JPH0347756U - - Google Patents
Info
- Publication number
- JPH0347756U JPH0347756U JP10755389U JP10755389U JPH0347756U JP H0347756 U JPH0347756 U JP H0347756U JP 10755389 U JP10755389 U JP 10755389U JP 10755389 U JP10755389 U JP 10755389U JP H0347756 U JPH0347756 U JP H0347756U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- carrier
- measuring
- double
- master
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
第１図は本考案に係る両頭研削盤の計測装置の
一実施例を適用した両頭研削盤の平面図、第２図
はその右側面図、第３図は計測装置の拡大平面図
である。
２Ｒ，２Ｌ……砥石（円板砥石）、３……キヤ
リア円板（キヤリア）、５……ワーク、１０……
計測装置（計測手段）、１２……測定子、２０…
…マスター。
FIG. 1 is a plan view of a double-head grinder to which an embodiment of the measuring device for a double-head grinder according to the present invention is applied, FIG. 2 is a right side view thereof, and FIG. 3 is an enlarged plan view of the measuring device. 2R, 2L...Whetstone (disc grindstone), 3...Carrier disc (carrier), 5...Work, 10...
Measuring device (measuring means), 12... Measuring head, 20...
...Master.
Claims (1)
れたワークを供給して該ワークの両面を同時に研
削する両頭研削盤であつて、キヤリアの両側に配
置された計測手段でワークの厚さを計測すると共
に該計測手段による計測結果に基づいて砥石位置
を制御するものに於て、 前記キヤリアの外方に前記ワークのマスターを
配置すると共に、前記計測手段を、その計測子が
前記マスターと対応する位置に移動可能に構成し
たこと、を特徴とする両頭研削盤の計測装置。[Scope of Claim for Utility Model Registration] A double-headed grinding machine that feeds a workpiece held by a carrier between opposing disc grinding wheels and grinds both sides of the workpiece at the same time; In a device that measures the thickness of a workpiece using a means and controls the grinding wheel position based on the measurement result by the measuring means, the master of the workpiece is disposed outside the carrier, and the measuring means is placed outside the carrier. A measuring device for a double-headed grinding machine, characterized in that a measuring element is configured to be movable to a position corresponding to the master.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10755389U JPH0347756U (en) | 1989-09-13 | 1989-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10755389U JPH0347756U (en) | 1989-09-13 | 1989-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0347756U true JPH0347756U (en) | 1991-05-07 |
Family
ID=31656242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10755389U Pending JPH0347756U (en) | 1989-09-13 | 1989-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0347756U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112890A (en) * | 1976-03-15 | 1977-09-21 | Tokyo Seimitsu Co Ltd | Measuring method and controlling method for use in twoohead plane surface grinding machine |
| JPS5444871U (en) * | 1977-08-29 | 1979-03-28 | ||
| JPS6253945B2 (en) * | 1986-05-15 | 1987-11-12 | Sony Corp |
-
1989
- 1989-09-13 JP JP10755389U patent/JPH0347756U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112890A (en) * | 1976-03-15 | 1977-09-21 | Tokyo Seimitsu Co Ltd | Measuring method and controlling method for use in twoohead plane surface grinding machine |
| JPS5444871U (en) * | 1977-08-29 | 1979-03-28 | ||
| JPS6253945B2 (en) * | 1986-05-15 | 1987-11-12 | Sony Corp |