JPH0350368U - - Google Patents

Info

Publication number
JPH0350368U
JPH0350368U JP11008089U JP11008089U JPH0350368U JP H0350368 U JPH0350368 U JP H0350368U JP 11008089 U JP11008089 U JP 11008089U JP 11008089 U JP11008089 U JP 11008089U JP H0350368 U JPH0350368 U JP H0350368U
Authority
JP
Japan
Prior art keywords
chip type
type component
pads
wiring board
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11008089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11008089U priority Critical patent/JPH0350368U/ja
Publication of JPH0350368U publication Critical patent/JPH0350368U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例の平面図、第2図は従
来例の図で、aは平面図、bは側断面図である。 図において、1……印刷配線板、2……チツプ
型部品、3A,3B……電極、5A,5B,10
A,10B……パツド、6A,6B……パターン
、11A,11B,12A,12B……予備パツ
ドをそれぞれ示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 チツプ型部品2を表面実装する印刷配線板にお
    いて、 該チツプ型部品2の電極3A,3Bを初回に半
    田付けする一対のパツド10A,10Bと、複数
    対の予備パツド11A,11B,12A,12B
    とを設け、 該チツプ型部品2を交換半田付けする毎に、順
    次他の未使用の予備パツドを用いるようにしたこ
    とを特徴とする印刷配線板。
JP11008089U 1989-09-20 1989-09-20 Pending JPH0350368U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11008089U JPH0350368U (ja) 1989-09-20 1989-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11008089U JPH0350368U (ja) 1989-09-20 1989-09-20

Publications (1)

Publication Number Publication Date
JPH0350368U true JPH0350368U (ja) 1991-05-16

Family

ID=31658633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11008089U Pending JPH0350368U (ja) 1989-09-20 1989-09-20

Country Status (1)

Country Link
JP (1) JPH0350368U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8263875B2 (en) 2006-09-15 2012-09-11 Kabushiki Kaisha Toyota Jidoshokki Surface mounting structure for a surface mounting electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8263875B2 (en) 2006-09-15 2012-09-11 Kabushiki Kaisha Toyota Jidoshokki Surface mounting structure for a surface mounting electronic component

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