JPH0351869U - - Google Patents
Info
- Publication number
- JPH0351869U JPH0351869U JP11389989U JP11389989U JPH0351869U JP H0351869 U JPH0351869 U JP H0351869U JP 11389989 U JP11389989 U JP 11389989U JP 11389989 U JP11389989 U JP 11389989U JP H0351869 U JPH0351869 U JP H0351869U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- wire
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11389989U JPH0351869U (pt) | 1989-09-28 | 1989-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11389989U JPH0351869U (pt) | 1989-09-28 | 1989-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351869U true JPH0351869U (pt) | 1991-05-20 |
Family
ID=31662294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11389989U Pending JPH0351869U (pt) | 1989-09-28 | 1989-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351869U (pt) |
-
1989
- 1989-09-28 JP JP11389989U patent/JPH0351869U/ja active Pending