JPH0347731Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) This invention relates to an optical soldering device for IC lead wires, etc., and its purpose is to protrude a large number of IC lead wires from the periphery of the IC flat package without heating the body. To provide an optical soldering device for IC lead wires, etc., which can instantaneously solder lead wires to a printed circuit board at the same time, and which can simultaneously heat a plurality of surrounding areas without heating the central part.

(Prior Art and its Problems) Conventionally, as shown in FIG. 3, a soldering iron c has been used to attach an IC bracket package a to a printed circuit board b.

However, the IC bracket package a
A large number of lead wires d protrude from the main body around the four circumferences, and each lead image d must be accurately soldered to a predetermined position on the printed circuit board b, resulting in the following problem.

That is, in the soldering operation using the soldering iron c, it was not possible to simultaneously heat a large number of lead wires d protruding in all directions, resulting in poor work efficiency.

Further, since the soldering iron c was in contact with the lead wire d during the work, the lead wire d was deviated from the proper position on the printed circuit board b, making it difficult to perform precise soldering work.

On the other hand, those that use light energy are
In the "Light beam brazing method" disclosed in Publication No. 50-5257, "the light energy from a light source is focused, and the resulting light beam is trimmed to irradiate the brazing part at a position shifted from the light convergence part. A light beam brazing method is disclosed which comprises welding the braze by.

In addition, ``Light beam welding,
In "melting and heating processing equipment," a thermal light source lamp is installed at or near the first focal point of the ellipsoidal reflector, and the object to be processed is installed at or near the second focal point, and the energy emitted by the thermal light source lamp is used. In equipment that performs intensive welding, melting, and heating processing,
An aperture mechanism is provided between the first focal point and the second focal point,
The amount of light concentrated at the second focal point is adjusted, and the input to the thermal light source lamp is reduced in synchronization with the aperture operation of the aperture mechanism. A light beam, welding, melting, and heating processing device characterized by being configured to perform position determination. "It has been known. Furthermore, Japanese Patent Publication No. 55-120495 ``Light Beam Welding Machine'' and Japanese Patent Application Laid-Open No. 7-56189 ``Heating Point Detection Device for Light Beam Processing Equipment'' (these two items were invented by the father of this inventor) )It has been known.

(Issues to be solved by the invention) There was a big problem with the conventional technology that utilizes light energy. For example, in the "light beam brazing method" disclosed in Japanese Patent Application Laid-Open No. 50-5257, the light beam used for brazing is focused and then dispersed from the optical axis, so the temperature rises to the temperature required for brazing. It takes a considerable amount of time to do this, and there is a problem in that the IC board deteriorates due to temperature when the brazed portion reaches a predetermined temperature.

In addition, the device disclosed in Japanese Patent Application Laid-open No. 103057/1983 is
Since it is a structure in which the amount of focused light is adjusted at the second focal point, the amount of light can be adjusted, but since the focused light is concentrated at one point, it is not suitable for workpieces that must be focused in a donut shape.

The technology disclosed in JP-A-57-56189 is also based on JP-A-48-
It had the same drawback as the technology disclosed in No. 103057, namely, the inability to collect focused light in a donut shape.

In other words, when soldering IC route wires, the light is focused in a donut shape around the IC lead wire position, that is, around the IC flat package, and the temperature is instantly raised, allowing soldering without causing temperature deterioration of the IC flat package. There was a demand for a device that could do this.

However, such a device has not existed in the past.

(Means for solving the problem) In this invention, the inventor completed an elliptical reflecting mirror with a specific structure, and arrived at this invention. An elliptical arc having a second focal point is set on the optical axis that intersects the virtual straight line at a predetermined angle at the first focal point, and the rotation locus obtained by rotating this elliptical arc around the virtual straight line is used as a reflective surface in front of this reflective surface. It has a curved reflecting mirror having a second focal group that condenses light in an annular shape towards the other side, a light source is disposed at the first focal position of the curved reflecting mirror, and a light source is disposed at the second focal position overlapping with the second focal group. A translucent slit is provided to
By providing an optical soldering device in which an aperture lens and a soldering workbench are sequentially arranged in front of this translucent slit, light can be focused in a ring shape around the IC flat package for the first time. We succeeded in resolving all the problems.

(Example) An embodiment of this invention will be described based on the drawings.

FIGS. 1A to 1B are diagrams illustrating an optical soldering device according to an embodiment of the present invention, in which reference numeral 1 indicates an optical soldering device such as an IC lead wire.

This optical soldering device 1 for IC lead wires, etc. has a specific curved reflector 3 on the upper part of a casing 2.

This curved reflecting mirror 3 has a first focal point 5 on a virtual straight line 4.
A second focal point 8 is located on the optical axis 7 which intersects the virtual straight line 4 at a predetermined angle 6 at the first focal point 5.
An elliptical arc 9 is set, and this elliptical arc 9 is rotated around the imaginary straight line 4, and a rotation locus obtained is set as a reflection surface 10, and a second focal group 11 is formed in front of this reflection surface 10, where light is condensed in an annular shape. have (second
(See Figure B). This idea was completed only after the curved reflecting mirror 3 was completed.

A light source 1 is located at the first focal point 5 of this curved reflecting mirror 3.
2 are arranged.

As the light source 12, a xenon lamp or other highly efficient light source having infrared rays is used.

In addition, a translucent slit 1 is provided at the second focal point 8 position of the curved reflecting mirror 3 and overlaps with the second focal group 11.
3 are arranged.

The light-transmitting slit 13 is formed between the light-shielding shaft 14 and the through-hole 16 of the light-shielding plate 15.

The light shielding plate 15 is installed horizontally in the middle of the casing 2 so as to be freely accessible and removable, and a cross-shaped through hole 16 is formed in the center of the light shielding plate 15 (see FIG. 2B).

On the other hand, the light-shielding shaft 14 extends vertically along the virtual straight line 4 from the center of a heat-resistant glass 19 horizontally mounted on the upper end of a cylindrical support body 18 erected on the light-shielding plate 15 .

The light-shielding shaft 14 is made of a metal material such as brass or brass and is formed into a prismatic shape, and its tip 20 overlaps the intersection of the cross-shaped through holes 16 (see FIG. 2B).

A plurality of several types of light shielding plates 15 are prepared in which the light shielding shafts 14 and the through holes 16 have various sizes, and are replaceable depending on the object to be soldered.

Note that cooling fins 21 are formed on the circumferential surface of the support cylinder 18.

Furthermore, an aperture tube 22 is disposed in the lower part of the casing 2 in front of the light-transmitting slit 13.

Two convex aperture lenses 23 are arranged in the upper and lower parts of the aperture barrel 22.

In front of this aperture tube 22 is a soldering workbench 24.
is installed.

Further, a monitor screen 25 is provided on the side of the aperture tube 22. .

This monitor screen 25 has a folded screen case 26.

The screen case 26 has an enlarged tip, and its base end is pivotally supported by the side wall 27 of the aperture tube 22.

A screen 29 is attached to the tip opening 28 of this screen case 26, and the screen case 26
A planar projection reflecting mirror 31 is disposed within the bending portion 30 of.

On the other hand, a flat relay reflector 32 for relaying reflected light 37 from the soldering workbench 24 to a projection reflector 31 is disposed at the center inside the aperture tube 22 .

The configuration of one embodiment of this invention is as described above, and the usage state of the same embodiment will be explained next.

As shown in Fig. 2, using this optical soldering device 1 for IC lead wires, etc.
3 to the printed circuit board 34, the printed circuit board 34 is preliminarily attached with solder at a predetermined position.
Place the printed circuit board 3 on the soldering workbench 24.
Place the flat package 33 on the predetermined position of 4,
All you have to do is turn on the light source 12.

The light beam 35 emitted from the light source 12 is reflected by the reflecting surface 10 of the curved reflecting mirror 3, condensed in an annular shape at the second focal point 8 position as the second focal group 11, and transmitted through the light-transmitting slit 13. The aperture lens 23 focuses the light 3 along the tip of the lead wire 36 protruding from the four circumferences of the flat package 33.
8, the same portion is heated, and the lead wire 36 is soldered to the printed circuit board 34.

On the other hand, the light ray 37 reflected on the printed circuit board 34
is irradiated onto the screen 29 via the relay reflector 32 and the projection reflector 31 in order, and the working situation on the soldering workbench 24 is projected onto the screen 29.

(Effect of the invention) This invention sets an elliptical arc which has a first focal point on an imaginary straight line and a second focal point on an optical axis that intersects the imaginary straight line at a predetermined angle at this first focal point. It has a curved reflector having a second focal group that condenses light in an annular shape in front of the reflection surface using a rotation locus obtained by rotating around a virtual straight line as a reflection surface, and a first focal position of this curved reflection mirror. A light source is disposed at the second focal point, and a translucent slit that overlaps with the second focal group is disposed at the second focal position, and an aperture lens and a soldering workbench are sequentially arranged in front of the translucent slit. Since this is an optical soldering device for IC lead wires, etc., it has the following effects.

In other words, since a reflector with a specific structure is used, the light rays emitted from the light source are reflected by the curved reflector,
The light is focused in an annular shape at the second focal point, passes through the transparent slit, is narrowed down by the diaphragm lens, and is focused again on the soldering workbench, so that the center of the object to be soldered on the soldering workbench is It is possible to simultaneously heat multiple locations around the device without heating it, making it most suitable for applications such as soldering heat-sensitive IC flat packages to printed circuit boards.

In addition, since soldering work can be performed without mechanical contact with the soldering object, such as with a soldering iron,
Precise work can be performed without shifting the position of the soldering object.

[Brief explanation of the drawing]

FIG. 1A is a front view of an optical soldering device for IC lead wires, etc. according to an embodiment of this invention, FIG. 1B is an explanatory diagram of the internal structure of the device, and FIG. B in the same figure is a sectional view taken along B-B, and C in the same figure is a cross-sectional view taken along C-C.
The sectional view and FIG. 3 are explanatory views of the prior art. 1... Optical soldering device for IC lead wires, etc., 3...
Curved reflector, 4... virtual straight line, 5... first focal point,
6... Predetermined angle, 7... Optical axis, 8... Second focal point,
9... Elliptical arc, 10... Reflective surface, 11... Second focal group, 12... Light source, 13... Translucent slit,
23...Aperture lens, 24...Soldering workbench.

Claims (1)

[Scope of utility model registration request] An elliptical arc having a first focal point on an imaginary straight line and a second focal point on an optical axis that intersects the imaginary straight line at a predetermined angle at the first focal point, and rotating this elliptical arc around the imaginary straight line. It has a curved reflecting mirror having a second focal group that focuses light in an annular shape in front of the reflecting surface using the obtained rotation locus as a reflecting surface, and a light source is disposed at the first focal position of the curved reflecting mirror. A light-transmitting slit that overlaps with the second focal group is provided at the second focal position, and an aperture lens and a soldering workbench are sequentially arranged in front of the light-transmitting slit. Device.