JPH0348228U - - Google Patents

Info

Publication number
JPH0348228U
JPH0348228U JP10955089U JP10955089U JPH0348228U JP H0348228 U JPH0348228 U JP H0348228U JP 10955089 U JP10955089 U JP 10955089U JP 10955089 U JP10955089 U JP 10955089U JP H0348228 U JPH0348228 U JP H0348228U
Authority
JP
Japan
Prior art keywords
mold
pot
resin encapsulation
semiconductor device
plunger head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10955089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10955089U priority Critical patent/JPH0348228U/ja
Publication of JPH0348228U publication Critical patent/JPH0348228U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10955089U 1989-09-19 1989-09-19 Pending JPH0348228U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10955089U JPH0348228U (enrdf_load_stackoverflow) 1989-09-19 1989-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10955089U JPH0348228U (enrdf_load_stackoverflow) 1989-09-19 1989-09-19

Publications (1)

Publication Number Publication Date
JPH0348228U true JPH0348228U (enrdf_load_stackoverflow) 1991-05-08

Family

ID=31658137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10955089U Pending JPH0348228U (enrdf_load_stackoverflow) 1989-09-19 1989-09-19

Country Status (1)

Country Link
JP (1) JPH0348228U (enrdf_load_stackoverflow)

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