JPH0344863U - - Google Patents
Info
- Publication number
- JPH0344863U JPH0344863U JP10641389U JP10641389U JPH0344863U JP H0344863 U JPH0344863 U JP H0344863U JP 10641389 U JP10641389 U JP 10641389U JP 10641389 U JP10641389 U JP 10641389U JP H0344863 U JPH0344863 U JP H0344863U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- tip
- guide part
- solder cup
- vicinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10641389U JPH0344863U (ru) | 1989-09-11 | 1989-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10641389U JPH0344863U (ru) | 1989-09-11 | 1989-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0344863U true JPH0344863U (ru) | 1991-04-25 |
Family
ID=31655142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10641389U Pending JPH0344863U (ru) | 1989-09-11 | 1989-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0344863U (ru) |
-
1989
- 1989-09-11 JP JP10641389U patent/JPH0344863U/ja active Pending