JPH0348254U - - Google Patents
Info
- Publication number
- JPH0348254U JPH0348254U JP10846789U JP10846789U JPH0348254U JP H0348254 U JPH0348254 U JP H0348254U JP 10846789 U JP10846789 U JP 10846789U JP 10846789 U JP10846789 U JP 10846789U JP H0348254 U JPH0348254 U JP H0348254U
- Authority
- JP
- Japan
- Prior art keywords
- lens
- light emitting
- emitting diode
- molded
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10846789U JPH0348254U (US06262066-20010717-C00424.png) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10846789U JPH0348254U (US06262066-20010717-C00424.png) | 1989-09-16 | 1989-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348254U true JPH0348254U (US06262066-20010717-C00424.png) | 1991-05-08 |
Family
ID=31657108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10846789U Pending JPH0348254U (US06262066-20010717-C00424.png) | 1989-09-16 | 1989-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348254U (US06262066-20010717-C00424.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027822A (ja) * | 2001-07-16 | 2003-01-29 | Misawa Homes Co Ltd | 窓サッシのレール構造および窓サッシの再生方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5270766A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor device |
| JPS60208715A (ja) * | 1984-04-02 | 1985-10-21 | Nec Corp | 光半導体装置 |
-
1989
- 1989-09-16 JP JP10846789U patent/JPH0348254U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5270766A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor device |
| JPS60208715A (ja) * | 1984-04-02 | 1985-10-21 | Nec Corp | 光半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027822A (ja) * | 2001-07-16 | 2003-01-29 | Misawa Homes Co Ltd | 窓サッシのレール構造および窓サッシの再生方法 |
