JPH0344082B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to an ultraviolet curable conductive resin composition. The purpose of the present invention is to provide ultraviolet curable,
An object of the present invention is to provide an ultraviolet curable conductive resin composition having excellent conductivity, adhesiveness, and surface smoothness. Conventionally, a method of forming a circuit by coating or printing a conductive resin composition and drying or curing it by heating has been widely used. Currently, conductive resin compositions include conductive metal powders such as silver powder and copper powder, or thermosetting (or heat-drying , hereinafter omitted) conductive resin composition is used. However, the method of forming a circuit using such a thermosetting conductive resin composition has many disadvantages as follows. Namely, (1) Since the curing is performed by heating, the curing equipment becomes large-scale and consumes a large amount of energy. (2) Curing takes several tens of minutes to several hours, resulting in poor productivity. (3) The conductive resin composition often contains a volatile solvent, and in this case, for example, the solvent volatilizes on the screen printing plate, causing clogging of the plate. (4) Thermosetting resins have a limited pot life, and gelation occurs within several tens of minutes to several days, resulting in large losses. Particularly in the case of conductive resin compositions using silver powder or the like, they are very expensive, and therefore, losses will cause great damage. On the other hand, recently, ultraviolet curable resins have been attracting attention in place of the above-mentioned thermosetting resins, and have been put to practical use in the fields of paints, inks, coating agents, adhesives, and the like. However, at present, ultraviolet curable resins have hardly been utilized in conductive resin compositions. The reason for this is that since the proportion of conductive metal powder in the conductive resin composition is 50% by weight or more, ultraviolet rays do not penetrate into the coating film, causing poor curing and preventing stable conductivity. There are things you can't get. One method has been proposed to eliminate these drawbacks of ultraviolet curable conductive resin compositions. In other words, in JP-A-55-78070, a non-oxidizing, especially chain metal powder obtained by heat treatment in a reducing atmosphere is used, or glass powder is blended to improve ultraviolet curability. Ultraviolet curable conductive paints have been proposed. According to the above-mentioned publication, in order to improve the ultraviolet curability, a special metal powder must be used, and 1 to 15% by weight of glass powder with a particle size of 10 .mu.m to 100 .mu..phi. must be added to the metal powder. The present inventors have demonstrated ultraviolet curable properties, electrical conductivity, adhesive properties,
As a result of extensive research in order to obtain an ultraviolet curable conductive resin composition with excellent surface smoothness, we succeeded in obtaining an ultraviolet curable conductive resin composition using a method completely different from that in the above publication, and arrived at the present invention. did. That is, the present invention provides a polymerizable compound (), a photosensitizer (), a conductive substance (), a phosphorus compound () represented by the following general formula (a) or/and (b), and the polymerizable compound () A saturated copolymerized polyester () soluble in the saturated copolymerized polyester () is blended with the saturated copolymerized polyester () and the polymerizable compound () in a weight ratio of ():()=5:95 to
This is an ultraviolet curable conductive resin composition characterized by a ratio of 60:40. General formula (a): General formula (b): (In general formulas (a) and (b), R ₁ , R ₂ , and R ₃ are each a hydrogen atom, an alkyl group, a substituted alkyl group,
They are an aryl group and a substituted aryl group. ) The ultraviolet curable conductive resin composition obtained in the present invention has the following features: (1) Since it does not substantially contain volatile solvents, there is no change in viscosity during printing or coating, and circuits can be formed with good reproducibility. (2) Since there are no restrictions on pot life as seen with thermosetting resins, it is advantageous in improving work efficiency and reducing costs. (3) By blending the phosphorus compounds represented by the above general formulas (a) and (b), the dispersibility of conductive substances such as conductive metal powders such as silver powder and copper powder is good. (4) As a result, the conductive substance is uniformly dispersed in the resin as primary particles, and the cured resin layer is densely filled with the conductive substance, thereby improving conductivity. (5) The improvement in dispersibility mentioned above also contributes to improvement in the smoothness of the surface of the coated or printed resin.
There is little diffused reflection of ultraviolet rays on the resin surface. As a result, ultraviolet rays can easily pass through to the inside, improving curability. (6) Since it is cured by irradiation with active light such as ultraviolet rays, a printed circuit with good conductivity and adhesiveness can be formed in a few seconds to several tens of seconds, greatly improving productivity. There are many features such as. The phosphorus compound () used in the present invention is a compound represented by the following general formula (a) and/or (b). General formula (a): General formula (b): (In general formulas (a) and (b), R ₁ , R ₂ , and R ₃ are each a hydrogen atom, an alkyl group, a substituted alkyl group, an aryl group, or a substituted aryl group.) Represented by general formula (a) Typical examples of phosphorus compounds include phosphorous acid, monomethyl phosphite, monoethyl phosphite, monopropyl phosphite,
Phosphite monoesters such as monophenyl phosphite, monostearyl phosphite, mono (acryloyloxyethyl) phosphite, mono (methacryloyloxypropyl) phosphite, dimethyl phosphite, diethyl phosphite, dibutyl phosphite, dioctyl phosphite, Diphenyl phosphite, dibenzyl phosphite, bis(acryloyloxypropyl)
Phosphite diesters such as phosphite and bis(methacryloyloxyethyl) phosphite,
Examples include phosphite triesters such as triethyl phosphite, tributyl phosphite, tristearyl phosphite, triphenyl phosphite, tris (methacryloyloxyethyl) phosphite, and tris (acryloyloxypropyl) phosphite. Further, typical examples of the phosphorus compound represented by the general formula (b) include phosphoric acid, monoethyl phosphate, monopropyl phosphate, monobutyl phosphate, monophenyl phosphate, mono(acryloyloxyethyl) phosphate, mono Phosphate monoesters such as benzyl phosphate, dimethyl phosphate, diethyl phosphate, dibutyl phosphate, dioctyl phosphate, distearyl phosphate, diphenyl phosphate, dibenzyl phosphate, bis(methacryloyloxyethyl) phosphate, Examples include phosphoric acid diesters such as bis(acryloyloxyethyl) phosphate, bis(acryloyloxypropyl) phosphate, and bis(methacryloyloxypropyl) phosphate. In particular, it is desirable to use a phosphorus compound having a (meth)acryloyloxy group that is copolymerizable with the polymerizable compound (). In the present invention, it is important to use the phosphorus compound (), and other phosphorus compounds, such as phosphoric triesters such as triethyl phosphate and tris(acryloyloxyethyl) phosphate, phosphonic acids such as phenylphosphonic acid, Phosphonous acids such as phenylphosphonic acid cannot achieve the object of the present invention. The phosphorus compound () used in the present invention is blended alone or in combination of two or more, and the blending amount is determined in the ultraviolet curable conductive resin composition of the present invention.
0.02-10% by weight, preferably 0.1-5.0% by weight. If the blending amount is less than 0.02% by weight, no effect will be observed, and if it exceeds 10% by weight, the expected effect will not be observed and, on the contrary, it will have a negative effect on water resistance, moisture resistance, etc., so it is preferable. do not have. The polymerizable compound () used in the present invention is a photopolymerizable compound having one or more polymerizable double bonds in the molecule, and at least a portion of the polymerizable compound () has two or more double bonds in the molecule. It is a compound having a polymerizable double bond. Examples of photopolymerizable compounds having one polymerizable double bond in the molecule include (i) styrene, α
- Styrenic compounds such as methylstyrene and chlorostyrene, (ii) methyl (meth)acrylate (meaning methyl acrylate and methyl methacrylate, hereinafter similarly abbreviated), ethyl (meth)acrylate, n- and i-propyl ( meth)acrylate, n-, sec and t-butyl (meth)
Acrylate, alkyl (meth)acrylate such as 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, cyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, stearyl (meth)acrylate, or methoxyethyl (meth)acrylate , alkoxyalkyl (meth)acrylates such as ethoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, allyloxyalkyl (meth)acrylates such as phenoxyethyl (meth)acrylate, and hydroxyalkyl (meth)acrylates such as hydroxyethyl (meth)acrylate. ) acrylate, halogen-substituted alkyl methacrylate, or substituted alkyl mono(meth)acrylate such as polyoxyalkylene glycol mono(meth)acrylate such as polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, or substituted alkyl mono(meth)acrylate such as alkoxypolyoxyalkylene glycol
There are acrylates, etc. (iii) Mono(meth)acrylates of alkylene oxide adducts of bisphenol A, such as ethylene oxide and/or propylene oxide adducts of bisphenol A, or ethylene oxide and/or propylene oxide adducts of hydrogenated bisphenol A, etc. Examples include mono(meth)acrylates of alkylene oxide adducts of hydrogenated bisphenol A. Furthermore, (iv) one in the molecule obtained by further reacting a terminal isocyanate group-containing compound obtained by reacting a diisocyanate compound with two or more alcoholic hydroxyl group-containing compounds with an alcoholic hydroxyl group-containing (meth)acrylate. Urethane-modified mono(meth)acrylate having a (meth)acryloyloxy group, or epoxy mono(meth)acrylate obtained by reacting a compound having one or more epoxy groups in the molecule with acrylic acid or methacrylic acid. , or (vi)
Examples include acrylic acid or methacrylic acid as a carboxylic acid component, and oligoester mono(meth)acrylate obtained by reacting a polycarboxylic acid with two or more polyhydric alcohols as an alcohol component. Examples of photopolymerizable compounds having two polymerizable double bonds in the molecule include (i) ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, and 1,4-butanediol di(meth)acrylate. ) acrylate, alkylene glycol di(meth)acrylate such as neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, di propylene glycol di(meth)acrylate,
Polyoxyalkylene glycol di(meth)acrylate such as polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, substituted alkylene such as halogen-substituted alkylene glycol di(meth)acrylate, hydroxyl group-substituted alkylene glycol di(meth)acrylate, etc. glycol di(meth)acrylate, (ii) di(meth)acrylate of alkylene oxide adducts of bisphenol A, such as ethylene oxide or/and propylene oxide adducts of bisphenol A, ethylene oxide or/and propylene of hydrogenated bisphenol A; Di(meth)acrylates of alkylene oxide adducts of hydrogenated bisphenol A such as oxide adducts, (iii) terminal isocyanate group-containing compounds obtained by reacting a diisocyanate compound with two or more alcoholic hydroxyl group-containing compounds in advance. , urethane-modified di(meth)acrylate having two (meth)acryloyloxy groups in the molecule obtained by further reacting an alcoholic hydroxyl group-containing (meth)acrylate, (iv) two or more epoxy groups in the molecule. Epoxy di(meth)acrylate obtained by reacting acrylic acid or methacrylic acid with a compound having (v) acrylic acid or methacrylic acid as the carboxylic acid component, and polyhydric alcohol with dihydric or higher hydric acid as the polyhydric carboxylic acid and alcohol component oligoester di(meth) obtained by reacting with
A typical example is acrylate. Examples of photopolymerizable compounds having three or more polymerizable double bonds in the molecule include (i) trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate. ) Polyhydric (meth)acrylate of trivalent or higher aliphatic polyhydric alcohol such as acrylate, or polyhydric (meth)acrylate of trivalent or higher hydroxyl-substituted aliphatic polyhydric alcohol, (ii) diisocyanate compound and two or more A terminal isocyanate group-containing compound obtained by reacting an alcoholic hydroxyl group-containing compound in advance,
Further, there are urethane-modified (meth)acrylates having three or more (meth)acryloyloxy groups in the molecule obtained by reacting alcoholic hydroxyl group-containing (meth)acrylates. These polymerizable compounds () may be used alone or in combination. At least a portion of the polymerizable compound () used in the present invention is desirably an epoxy (meth)acrylate having two or more polymerizable bonds in the molecule. Preferred compounds as the epoxy (meth)acrylate used in the present invention are, for example, compounds produced by the following two typical methods.
That is, a method in which an α,β-unsaturated acid and an epoxy compound are reacted in the presence of a catalyst (Japanese Patent Publication No. 1973-
15988, U.S. Pat. No. 3,373,211) and a method of reacting a polyhydric phenol with a compound containing a polymerizable double bond and an epoxy group in the molecule (Japanese Patent Publication No. 1973-
No. 43536, Japanese Unexamined Patent Publication No. 51-80394). Examples of α,β-unsaturated acids used in the former method include acrylic acid, methacrylic acid, and crotonic acid, and examples of epoxy compounds include the following general formula (d),
(e) and (f) (In the formula, n is 0 to 4, and R is a hydrogen atom, a lower alkyl group, or a halogen atom.) (In the formula, n is 1 to 5, and R is a hydrogen atom or a lower alkyl group.) (In the formula, n is 1 to 20, and R is a hydrogen atom or a lower alkyl group.) In addition to the compounds represented by, diglycidyl orthophthalate, diglycidyl isophthalate, diglycidyl terephthalate, dipentene oxide,
3',4'-epoxy-6'-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 1-epoxyethyl-
Examples include 3,4-epoxycyclohexane. Compounds containing a polymerizable double bond and an epoxy group used in the latter method include glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, allyl-2,3-epoxybutyl ether, allyl-2,3-epoxy- Examples of polyhydric phenols include 2-methylpropyl ether and diglycidyl maleate, and bis(4-hydroxyphenyl)methane.
2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(3,5-dichloro-4-hydroxyphenyl)propane, 2,2-bis(3,
5-dibromo-4-hydroxyphenyl)propane, 2,2-bis(2-methyl-4-hydroxyphenyl)propane, 2,2-bis(2-hydroxy-4-tert-butylphenyl)propane,
2,2-bis(2-hydroxyphenyl)propane, 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(3,5-dibromo-4-hydroxyphenyl)butane, 2, 2-bis(2-
Chloro-4-hydroxyphenyl)propane, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxyphenyl)ether, 4,4'-
Dihydroxydiphenyl, 3,3',5,5'-tetrachloro-4,4'-dihydroxydiphenyl,
3,3',5,5'-tetrabromo-4,4'-dihydroxydiphenyl, 3-hydroxyphenyl salicylate, hydroquinone, catechol, 2,6
-tert-butylhydroquinone, moter-tert-butylhydroquinone, p-tert-butylcatechol, pyrogallol, resorcinol, tannic acid, 1,5-dihydroxynaphthalene, 1,4-
Examples include dihydroxynaphthalene. The proportion of the above polymerizable compound () in the ultraviolet curable conductive resin composition is 70% to 5% by weight, preferably 60% to 10% by weight. The photosensitizer () used in the present invention is
Compounds that promote the photopolymerization reaction of the polymerizable compound () are not particularly limited, and include, for example, benzoins such as benzoin methyl ether, benzoin ethyl ether, benzoin-i-propyl ether, benzoin, and α-methylbenzoin; Anthraquinones such as 9,10-anthraquinone, 1-chloroanthraquinone, and 2-chloroanthraquinone, benzophenones such as benzophenone, p-chlorobenzophenone, and p-dimethylaminobenzophenone, diphenyl disulfide, and tetramethylthiuram. Sulfur-containing compounds such as disulfide, pigments such as methylene blue, eosin, fluorescein, 4'-isopropyl-
Propiophenones such as 2-hydroxy-2-methyl-propiophenone and 2-hydroxy-2-methyl-propiophenone, benzyl ketals such as benzyl dimethyl ketal and benzyl diethyl ketal, acetophenone, diethoxyacetophenone Examples include acetophenones such as, among others, but particularly the use of the above propiophenones or benzyl ethers provides good curability. These photosensitizers () may be used alone or in combination of two or more. The amount of the photosensitizer () is 0.05 to 20% by weight, especially 0.5 to 20% by weight, based on the ultraviolet curable conductive resin composition.
10% by weight is preferred. In addition, in order to increase the photopolymerization reaction promoting effect of the photosensitizer (), amines such as triethanolamine, triethylamine, N,N-diethylaminoethyl (meth)acrylate, and triphenylphosphine are used as photosensitizers. It is also possible to use phosphorus compounds such as. As the conductive substance () used in the present invention,
For example, metal powders such as gold, silver, copper, nickel, chromium, palladium, aluminum, tungsten, molybdenum, and platinum are used. There are no particular restrictions on the shape of this metal powder; granules, flakes, scales, plates, dendritic shapes, dice shapes, etc. can be used, and the size of the metal powder can range from 0.1 μm to 100 μm. Typically, those with a diameter of 0.1 μm to 20 μm are used. In addition, the surface of these metal powders is
For example, the surface may be treated with oil or fat.
In addition to metal powder, other conductive substances such as
Carbon powders such as carbon black, ketone black, and acetylene black, graphite powders, and metal oxides such as silver oxide, indium oxide, tin oxide, zinc oxide, iridium oxide, and ruthenium oxide can also be used. It can also be used in combination with The amount of these conductive substances () ranges from 40% to 95% by weight of the ultraviolet curable conductive resin composition of the present invention.
% by weight, preferably from 50% to 90% by weight.
If the amount of the conductive substance () is less than 40% by weight, hardly any conductivity will be obtained, and if it exceeds 95% by weight, it will be difficult to cure with ultraviolet rays and stable conductivity will not be obtained. do not have. Blending the saturated copolymerized polyester () soluble in the above-mentioned polymerizable compound () into the ultraviolet curable conductive resin composition of the present invention is extremely effective in improving adhesiveness. The saturated copolymerized polyester soluble in the polymerizable compound () referred to herein is a polyester produced from a saturated polyhydric carboxylic acid, a derivative thereof, and a polyhydric alcohol. Saturated polyhydric carboxylic acid components used in such a saturated copolymerized polyester () include terephthalic acid, isophthalic acid, orthophthalic acid, 2,
6-naphthalene dicarboxylic acid, succinic acid, adipic acid, azelaic acid, dodecanedioic acid, 1,4
-cyclohexanedicarboxylic acid, tetrahydrophthalic acid, hexahydrophthalic acid, chlorendic acid,
Examples include 5-sodium sulfoisophthalic acid. As the saturated polycarboxylic acid component, in addition to the above compounds, it is also possible to use a trifunctional or higher functional polycarboxylic acid such as trimellitic acid and pyromellitic acid, and in that case, the amount should be 10 mol% or less. desirable. On the other hand, as the polyhydric alcohol component used in the saturated copolymerized polyester (), for example,
ethylene glycol, propylene glycol,
Alkylene glycols such as 1,4-butanediol, 1,6-hexanediol, 1,5-pentanediol, neopentyl glycol, diethylene glycol, triethylene glycol, tetra or more polyethylene glycol, dipropylene glycol, tri or more polypropylene glycol , polyoxyalkylene glycol such as polytetramethylene glycol, halogenated alkylene glycol such as dibromoneopentyl glycol, 1,4-cyclohexanediol, ethylene oxide or/and propylene oxide adduct of bisphenol A, ethylene oxide of hydrogenated bisphenol A and/or propylene oxide adduct, 1,4-cyclohexanedimethanol, and the like. These polyhydric glycol components may be used alone or in combination. As the polyhydric alcohol component, in addition to the above-mentioned glycols, it is also possible to use trihydric or higher polyhydric alcohols such as trimethylolpropane, trimethylolethane, and pentaerythritol in an amount of 10 mol % or less. If necessary, add monovalent carboxylic acid or
A small amount of alcohol may also be used. These saturated copolymerized polyesters may be used alone or in combination of two or more. There are no particular limitations on the method for producing the saturated copolymerized polyester () of the present invention, and methods such as transesterification and direct esterification may be used, and if necessary, tetra-n-butyl titanate, stannous oxalate, Known catalysts such as zinc acetate and antimony trioxide are used. The saturated copolymerized polyester used in the present invention needs to be soluble in the above-mentioned polymerizable compound (). Examples of preferable components of the saturated copolymerized polyester that satisfy solubility in the polymerizable compound () include, for example, a two-component system of terephthalic acid and isophthalic acid, a three-component system of terephthalic acid, isophthalic acid, and adipic acid, There are ternary systems such as terephthalic acid, isophthalic acid and sebacic acid.
It is desirable that the proportion of aromatic dicarboxylic acid, particularly terephthalic acid and/or isophthalic acid, in the polyhydric carboxylic acid component is 20 mol % or more.
Polyhydric alcohol components include two-component systems of ethylene glycol and propylene glycol, two-component systems of ethylene glycol and 1,6-hexanediol, and two-component systems of ethylene glycol and neopentyl glycol. It is not limited to. The solubility of the saturated copolyester () in the polymerizable compound () is greatly affected by the acid value and molecular weight of the saturated copolyester.
It is desirable that the acid value is 50 or less. In the present invention, the blending ratio of the saturated copolymerized polyester () soluble in the polymerizable compound () and the polymerizable compound () is saturated copolymerized polyester ():polymerizable compound ()=5:95 in weight ratio. ~
The ratio is 60:40, preferably 8:92 to 50:50. The blending ratio of saturated copolyester polyester () is 5% by weight
If it is less than 60% by weight, a product with excellent adhesiveness and flexibility cannot be obtained, and if it exceeds 60% by weight, the viscosity becomes too high to be practical. The ultraviolet curable conductive resin composition of the present invention includes:
Synthetic resins other than saturated copolymerized polyester (), for example,
Phenol resin, epoxy resin, acrylic resin,
PVC resin, known acrylic or silicone leveling agents, hydroquinone,
Thermal polymerization inhibitors such as phenothiazine, zinc chloride,
A stabilizer such as N-nitrosophenylhydroxylamine, a silane coupling agent such as an aminosilane type, a methoxysilane type, or an epoxysilane type are added to the composition for coating or printing. After the ultraviolet curable resin composition of the present invention is applied or printed on a substrate, it is cured by irradiation with actinic light. The base material is polyethylene terephthalate,
Plastics such as polycarbonate, polyphenylene sulfide, epoxy resin, phenolic resin, polyimide resin, unsaturated polyester resin, sintered bodies of ceramic, glass, pottery, etc.
Metals such as copper, aluminum, silver, and iron can be used, and there are no particular restrictions on the shape, such as plate, film, or foil. As a coating method, known methods such as spraying, brushing, and screen printing can be used. The active light is preferably ultraviolet light, and the light source used for irradiating this ultraviolet light includes sunlight, chemical lamps, low-pressure mercury lamps, high-pressure mercury lamps, carbon arc lamps, xenon lamps, metal halide lamps, and the like. It is also possible to use an electron beam as actinic light. The ultraviolet curable conductive resin composition obtained according to the present invention has the following features: (1) Since it does not substantially contain volatile solvents, there is no change in viscosity during printing or coating, and circuits can be formed with good reproducibility. (2) Since there is no restriction on pot life as seen in thermosetting resins, it is advantageous in improving work efficiency and reducing costs. (3) By blending the phosphorus compounds () represented by the general formulas (a) and (b), the dispersibility of conductive substances, for example metal powders such as silver powder and copper powder, is good. (4) As a result, the conductive substance is uniformly dispersed in the resin as primary particles, and the cured resin layer is densely filled with the conductive substance, thereby improving conductivity. (5) The improvement in dispersibility mentioned above also contributes to improvement in the smoothness of the surface of the coated or printed resin.
There is little diffused reflection of ultraviolet rays on the resin surface. As a result, ultraviolet rays can easily pass through to the inside, improving curability. (6) Since it is cured by irradiation with actinic light such as ultraviolet rays, a coating film circuit with good conductivity and adhesiveness can be formed in a few seconds to several tens of seconds, greatly improving productivity. It has many characteristics such as, and its industrial significance is extremely large. Taking advantage of these characteristics, the ultraviolet curable resin composition of the present invention can be used to form conductive circuits on insulating substrates, to bond semiconductor elements, to bond lead wires, to bond between contacts, to bond Nesa glass to each other, to bond watches. It can be used for manufacturing electrodes on the back of dials, etc. EXAMPLES Examples are given below to explain the present invention more specifically, but the present invention is not limited to these Examples in any way. In Examples and Reference Examples, parts represent parts by weight. Reference Example 1 40 parts of saturated copolymerized polyester (A) of the following composition obtained by a conventional method, 30 parts of tetrahydrofurfuryl acrylate, 30 parts of diacrylate of 4 moles of ethylene oxide adduct of bisphenol A, and as a thermal polymerization inhibitor. 0.01 part of hydroquinone was added and mixed and dissolved under heating at 80°C to obtain resin (1).
The resulting resin had a viscosity of 95 poise at 25°C. Composition of saturated copolymerized polyester (A) Molecular weight 3500 Saturated polyhydric carboxylic acid component Terephthalic acid 50 mol% Isophthalic acid 50 mol% Polyhydric alcohol component Ethylene glycol 40 mol% 1,6-hexanediol 60 mol% Reference example 2 Conventional method 30 parts of a saturated copolymerized polyester (B) having the following composition obtained by, 15 parts of tetrahydrofurfuryl acrylate, 15 parts of trimethylolpropane triacrylate, 40 parts of diacrylate of 4 moles of ethylene oxide adduct of bisphenol A, and thermal polymerization. Resin (ii) was obtained in the same manner as in Reference Example 1 except that 0.01 part of hydroquinone was added as an inhibitor. The viscosity of the obtained resin was 89 poise at 25°C. Composition of saturated copolymerized polyester (B) Molecular weight 3200 Saturated polycarboxylic acid component Terephthalic acid 49 mol% Isophthalic acid 49 mol% 5-sodium sulfoisophthalic acid 2 mol% Polyhydric alcohol component Ethylene glycol 50 mol% Neopentyl glycol 50 mol % Example 1 Various ultraviolet curable conductive resin compositions were prepared by thoroughly kneading the composition raw materials shown in Tables 1 and 2 using three rolls, and using a 300 mesh polyester screen printing plate. After printing on a glass plate, it was cured by irradiating it with ultraviolet light for 30 seconds at a distance of 15 cm under a 5.6KW high-pressure mercury lamp. The characteristic values of the obtained cured coating films are shown in Tables 1 and 2.

【table】

【table】

【table】 [Brief explanation of drawings]

FIG. 1 shows the surface smoothness of a cured film obtained by printing the composition (No. 1) of the present invention on a polyethylene terephthalate film and irradiating it with ultraviolet rays. FIG. 2 shows the surface smoothness of a cured coating film obtained by printing a comparative composition (No. 10) on a polyethylene terephthalate film and irradiating it with ultraviolet rays.

Claims (1)

[Claims] 1. A polymerizable compound (), a photosensitizer (), a conductive substance (), a phosphorus compound () represented by the following general formula (a) or/and (b), and the polymerizable compound () is blended with a soluble saturated copolymerized polyester (), and the weight ratio of the saturated copolymerized polyester () and the polymerizable compound () is ():()=5:95~ An ultraviolet curable conductive resin composition characterized by a ratio of 60:40. General formula (a): General formula (b): [In general formulas (a) and (b), R ₁ , R ₂ , and R ₃ are each a hydrogen atom, an alkyl group, a substituted alkyl group, an aryl group, or a substituted aryl group. ]