JPH0352119U - - Google Patents

Info

Publication number
JPH0352119U
JPH0352119U JP11486089U JP11486089U JPH0352119U JP H0352119 U JPH0352119 U JP H0352119U JP 11486089 U JP11486089 U JP 11486089U JP 11486089 U JP11486089 U JP 11486089U JP H0352119 U JPH0352119 U JP H0352119U
Authority
JP
Japan
Prior art keywords
resin molding
molding device
pot
plunger
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11486089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0739615Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11486089U priority Critical patent/JPH0739615Y2/ja
Publication of JPH0352119U publication Critical patent/JPH0352119U/ja
Application granted granted Critical
Publication of JPH0739615Y2 publication Critical patent/JPH0739615Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP11486089U 1989-09-29 1989-09-29 樹脂モールド装置 Expired - Lifetime JPH0739615Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11486089U JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11486089U JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Publications (2)

Publication Number Publication Date
JPH0352119U true JPH0352119U (US20070244113A1-20071018-C00087.png) 1991-05-21
JPH0739615Y2 JPH0739615Y2 (ja) 1995-09-13

Family

ID=31663208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11486089U Expired - Lifetime JPH0739615Y2 (ja) 1989-09-29 1989-09-29 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JPH0739615Y2 (US20070244113A1-20071018-C00087.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005263657A (ja) * 2004-03-17 2005-09-29 Tokuhon Corp 貼付剤用両面離型フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005263657A (ja) * 2004-03-17 2005-09-29 Tokuhon Corp 貼付剤用両面離型フィルム
JP4607478B2 (ja) * 2004-03-17 2011-01-05 株式会社トクホン 貼付剤用両面離型フィルム

Also Published As

Publication number Publication date
JPH0739615Y2 (ja) 1995-09-13

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