Epson Corp Printed circuit board and method of connecting electronic parts.
US5943217A (en) * 1994-05-06 1999-08-24 Seiko Epson Corporation Printed circuit board for mounting at least one electronic part
US6201193B1 (en) 1994-05-06 2001-03-13 Seiko Epson Corporation Printed circuit board having a positioning marks for mounting at least one electronic part

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