JPH0352761A - Method for testing solderability of soldering material - Google Patents
Method for testing solderability of soldering materialInfo
- Publication number
- JPH0352761A JPH0352761A JP1187824A JP18782489A JPH0352761A JP H0352761 A JPH0352761 A JP H0352761A JP 1187824 A JP1187824 A JP 1187824A JP 18782489 A JP18782489 A JP 18782489A JP H0352761 A JPH0352761 A JP H0352761A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solderability
- mask
- cream solder
- spacings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 6
- 238000012360 testing method Methods 0.000 title claims description 5
- 238000005476 soldering Methods 0.000 title abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000006071 cream Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半田付等が行われている回路装置に用いる半
田材料の半田付性試験法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for testing the solderability of solder materials used in circuit devices to which soldering and the like are being performed.
従来の技術
従来の試験法について第３図，第４図を用いて説明する
。図において５が基板、６が電極、７がクリーム半田、
８が半田である。まず、第３図の様に、ある決められた
大きさの窓のマスクを用いて、クリーム半田７を電極６
上に印刷し、その後決められた熱量を一定時間加えてク
リーム半田７を溶融させる。そして、第４図の様に硬化
した半田８の大きさをａとｂの積の値によって、半田材
料の半田付性を調べる方法である。BACKGROUND ART A conventional test method will be explained using FIGS. 3 and 4. In the figure, 5 is the board, 6 is the electrode, 7 is cream solder,
8 is solder. First, as shown in Figure 3, using a mask with a window of a certain size, cream solder 7 is applied to the electrode 6.
The cream solder 7 is printed on top, and then a predetermined amount of heat is applied for a certain period of time to melt the cream solder 7. Then, as shown in FIG. 4, the solderability of the solder material is examined by determining the size of the hardened solder 8 by the product of a and b.
発明が解決しようとする課題
このような、半田材料の半田付性の測定方法では、第４
図のａとｂの積によって求めなくてはならなく、半田材
料の半田付性の優劣を一目で判別することができない。Problems to be Solved by the Invention In this method for measuring the solderability of solder materials, the fourth
It must be determined by the product of a and b in the figure, and it is not possible to determine at a glance whether the solderability of the solder material is superior or inferior.
本発明は、このような半田材料の半田付性の優劣を一目
で判別できるようにすることを目的とする。An object of the present invention is to enable the superiority or inferiority of solderability of such solder materials to be determined at a glance.
課題を解決するための手段
この課題を解決するために本発明は、クリーム半田を塗
布するパターン窓の間隔を段階的に広げたマスクを用い
て、基板の電極上にクリーム半田を印刷し、その後決め
られた熱量を一定時間加えてクリーム半田を溶融させ、
そして、マスクのパターン窓のどの間隔で半田が接着し
ているか調べることによって、半田材料の半田付性の優
劣を判別する方法である。Means for Solving the Problem In order to solve this problem, the present invention prints cream solder on the electrodes of the substrate using a mask in which the interval between pattern windows for applying cream solder is gradually increased, and then Melt the cream solder by applying a determined amount of heat for a certain period of time,
This method determines the solderability of the solder material by checking at what intervals in the pattern windows of the mask the solder adheres.
作用
この方法により、マスクのパターン窓の間隔が大きけれ
ば半田付性が良く、マスクのパターン窓の間隔が小さけ
れば半田付性が悪いと言う比較が一目で判別できるよう
になり、従来の測定時間をカットすることができ、時間
短縮することができる。また、従来使用してきた測定器
具を必要とせず、経費を節減することができる。Effect This method makes it possible to determine at a glance that the larger the interval between the mask pattern windows is, the better the solderability is, and the smaller the interval between the mask pattern windows is, the worse the solderability. can be cut and time can be shortened. Furthermore, conventional measuring instruments are not required, which can save costs.
実施例
第１図，第２図は本発明の一実施例による試験法を示す
図である。１は基板であり、２は電極、３はクリーム半
田、４は半田である。Embodiment FIGS. 1 and 2 are diagrams showing a test method according to an embodiment of the present invention. 1 is a substrate, 2 is an electrode, 3 is cream solder, and 4 is solder.
まず、第１図の様に、パターン窓の間隔を段階的に広げ
たマスクを用いて、クリーム半田３を電極２上に印刷す
る。この時、マスクのパターン窓の間隔の小さい方から
ランクＡ−Ｂ−Ｃとする。First, as shown in FIG. 1, cream solder 3 is printed on the electrodes 2 using a mask in which the interval between pattern windows is gradually widened. At this time, the ranks A, B, and C are given in descending order of the distance between the pattern windows of the mask.
そして第１図の状態にある決められた熱量を一定時間加
え、クリーム半田３を溶融させて第２図の状態にする。Then, a predetermined amount of heat is applied for a certain period of time in the state shown in FIG. 1 to melt the cream solder 3 and bring it into the state shown in FIG.
ここで、第２図のランクＡ−Ｂは半田が接着されている
が、ランクＣは、半田が接着されていなく、これにより
半田材料の半田付性を一目で判別することができる。Here, in the rank A-B of FIG. 2, solder is bonded, but in rank C, the solder is not bonded, so that the solderability of the solder material can be determined at a glance.
発明の効果
以上のように本発明によれば、クリーム半田をパターン
窓の間隔を段階的に広げたマスクを用いて、クリーム半
田を形威しある決められた熱量を一定時間加えることに
よって、半田が接着しているかどうかをマスクのパター
ン窓の間隔によって一目で判別することができる。また
、これによって、従来の測定時間を短縮することができ
る。Effects of the Invention As described above, according to the present invention, the cream solder can be soldered by applying a certain amount of heat for a certain period of time to shape the cream solder using a mask in which the interval between the pattern windows is gradually widened. It is possible to determine at a glance whether or not the mask is adhered by looking at the spacing between the pattern windows on the mask. Moreover, this allows the conventional measurement time to be shortened.
第１図，第２図は本発明の実施例による半田付性試験法
を示す説明図、第３図，第４図は従来の試験法を示す説
明構造図である。
１・・・・・・基板、２・・・・・・電極、３・・・・
・・クリーム半田、４・・・・・・半田。FIGS. 1 and 2 are explanatory diagrams showing a solderability testing method according to an embodiment of the present invention, and FIGS. 3 and 4 are explanatory structural diagrams showing a conventional testing method. 1...Substrate, 2...Electrode, 3...
...Cream solder, 4...Solder.
Claims (1)
げたマスクを用いて基板上に付着させ、その後クリーム
半田を溶融させることを特徴とする半田材料の半田付性
試験法。A method for testing the solderability of solder materials, which is characterized in that cream solder is applied onto a substrate using a mask in which the interval between pattern windows is gradually widened, and then the cream solder is melted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1187824A JPH0352761A (en) | 1989-07-20 | 1989-07-20 | Method for testing solderability of soldering material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1187824A JPH0352761A (en) | 1989-07-20 | 1989-07-20 | Method for testing solderability of soldering material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0352761A true JPH0352761A (en) | 1991-03-06 |
Family
ID=16212881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1187824A Pending JPH0352761A (en) | 1989-07-20 | 1989-07-20 | Method for testing solderability of soldering material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0352761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779774A1 (en) * | 1995-12-13 | 1997-06-18 | Nokia Mobile Phones Ltd. | Method for monitoring solder paste printing process |
-
1989
- 1989-07-20 JP JP1187824A patent/JPH0352761A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779774A1 (en) * | 1995-12-13 | 1997-06-18 | Nokia Mobile Phones Ltd. | Method for monitoring solder paste printing process |
| US6342266B1 (en) | 1995-12-13 | 2002-01-29 | Nokia Mobile Phones Limited | Method for monitoring solder paste printing process |
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