JPH0348268U - - Google Patents
Info
- Publication number
- JPH0348268U JPH0348268U JP10849389U JP10849389U JPH0348268U JP H0348268 U JPH0348268 U JP H0348268U JP 10849389 U JP10849389 U JP 10849389U JP 10849389 U JP10849389 U JP 10849389U JP H0348268 U JPH0348268 U JP H0348268U
- Authority
- JP
- Japan
- Prior art keywords
- board
- flexible
- conductive layer
- printed wiring
- rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10849389U JPH0348268U (fi) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10849389U JPH0348268U (fi) | 1989-09-16 | 1989-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348268U true JPH0348268U (fi) | 1991-05-08 |
Family
ID=31657132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10849389U Pending JPH0348268U (fi) | 1989-09-16 | 1989-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348268U (fi) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013164887A (ja) * | 2012-02-10 | 2013-08-22 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
| WO2018193664A1 (ja) | 2017-04-18 | 2018-10-25 | 東京エレクトロン株式会社 | 成膜装置及びそのクリーニング方法 |
-
1989
- 1989-09-16 JP JP10849389U patent/JPH0348268U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013164887A (ja) * | 2012-02-10 | 2013-08-22 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
| WO2018193664A1 (ja) | 2017-04-18 | 2018-10-25 | 東京エレクトロン株式会社 | 成膜装置及びそのクリーニング方法 |