JPH0350338U - - Google Patents
Info
- Publication number
- JPH0350338U JPH0350338U JP1989110098U JP11009889U JPH0350338U JP H0350338 U JPH0350338 U JP H0350338U JP 1989110098 U JP1989110098 U JP 1989110098U JP 11009889 U JP11009889 U JP 11009889U JP H0350338 U JPH0350338 U JP H0350338U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- mounted semiconductor
- view
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989110098U JPH0350338U (US20110232667A1-20110929-C00004.png) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989110098U JPH0350338U (US20110232667A1-20110929-C00004.png) | 1989-09-20 | 1989-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0350338U true JPH0350338U (US20110232667A1-20110929-C00004.png) | 1991-05-16 |
Family
ID=31658650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989110098U Pending JPH0350338U (US20110232667A1-20110929-C00004.png) | 1989-09-20 | 1989-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0350338U (US20110232667A1-20110929-C00004.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163409A (ja) * | 1997-12-01 | 1999-06-18 | Matsushita Electron Corp | 発光装置 |
JP2004014857A (ja) * | 2002-06-07 | 2004-01-15 | Stanley Electric Co Ltd | チップタイプ光半導体素子 |
JP2016015356A (ja) * | 2014-06-30 | 2016-01-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2016086047A (ja) * | 2014-10-24 | 2016-05-19 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134040A (ja) * | 1984-12-04 | 1986-06-21 | Fuji Dengiyou Kk | 半導体素子の製法 |
-
1989
- 1989-09-20 JP JP1989110098U patent/JPH0350338U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134040A (ja) * | 1984-12-04 | 1986-06-21 | Fuji Dengiyou Kk | 半導体素子の製法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163409A (ja) * | 1997-12-01 | 1999-06-18 | Matsushita Electron Corp | 発光装置 |
JP2004014857A (ja) * | 2002-06-07 | 2004-01-15 | Stanley Electric Co Ltd | チップタイプ光半導体素子 |
JP2016015356A (ja) * | 2014-06-30 | 2016-01-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2016086047A (ja) * | 2014-10-24 | 2016-05-19 | 日亜化学工業株式会社 | 発光装置の製造方法 |