JPH0345636U - - Google Patents
Info
- Publication number
- JPH0345636U JPH0345636U JP10530989U JP10530989U JPH0345636U JP H0345636 U JPH0345636 U JP H0345636U JP 10530989 U JP10530989 U JP 10530989U JP 10530989 U JP10530989 U JP 10530989U JP H0345636 U JPH0345636 U JP H0345636U
- Authority
- JP
- Japan
- Prior art keywords
- support parts
- cleaned
- sets
- supported
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Description
第１図は本考案の原理説明図、第２図は本考案
の実施例を示す斜視図、第３図は本考案の実施例
の作用を示す図、第４図は従来の洗浄用キヤリヤ
の１例を示す図である。
図において、１０……被洗浄物、１１，１２，
２１〜２４……支持部材、１１ａ，１１ｂ，１２
ａ，１２ｂ，３０……支持部、２５，２６……側
板、２７……連結部材、２８……長孔を示す。
Fig. 1 is a diagram explaining the principle of the present invention, Fig. 2 is a perspective view showing an embodiment of the invention, Fig. 3 is a diagram showing the operation of the embodiment of the invention, and Fig. 4 is a diagram of a conventional cleaning carrier. It is a figure showing one example. In the figure, 10... object to be cleaned, 11, 12,
21-24...Supporting member, 11a, 11b, 12
a, 12b, 30... support portion, 25, 26... side plate, 27... connection member, 28... long hole.
Claims (1)
１ａ，１１ｂ，１２ａ，１２ｂを設け、該支持部
の少なくとも一方の支持部を上下可動とし、被洗
浄物１０を該２組の支持部１１ａ，１１ｂ，１２
ａ，１２ｂで交互に支持し得るようにしたことを
特徴とする洗浄用キヤリヤ。 Two sets of support parts 1 supporting one object to be cleaned 10
1a, 11b, 12a, 12b are provided, at least one of the support parts is movable up and down, and the object to be cleaned 10 is supported by the two sets of support parts 11a, 11b, 12.
A cleaning carrier characterized in that it can be alternately supported by a and 12b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10530989U JPH0345636U (en) | 1989-09-11 | 1989-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10530989U JPH0345636U (en) | 1989-09-11 | 1989-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345636U true JPH0345636U (en) | 1991-04-26 |
Family
ID=31654072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10530989U Pending JPH0345636U (en) | 1989-09-11 | 1989-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345636U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036644A1 (en) * | 1998-12-11 | 2000-06-22 | Toho Kasei Ltd. | Device for processing wafer |
| KR100588276B1 (en) * | 1997-11-19 | 2006-12-01 | 가부시끼가이샤가이죠 | Substrate drying apparatus and method |
| JP2011204893A (en) * | 2010-03-25 | 2011-10-13 | Tokyo Electron Ltd | Substrate treatment apparatus, substrate treatment method, and storage medium storing computer program for performing the substrate treatment method |
| US8567417B2 (en) * | 2009-10-05 | 2013-10-29 | Tokyo Electron Limited | Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method |
-
1989
- 1989-09-11 JP JP10530989U patent/JPH0345636U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100588276B1 (en) * | 1997-11-19 | 2006-12-01 | 가부시끼가이샤가이죠 | Substrate drying apparatus and method |
| WO2000036644A1 (en) * | 1998-12-11 | 2000-06-22 | Toho Kasei Ltd. | Device for processing wafer |
| US8567417B2 (en) * | 2009-10-05 | 2013-10-29 | Tokyo Electron Limited | Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method |
| JP2011204893A (en) * | 2010-03-25 | 2011-10-13 | Tokyo Electron Ltd | Substrate treatment apparatus, substrate treatment method, and storage medium storing computer program for performing the substrate treatment method |