JPH0352181U - - Google Patents

Info

Publication number

JPH0352181U

JPH0352181U JP11326089U JP11326089U JPH0352181U JP H0352181 U JPH0352181 U JP H0352181U JP 11326089 U JP11326089 U JP 11326089U JP 11326089 U JP11326089 U JP 11326089U JP H0352181 U JPH0352181 U JP H0352181U

Authority

JP

Japan

Prior art keywords

module

card

insulating substrate

chip

electrodes

Prior art date

1989-09-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 5
• 238000007789 sealing Methods 0.000 claims description 3
• 239000002184 metal Substances 0.000 claims description 2
• 238000000465 moulding Methods 0.000 claims description 2
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 4
• 238000000034 method Methods 0.000 description 1