JPH0346967B2 - - Google Patents
Info
- Publication number
- JPH0346967B2 JPH0346967B2 JP60170506A JP17050685A JPH0346967B2 JP H0346967 B2 JPH0346967 B2 JP H0346967B2 JP 60170506 A JP60170506 A JP 60170506A JP 17050685 A JP17050685 A JP 17050685A JP H0346967 B2 JPH0346967 B2 JP H0346967B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- plate
- metal plate
- lead plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 9
- 230000003064 anti-oxidating effect Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 26
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品本体の両端部から夫々リード
端子が引き出されてなる電子部品の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing an electronic component in which lead terminals are drawn out from both ends of an electronic component body.
（従来技術）
一般に、コンデンサや抵抗器等の電子部品で
は、第６図に示すように、チツプ状の電子部品本
体１の両端面に夫々形成された電極２および３
に、各一端が偏平状に形成された断面が円形のリ
ード端子４，４の偏平部分４ａ，４ａを半田付け
し、電子部品本体１を外装樹脂（図示せず。）に
より被覆したものがある。上記各リード端子４に
は、この電子部品をプリント回路基板（図示せ
ず。）に実装したときの位置決め用の突起４ｂが
形成されている。(Prior Art) In general, in electronic components such as capacitors and resistors, as shown in FIG.
In some cases, the flat parts 4a, 4a of lead terminals 4, 4 each having a flat end and a circular cross section are soldered, and the electronic component main body 1 is covered with an exterior resin (not shown). . Each lead terminal 4 is formed with a projection 4b for positioning when the electronic component is mounted on a printed circuit board (not shown).
従来、この種の電子部品を製造するには、先
ず、リール（図示せず。）に巻回された断面が円
形の銅等の材料からなるワイヤをこのリールから
引き出して上記リード端子４の長さのほぼ２倍の
長さに切断し、リールに巻回されて円弧状に湾曲
している切断後のワイヤを直線状に伸線する。そ
の後、第７図ａに示すように、切断後の上記ワイ
ヤ４′をＵ字状に湾曲させ、その湾曲部分５より
上記ワイヤ４′を、厚紙もしくは樹脂フイルム等
からなる保持テープ６に形成された２本のスリツ
ト７，７′の一方７に、保持テープ６の表側から
裏側に挿通し、さらに、上記スリツトの他方７′
に、保持テープ６の裏側から表側に挿通し、保持
テープ６にワイヤ４′を保持する。次に、第７図
ｂに示すように、ワイヤ４′の両端部を成形して
偏平部分４ａ，４ａと位置決め用の突起４ｂ，４
ｂとを形成し、上記偏平部分４ａ，４ａの間に、
矢印A0で示すように、電子部品本体１を挿入し、
第７図ｃに示すように、上記偏平部分４ａ，４ａ
の間に電子部品本体１を保持する。この状態で電
子部品本体１の両端部に形成された電極２，３に
上記偏平部分４ａ，４ａを半田付けし、上記電子
部品本体１を外装樹脂（図示せず。）により外装
した後あるいは前に、第７図ｃにおいて一点鎖線
l0で示すワイヤ４′の湾曲部分５の近くでワイヤ
４′を切断し、２本のリード端子４，４に分離す
るようにしていた。 Conventionally, in order to manufacture this type of electronic component, first, a wire made of a material such as copper and having a circular cross section is wound around a reel (not shown), and the wire is pulled out from the reel, and the length of the lead terminal 4 is determined. The wire is cut into a length approximately twice the length of the wire, and the cut wire, which is wound around a reel and curved in an arc, is drawn into a straight line. Thereafter, as shown in FIG. 7a, the cut wire 4' is bent into a U-shape, and from the curved portion 5, the wire 4' is formed into a holding tape 6 made of cardboard or resin film. The holding tape 6 is inserted through one 7 of the two slits 7 and 7' from the front side to the back side, and then the other slit 7'
Then, the wire 4' is inserted through the holding tape 6 from the back side to the front side, and the wire 4' is held on the holding tape 6. Next, as shown in FIG. 7b, both ends of the wire 4' are formed to form flat portions 4a, 4a and positioning protrusions 4b, 4.
b, and between the flat portions 4a, 4a,
Insert the electronic component body 1 as shown by arrow A 0 ,
As shown in FIG. 7c, the flat portions 4a, 4a
The electronic component main body 1 is held between them. In this state, the flat parts 4a, 4a are soldered to the electrodes 2, 3 formed at both ends of the electronic component main body 1, and the electronic component main body 1 is covered with an exterior resin (not shown) or before. In Figure 7c, the dashed line
The wire 4' was cut near the curved portion 5 of the wire 4' indicated by l 0 to separate it into two lead terminals 4, 4.
ところで、上記のような横断面が円形のワイヤ
４′をリード端子４，４として使用する電子部品
の製造方法では、リード端子４は断面が円形であ
るためにあらゆる方向に曲がる可能性があり、電
子部品の製造過程においてリード端子４，４に曲
りや変形が生じ、リード端子４，４の偏平部分４
ａ，４ａの間に電子部品本体１を挿入してうまく
保持することができなくなり、リード端子４，４
の偏平部分４ａ，４ａを電子部品本体１の電極
２，３にうまく半田付けすることができなくなる
といつた問題があつた。また、上記従来の電子部
品の製造方法では、リールに巻回されて円弧状に
湾曲している切断後のワイヤ４′を直線状に伸線
する工程や、ワイヤ４′に偏平部分４ａ，４ａお
よび位置決め用の突起４ｂ，４ｂを形成する工程
等、ワイヤ４′に対する加工工程が多いという問
題もあつた。 By the way, in the method of manufacturing an electronic component using the wire 4' having a circular cross section as the lead terminals 4, as described above, the lead terminal 4 has a circular cross section and may be bent in any direction. During the manufacturing process of electronic components, the lead terminals 4, 4 may be bent or deformed, and the flat portions 4 of the lead terminals 4, 4 may be bent or deformed.
The electronic component main body 1 cannot be inserted and held properly between the lead terminals 4 and 4a, and the lead terminals 4 and 4
There was a problem in that the flat portions 4a, 4a of the electronic component body 1 could not be properly soldered to the electrodes 2, 3 of the electronic component body 1. In addition, in the above-mentioned conventional method for manufacturing electronic components, there is a step of drawing the cut wire 4', which is wound around a reel and curved in an arc shape, into a straight line, and a step of drawing the wire 4' into a straight line, and a step of drawing the wire 4' into a straight line. Another problem was that there were many processing steps for the wire 4', such as the step of forming the positioning protrusions 4b, 4b.
（発明の目的）
本発明の目的は、リード端子の製造が容易でリ
ード端子の曲りや変形が少なく、リード端子付き
の電子部品を容易に製造することができ、しかも
リード端子の酸化が少なく、リード端子の半田付
性の良好な電子部品の製造方法を提供することで
ある。(Objective of the Invention) The object of the present invention is to easily manufacture lead terminals with less bending or deformation of the lead terminals, to easily manufacture electronic components with lead terminals, and to reduce oxidation of the lead terminals. It is an object of the present invention to provide a method for manufacturing an electronic component having lead terminals with good solderability.
（発明の構成）
このため、本発明は、打抜き開口を形成した金
属板に半田付性および酸化防止性の良好な金属の
皮膜を形成した後、この金属板を切断して両端部
に夫々幅広部を有するリード板を形成し、このリ
ード板をその幅広部を互いに対面させてＵ字状に
湾曲させてテープ状の保持部材にその長手方向に
対して直角をなすように保持させ、この状態でリ
ード板の幅広部の間に電子部品本体を挿入し、こ
れら幅広部を電子部品本体の電極に接続した後、
リード板を２本のリード端子に切断するようにし
たことを特徴としている。すなわち、本発明は、
Ｕ字状に湾曲された板状のリード板とこのリード
板を、互いに対面させて保持するテープ状の保持
部材を使用し、この保持部材に保持されたリード
板の両端部の間に電子部品本体を挿入してその電
極にリード板の両側部を半田付け等することによ
り、電子部品本体の電極にリード端子を接続する
ようにしたものである。(Structure of the Invention) For this reason, the present invention involves forming a metal film with good solderability and anti-oxidation properties on a metal plate having punched openings, and then cutting the metal plate so that each end has a wide width. The lead plate is curved into a U-shape with its wide parts facing each other, and is held by a tape-shaped holding member at right angles to its longitudinal direction. After inserting the electronic component body between the wide parts of the lead plate and connecting these wide parts to the electrodes of the electronic component body,
It is characterized in that the lead plate is cut into two lead terminals. That is, the present invention
A U-shaped lead plate and a tape-shaped holding member are used to hold the lead plate facing each other, and electronic components are placed between both ends of the lead plate held by this holding member. The lead terminals are connected to the electrodes of the electronic component main body by inserting the main body and soldering both sides of the lead plate to the electrodes.
（発明の効果）
本発明によれば、Ｕ字状に湾曲させたリード板
を電子部品本体の電極に接続し、このリード板を
切断してリード端子を形成するようにしたので、
リード端子はその厚み方向に対して直角の方向に
は変形し難く、電子部品製造時のリード端子の変
形が少なく、リード板は平板の打ち抜きにより形
成できるので、リールに巻回された断面が円形の
ワイヤのように、カツト後の伸線工程や各種の成
形工程が不要となり、電子部品の製造が容易にな
る。また、本発明によれば、打抜き開口が形成さ
れた後、金属板は半田付性および酸化防止性の良
好な金属よりなる皮膜により被覆されるので、リ
ード端子の酸化が少なくなり、リード端子の半田
付性も向上させることができる。(Effects of the Invention) According to the present invention, the lead plate curved in a U-shape is connected to the electrode of the electronic component body, and the lead plate is cut to form the lead terminal.
The lead terminal is difficult to deform in the direction perpendicular to its thickness direction, so there is little deformation of the lead terminal during the manufacture of electronic components, and the lead plate can be formed by punching a flat plate, so the cross section wound on the reel is circular. This eliminates the need for the wire drawing process and various forming processes after cutting, as with wires, making it easier to manufacture electronic parts. Further, according to the present invention, after the punched opening is formed, the metal plate is covered with a film made of a metal that has good solderability and anti-oxidation properties, so oxidation of the lead terminal is reduced, and the lead terminal is Solderability can also be improved.
（実施例）
以下、添付図面を参照して本発明の実施例を説
明する。(Example) Hereinafter, an example of the present invention will be described with reference to the accompanying drawings.
本実施例により製造される電子部品を第２図に
示す。 FIG. 2 shows an electronic component manufactured according to this example.
第２図の電子部品は、積層チツプコンデンサ１
１の両端部に形成された電極１２および１３に
夫々平板状のリード端子１４，１４の幅広部１４
ａ，１４ａを接続（半田付け）し、積層チツプコ
ンデンサ１１の外部を絶縁性の樹脂１５で被覆し
たリード端子付きコンデンサである。 The electronic component in Figure 2 is a multilayer chip capacitor 1.
Wider portions 14 of flat lead terminals 14, 14 are attached to electrodes 12 and 13 formed at both ends of 1, respectively.
This is a capacitor with lead terminals in which the capacitors a and 14a are connected (soldered) and the outside of the multilayer chip capacitor 11 is covered with an insulating resin 15.
上記リード端子付きコンデンサを製造するに
は、先ず、第１図ａに示すように、一定の幅w1
を有する厚さt1の帯状の金属板１６を用意する。
この金属板１６の材料としては、真ちゆう、鉄、
銅、燐青銅、もしくは洋白等の良好な導電性を有
する金属材料を使用することができる。金属板１
６の上記幅w1および厚さt1は、積層チツプコンデ
ンサ１１の寸法等に対応して、たとえば、w1＝
84mm、t1＝0.25mmに選択される。 To manufacture the above capacitor with lead terminals, first, as shown in Figure 1a, a certain width w 1
A strip-shaped metal plate 16 having a thickness t 1 is prepared.
Materials for this metal plate 16 include brass, iron,
Metal materials with good electrical conductivity, such as copper, phosphor bronze, or nickel silver, can be used. metal plate 1
The above-mentioned width w 1 and thickness t 1 of 6 correspond to the dimensions of the multilayer chip capacitor 11, for example, w 1 =
84mm, t 1 =0.25mm is selected.
上記金属板１６には、その長手方向に一定間隔
をおいて、両端部がいずれも三角形状となつた打
抜き開口１６ａ，１６ａ…を打ち抜く。次いで、
打抜き開口１６ａ，１６ａ，…が形成された上記
金属板１６の表面に、半田付性および酸化防止性
の良好な金属、たとえば錫もしくは半田等の皮膜
（図示せず。）を形成する。この皮膜は、上記金属
板１６を溶融した半田もしくは錫の中に浸漬する
ことにより形成される。その後、上記金属板１６
は、第１図ａにおいて点線で示す上記各打抜き開
口１６ａの中心を通る線で切断し、第１図ｂに示
すように、両端部に幅広部１４ａ，１４ａを有す
るリード板１４′を形成する。このリード板１
４′の各幅広部１４ａの幅w2および長さl1は、積
層チツプコンデンサ１１の両端面の寸法にほぼ等
しく、たとえば、w2＝１mm、l1＝４mmである。ま
た、リード板１４′の幅w3は、w3＝0.5mmである。 The metal plate 16 is punched with openings 16a, 16a, . . . having triangular shapes at both ends at regular intervals in the longitudinal direction. Then,
A film (not shown) of a metal having good solderability and antioxidation properties, such as tin or solder, is formed on the surface of the metal plate 16 in which the punched openings 16a, 16a, . . . are formed. This film is formed by dipping the metal plate 16 into molten solder or tin. After that, the metal plate 16
is cut along a line passing through the center of each of the punched openings 16a, indicated by dotted lines in FIG. 1a, to form a lead plate 14' having wide portions 14a, 14a at both ends, as shown in FIG. 1b. . This lead plate 1
The width w 2 and length l 1 of each wide portion 14a of 4' are approximately equal to the dimensions of both end faces of the multilayer chip capacitor 11, for example, w 2 =1 mm and l 1 =4 mm. Further, the width w 3 of the lead plate 14' is w 3 =0.5 mm.
上記リード板１４′は、第１図ｃに示すように、
その中央部にて、両端部の幅広部１４ａ，１４ａ
を対面させてＵ字状に湾曲させ、紙もしくは樹脂
等の材料からなる可撓性を有する材料からなる保
持部材としての保持テープ１７に保持させる。こ
の保持テープ１７による上記リード板１４′の保
持は、第７図ａにおいて説明したのと同様にし
て、保持テープ１７に予め形成されたスリツト１
８，１８′により行なわれる。 As shown in FIG. 1c, the lead plate 14' is
In the center part, wide parts 14a, 14a at both ends
are curved into a U-shape while facing each other, and held by a holding tape 17 as a holding member made of a flexible material such as paper or resin. The lead plate 14' is held by the holding tape 17 in the same way as explained in FIG.
8, 18'.
すなわち、上記保持テープ１７には、その長手
方向に、一つのリード板１４′に対して、その幅
広部１４ａ，１４ａの間隔ｄにほぼ等しい長さを
有する２本のスリツト１８，１８′が形成されて
いる。リード板１４′は、その湾曲部分１４ｂが
上記スリツトの一方１８に保持テープ１７の表側
から裏側に挿通され、その後、上記スリツトの他
方１８′に、保持テープ１７の裏側から表側に挿
通されて保持テープ１７に保持される。 That is, two slits 18, 18' are formed in the longitudinal direction of the holding tape 17 with respect to one lead plate 14', the length being approximately equal to the distance d between the wide parts 14a, 14a. has been done. The curved portion 14b of the lead plate 14' is inserted through one of the slits 18 from the front side of the holding tape 17 to the back side, and then through the other slit 18' from the back side of the holding tape 17 to the front side to be held. It is held on tape 17.
次に、リード板１４′の幅広部１４ａ，１４ａ
は、第１図ｄに示すように、積層チツプコンデン
サ１１の電極１２，１３が形成された端面間の寸
法に合わせて、その間隔が狭くなるように成形し
た後、その間に積層チツプコンデンサ１１を矢印
A1で示すように挿入し、第１図ｅに示すように、
リード板１４′の幅広部１４ａ，１４ａの間に上
記積層チツプコンデンサ１１を保持する。 Next, the wide parts 14a, 14a of the lead plate 14'
As shown in FIG. 1d, the multilayer chip capacitor 11 is formed so that the distance between the end faces on which the electrodes 12 and 13 are formed is narrowed, and then the multilayer chip capacitor 11 is placed between them. arrow
Insert it as shown in A 1 and as shown in Figure 1 e.
The multilayer chip capacitor 11 is held between the wide portions 14a, 14a of the lead plate 14'.
この状態で、上記リード板１４′の幅広部１４
ａ，１４ａを予熱し、その後これら幅広部１４
ａ，１４ａを積層チツプコンデンサ１１の電極１
２，１３に半田付けする。 In this state, the wide portion 14 of the lead plate 14'
a, 14a, and then these wide parts 14
a, 14a as electrode 1 of multilayer chip capacitor 11
Solder to 2 and 13.
次いで、上記リード板１４′を、第１図ｅに一
点鎖線l2で示すように、その湾曲部１４ｂの近傍
にて切断して２本のリード端子１４，１４に分離
し、これら２本の端子１４，１４間の静電容量等
の特性を測定した後、上記積層チツプコンデンサ
１１を絶縁性の樹脂１５（第２図参照）により外
装し、上記リード端子１４，１４を所定の位置で
切断したりして保持テープ１７からとりはずせ
ば、第２図において説明したコンデンサを得るこ
とができる。この場合前記外装工程を、リード板
１４′を切断して２本のリード端子１４，１４に
分離する工程の前で行なつてもよい。 Next, the lead plate 14' is cut near the curved portion 14b, as shown by the dashed line l2 in FIG. After measuring the characteristics such as capacitance between the terminals 14, 14, the multilayer chip capacitor 11 is covered with an insulating resin 15 (see Fig. 2), and the lead terminals 14, 14 are cut at predetermined positions. By removing it from the holding tape 17, the capacitor described in FIG. 2 can be obtained. In this case, the above-mentioned packaging step may be performed before the step of cutting the lead plate 14' and separating it into two lead terminals 14, 14.
上記のようにすれば、打抜き開口が形成されて
酸化防止性および半田付性の良好な金属の皮膜が
形成された金属板１６を切断するだけで酸化防止
性および半田付性の良好なリード端子を製作する
ことができ、リード端子１４の製作が非常に容易
になるうえに、保持テープ１７を利用してリード
端子付きのコンデンサを、自動機械により連続的
に製造することができる。また、上記のようにし
て製造された第２図のコンデンサは、リード端子
１４が金属板１６を打ち抜いて形成されているの
で、上記コンデンサの製造過程でリード端子１４
がその厚み方向に直角な方向に変形することもな
い。さらに、上記コンデンサは、リード端子１４
が幅広部１４ａを有しているので、この幅広部１
４ａとの長さをコンデンサよりも長くしてその下
端１４ｃに下方を突出させておけば、第３図に示
すように、その幅広部１４ａの下端１４ｃが上記
コンデンサをプリント回路基板１８に実装したと
き、このプリント回路基板１８に当接し、コンデ
ンサの位置決め用のストツパとして機能する。従
つて、コンデンサの位置決めをするためにリード
端子１４に特別な加工を施す必要はない。さらに
また、第２図のコンデンサはリード端子１４をそ
の厚み方向には容易に折出することができるの
で、第３図、第４図に示すように、リード端子１
４，１４をその厚み方向に析曲することにより、
リード端子１４，１４間の距離Ｆも容易に調整す
ることができる。 With the above method, a lead terminal with good anti-oxidation properties and solderability can be obtained by simply cutting the metal plate 16 in which punched openings are formed and a metal film with good anti-oxidation properties and solderability is formed. In addition, the lead terminals 14 can be manufactured very easily, and capacitors with lead terminals can be continuously manufactured using an automatic machine by using the holding tape 17. Further, in the capacitor shown in FIG. 2 manufactured as described above, the lead terminals 14 are formed by punching out the metal plate 16.
is not deformed in a direction perpendicular to its thickness direction. Further, the capacitor has a lead terminal 14
has a wide portion 14a, so this wide portion 1
4a is made longer than the capacitor and its lower end 14c protrudes downward, as shown in FIG. At this time, it comes into contact with this printed circuit board 18 and functions as a stopper for positioning the capacitor. Therefore, there is no need to perform any special processing on the lead terminals 14 in order to position the capacitor. Furthermore, since the capacitor shown in FIG. 2 can easily break out the lead terminals 14 in the thickness direction, the lead terminals 14 can be easily bent out in the thickness direction.
By analyzing 4 and 14 in the thickness direction,
The distance F between the lead terminals 14, 14 can also be easily adjusted.
なお、上記実施例において、第１図ｄのリード
板１４′の幅広部１４ａ，１４ａの成形工程は、
チツプ状積層コンデンサ１１の寸法が成形前の間
隔ｄに比較して大きいときは省略することができ
る。さらに、上記保持テープ１７は、ベーステー
プと貼着テープとからなり、その間に上記リード
板１４′を保持するものであつてもよい。 In the above embodiment, the forming process of the wide portions 14a, 14a of the lead plate 14' shown in FIG. 1d is as follows:
It can be omitted when the dimensions of the chip-shaped multilayer capacitor 11 are larger than the interval d before molding. Further, the holding tape 17 may be composed of a base tape and an adhesive tape, and may hold the lead plate 14' therebetween.
上記金属板１６に形成する打抜き開口１６ａ，
１６ａ，…は先端部が三角形状のものに限らず、
たとえば、第１図ｆに示すように、長方形状のも
の等であつてもよく、また、第１図ｇに示すよう
に、上記各打抜き開口１６ａの両端部に夫々対向
する切欠き１６ｂ，１６ｂを形成するようにして
もよい。 A punched opening 16a formed in the metal plate 16,
16a,... are not limited to those with triangular tips;
For example, as shown in FIG. 1f, it may have a rectangular shape, or as shown in FIG. may be formed.
本発明は、積層チツプコンデンサ１１の他に、
例えば第５図に示すように、円柱状の電子部品本
体１９の両端部に金属キヤツプ２０，２０を冠着
した抵抗器等の電子部品にも適用することができ
る。 In addition to the multilayer chip capacitor 11, the present invention also includes:
For example, as shown in FIG. 5, the present invention can be applied to an electronic component such as a resistor in which metal caps 20, 20 are attached to both ends of a cylindrical electronic component main body 19.
第１図ａ、第１図ｂ、第１図ｃ、第１図ｄおよ
び第１図ｅは夫々本発明に係る電子部品の製造方
法の一実施例の製造工程の説明図、第１図ｆおよ
び第１図ｇは夫々金属板に形成された打抜き開口
の変形例の説明図、第２図は本発明方法により製
造されたコンデンサの一部破断斜視図、第３図は
第２図のコンデンサのプリント回路基板への実装
状態を示す説明図、第４図はリード端子間調整の
説明図、第５図は円柱形状を有する電子部品本体
の斜視図、第６図は従来の電子部品の製造方法に
より製造された電子部品の内部構造を示す斜視
図、第７図ａ、第７図ｂおよび第７図ｃは夫々従
来の電子部品の製造方法の説明図である。
１１……積層チツプコンデンサ、１２，１３…
…電極、１４……リード端子、１４′……リード
板、１４ａ……幅広部、１４ｂ……湾曲部分、１
６……金属板、１６ａ……打抜き開口、１７……
保持テープ。
1a, 1b, 1c, 1d and 1e are explanatory diagrams of the manufacturing process of an embodiment of the electronic component manufacturing method according to the present invention, and FIG. 1f 1g is an explanatory diagram of a modified example of a punched opening formed in a metal plate, FIG. 2 is a partially cutaway perspective view of a capacitor manufactured by the method of the present invention, and FIG. 3 is a capacitor of FIG. 2. FIG. 4 is an explanatory diagram showing the state of mounting on a printed circuit board, FIG. 4 is an explanatory diagram of adjustment between lead terminals, FIG. 5 is a perspective view of a cylindrical electronic component body, and FIG. 6 is a conventional manufacturing method of electronic components. A perspective view showing the internal structure of an electronic component manufactured by the method, FIG. 7a, FIG. 7b, and FIG. 7c are explanatory diagrams of a conventional method for manufacturing an electronic component, respectively. 11... Multilayer chip capacitor, 12, 13...
...Electrode, 14...Lead terminal, 14'...Lead plate, 14a...Wide part, 14b...Curved part, 1
6... Metal plate, 16a... Punching opening, 17...
retaining tape.
Claims (1)
れた電極にリード端子が夫々導電的に接続されて
なる電子部品の製造方法であつて、 一定の幅および長さを有する金属板を用意し、
この金属板に、その幅方向に長い打抜き開口をそ
の長さ方向に沿つて等間隔に形成した後、上記金
属板の表面に半田付け性および酸化防止性の良好
な金属よりなる皮膜を形成し、上記各打抜き開口
を通つて上記金属板を幅方向に切断して、両端部
に夫々幅広部を有する細幅のリード板を形成し、
このリード板を両端部の幅広部を対向させてその
ほぼ中央部でＵ字状に湾曲させ、このリード板を
その湾曲部の両端部がテープ状の保持部材の長手
方向に対してほぼ直角をなすように保持部材に保
持させ、この状態でリード板の対向する幅広部の
間に電子部品本体を挿入し、幅広部と電子部品本
体の電極とを導電的に接続するようにしたことを
特徴とする電子部品の製造方法。[Scope of Claims] 1. A method for manufacturing an electronic component in which lead terminals are electrically conductively connected to electrodes formed on opposite end surfaces of an electronic component body, the electronic component having a constant width and length. Prepare a metal plate,
After forming punched openings long in the width direction of the metal plate at equal intervals along its length, a film made of a metal with good solderability and anti-oxidation properties is formed on the surface of the metal plate. , cutting the metal plate in the width direction through each of the punched openings to form a narrow lead plate having wide portions at both ends;
This lead plate is curved into a U-shape approximately in the center with the wide portions at both ends facing each other, and the lead plate is bent so that both ends of the curved portion are approximately perpendicular to the longitudinal direction of the tape-shaped holding member. The main body of the electronic component is inserted between the opposing wide parts of the lead plate in this state, and the wide part and the electrode of the main body of the electronic component are electrically connected. A method for manufacturing electronic components.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60170506A JPS6230310A (en) | 1985-07-31 | 1985-07-31 | Manufacture of electronic component |
| DE19863625238 DE3625238A1 (en) | 1985-07-31 | 1986-07-25 | ELECTRONIC COMPONENT WITH CONNECTING WIRE AND METHOD FOR PRODUCING THIS COMPONENT |
| US06/891,557 US4785990A (en) | 1985-07-31 | 1986-07-29 | Electronic component with lead terminals and method of manufacturing said electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60170506A JPS6230310A (en) | 1985-07-31 | 1985-07-31 | Manufacture of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6230310A JPS6230310A (en) | 1987-02-09 |
| JPH0346967B2 true JPH0346967B2 (en) | 1991-07-17 |
Family
ID=15906214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60170506A Granted JPS6230310A (en) | 1985-07-31 | 1985-07-31 | Manufacture of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230310A (en) |
-
1985
- 1985-07-31 JP JP60170506A patent/JPS6230310A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230310A (en) | 1987-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |