JPH0348259U - - Google Patents

Info

Publication number
JPH0348259U
JPH0348259U JP10869989U JP10869989U JPH0348259U JP H0348259 U JPH0348259 U JP H0348259U JP 10869989 U JP10869989 U JP 10869989U JP 10869989 U JP10869989 U JP 10869989U JP H0348259 U JPH0348259 U JP H0348259U
Authority
JP
Japan
Prior art keywords
ceramic
snap line
substrate
lattice
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10869989U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10869989U priority Critical patent/JPH0348259U/ja
Publication of JPH0348259U publication Critical patent/JPH0348259U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP10869989U 1989-09-18 1989-09-18 Pending JPH0348259U (US07202987-20070410-C00007.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10869989U JPH0348259U (US07202987-20070410-C00007.png) 1989-09-18 1989-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10869989U JPH0348259U (US07202987-20070410-C00007.png) 1989-09-18 1989-09-18

Publications (1)

Publication Number Publication Date
JPH0348259U true JPH0348259U (US07202987-20070410-C00007.png) 1991-05-08

Family

ID=31657323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10869989U Pending JPH0348259U (US07202987-20070410-C00007.png) 1989-09-18 1989-09-18

Country Status (1)

Country Link
JP (1) JPH0348259U (US07202987-20070410-C00007.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014200896A (ja) * 2013-04-08 2014-10-27 三菱マテリアル株式会社 分割体の製造方法及び製造装置
JP2014204031A (ja) * 2013-04-08 2014-10-27 三菱マテリアル株式会社 パワーモジュール製造用セラミックス原板及びパワーモジュール製造用積層基板
JPWO2022131337A1 (US07202987-20070410-C00007.png) * 2020-12-17 2022-06-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014200896A (ja) * 2013-04-08 2014-10-27 三菱マテリアル株式会社 分割体の製造方法及び製造装置
JP2014204031A (ja) * 2013-04-08 2014-10-27 三菱マテリアル株式会社 パワーモジュール製造用セラミックス原板及びパワーモジュール製造用積層基板
JPWO2022131337A1 (US07202987-20070410-C00007.png) * 2020-12-17 2022-06-23
WO2022131337A1 (ja) * 2020-12-17 2022-06-23 デンカ株式会社 セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

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