JPH0350369U - - Google Patents
Info
- Publication number
- JPH0350369U JPH0350369U JP11064489U JP11064489U JPH0350369U JP H0350369 U JPH0350369 U JP H0350369U JP 11064489 U JP11064489 U JP 11064489U JP 11064489 U JP11064489 U JP 11064489U JP H0350369 U JPH0350369 U JP H0350369U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pad
- protrusion
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11064489U JPH0350369U (lv) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11064489U JPH0350369U (lv) | 1989-09-20 | 1989-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0350369U true JPH0350369U (lv) | 1991-05-16 |
Family
ID=31659169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11064489U Pending JPH0350369U (lv) | 1989-09-20 | 1989-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0350369U (lv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160001491A (ko) * | 2014-06-27 | 2016-01-06 | (주) 엠투다이아몬드 | 장신구의 보석결착구조 |
-
1989
- 1989-09-20 JP JP11064489U patent/JPH0350369U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160001491A (ko) * | 2014-06-27 | 2016-01-06 | (주) 엠투다이아몬드 | 장신구의 보석결착구조 |