JPH0344646U - - Google Patents

Info

Publication number
JPH0344646U
JPH0344646U JP10627289U JP10627289U JPH0344646U JP H0344646 U JPH0344646 U JP H0344646U JP 10627289 U JP10627289 U JP 10627289U JP 10627289 U JP10627289 U JP 10627289U JP H0344646 U JPH0344646 U JP H0344646U
Authority
JP
Japan
Prior art keywords
pressure receiving
center diaphragm
recesses
ring
shaped grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10627289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10627289U priority Critical patent/JPH0344646U/ja
Publication of JPH0344646U publication Critical patent/JPH0344646U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を説明する断面構成
図である第2図のセンタダイアフラムの取り付け
部分を説明する構成図、第2図は本考案の差圧伝
送器の一実施例を説明する断面構成図、第3図は
第1図において溶接する前の構成図、第4図は他
の実施例を説明する構成図、第5図は更に他の実
施例を説明する構成図、第6図は従来の差圧伝送
器の要部断面構成図、第7図は第6図におけるセ
ンタダイアフラムの取り付け部分を説明する図、
第8図はセンタダイアフラムの取り付け部分の第
2の例を説明する図、第9図はセンタダイアフラ
ムの取り付け部分の第3の例を説明する図、第1
0図はセンタダイアフラムの取り付け部分の第4
の例を説明する図である。 これらの図において、1,38……第1の受圧
部ボデイ、2,39……第1の凹部、3,40…
…第2の受圧部ボデイ、4,41……第2の凹部
、5,42……センタダイアフラム、6,43…
…第1室、7,44……第2室、38a,40a
……溝、58……センタダイアフラム溶接部、5
9……受圧部ボデイ溶接部。
Fig. 1 is a cross-sectional configuration diagram illustrating an embodiment of the present invention. Fig. 2 is a configuration diagram illustrating the attachment part of the center diaphragm. Fig. 2 is a diagram illustrating an embodiment of the differential pressure transmitter of the present invention. FIG. 3 is a configuration diagram before welding in FIG. 1, FIG. 4 is a configuration diagram explaining another embodiment, and FIG. 5 is a configuration diagram explaining another embodiment. Fig. 6 is a cross-sectional configuration diagram of the main parts of a conventional differential pressure transmitter, Fig. 7 is a diagram illustrating the attachment part of the center diaphragm in Fig. 6,
FIG. 8 is a diagram illustrating a second example of the attachment part of the center diaphragm, FIG. 9 is a diagram illustrating a third example of the attachment part of the center diaphragm, and FIG.
Figure 0 shows the fourth part of the center diaphragm installation part.
It is a figure explaining an example. In these figures, 1, 38...first pressure receiving part body, 2, 39...first recessed part, 3, 40...
...Second pressure receiving part body, 4, 41... Second recess, 5, 42... Center diaphragm, 6, 43...
...First room, 7, 44...Second room, 38a, 40a
... Groove, 58 ... Center diaphragm welding part, 5
9...Pressure receiving part body welding part.

Claims (1)

【実用新案登録請求の範囲】 第1の凹部39が形成された第1の受圧部ボデ
イ38と、この第1の受圧部ボデイ38に取り付
けられ、前記第1の受圧部ボデイ38に対向する
第2の凹部41が形成された第2の受圧部ボデイ
40と、これら第1及び第2の受圧部ボデイ38
,40に挟持され、第1及び第2の凹部39,4
1によつて形成された空間を仕切り、第1室43
及び第2室44を形成するセンタダイアフラム4
2を有した差圧伝送器において、 前記第1及び第2の受圧部ボデイ38,40を
各対向面の前記第1及び第2の凹部39,41の
外周に形成され、対向する第1及び第2のリング
状の溝38a,40aと、 これら第1及び第2のリング状の溝38a,4
0aの内側に形成されたセンタダイアフラム溶接
部58と、 前記第1及び第2のリング状の溝38a,40
aの外側に、前記センタダイアフラム溶接部58
と同時に形成された受圧部ボデイ溶接部59とを
設けたことを特徴とする差圧伝送器。
[Claims for Utility Model Registration] A first pressure receiving body 38 in which a first recess 39 is formed; A second pressure receiving body 40 having two recesses 41 formed therein, and these first and second pressure receiving body 38
, 40, and the first and second recesses 39, 4
The space formed by 1 is partitioned into a first chamber 43.
and a center diaphragm 4 forming a second chamber 44.
2, the first and second pressure receiver bodies 38, 40 are formed on the outer periphery of the first and second recesses 39, 41 on each opposing surface, and the opposing first and second second ring-shaped grooves 38a, 40a, and these first and second ring-shaped grooves 38a, 4
A center diaphragm welded portion 58 formed on the inner side of 0a, and the first and second ring-shaped grooves 38a, 40.
On the outside of a, the center diaphragm welded portion 58
A differential pressure transmitter characterized in that a pressure receiving part body welded part 59 is formed at the same time.
JP10627289U 1989-09-11 1989-09-11 Pending JPH0344646U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10627289U JPH0344646U (en) 1989-09-11 1989-09-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10627289U JPH0344646U (en) 1989-09-11 1989-09-11

Publications (1)

Publication Number Publication Date
JPH0344646U true JPH0344646U (en) 1991-04-25

Family

ID=31655008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10627289U Pending JPH0344646U (en) 1989-09-11 1989-09-11

Country Status (1)

Country Link
JP (1) JPH0344646U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013061212A (en) * 2011-09-13 2013-04-04 Yokogawa Electric Corp Differential pressure and pressure gauge
JP2015166703A (en) * 2014-03-04 2015-09-24 アズビル株式会社 pressure sensor chip
WO2015151728A1 (en) * 2014-03-31 2015-10-08 アズビル株式会社 Pressure-sensor chip
WO2019102983A1 (en) * 2017-11-24 2019-05-31 イーグル工業株式会社 Metal diaphragm damper and manufacturing method for same
WO2019222598A1 (en) * 2018-05-17 2019-11-21 Rosemount Inc. Measuring element and measuring device comprising the same
CN111492217A (en) * 2018-05-17 2020-08-04 罗斯蒙特公司 Measuring element and measuring device comprising such a measuring element

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013061212A (en) * 2011-09-13 2013-04-04 Yokogawa Electric Corp Differential pressure and pressure gauge
JP2015166703A (en) * 2014-03-04 2015-09-24 アズビル株式会社 pressure sensor chip
US10401248B2 (en) 2014-03-31 2019-09-03 Azbil Corporation Pressure sensor chip
WO2015151728A1 (en) * 2014-03-31 2015-10-08 アズビル株式会社 Pressure-sensor chip
JP2015194342A (en) * 2014-03-31 2015-11-05 アズビル株式会社 pressure sensor chip
JPWO2019102983A1 (en) * 2017-11-24 2020-11-19 イーグル工業株式会社 Metal diaphragm damper and its manufacturing method
CN111356833A (en) * 2017-11-24 2020-06-30 伊格尔工业股份有限公司 Metal diaphragm damper and manufacturing method thereof
WO2019102983A1 (en) * 2017-11-24 2019-05-31 イーグル工業株式会社 Metal diaphragm damper and manufacturing method for same
CN111356833B (en) * 2017-11-24 2022-01-25 伊格尔工业股份有限公司 Metal diaphragm damper and manufacturing method thereof
WO2019222598A1 (en) * 2018-05-17 2019-11-21 Rosemount Inc. Measuring element and measuring device comprising the same
CN111492217A (en) * 2018-05-17 2020-08-04 罗斯蒙特公司 Measuring element and measuring device comprising such a measuring element
JP2021517969A (en) * 2018-05-17 2021-07-29 ローズマウント インコーポレイテッド Measuring element and measuring device equipped with it
CN111492217B (en) * 2018-05-17 2022-09-09 罗斯蒙特公司 Measuring element and measuring device comprising such a measuring element

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