JPH0343609Y2 - - Google Patents

Info

Publication number

JPH0343609Y2

JPH0343609Y2 JP18883287U JP18883287U JPH0343609Y2 JP H0343609 Y2 JPH0343609 Y2 JP H0343609Y2 JP 18883287 U JP18883287 U JP 18883287U JP 18883287 U JP18883287 U JP 18883287U JP H0343609 Y2 JPH0343609 Y2 JP H0343609Y2

Authority

JP

Japan

Prior art keywords

base plate

circuit board

printed circuit

contacts

pair

Prior art date

1987-12-14

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

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• 239000003550 marker Substances 0.000 description 17
• 230000000694 effects Effects 0.000 description 3
• 238000003780 insertion Methods 0.000 description 3
• 230000037431 insertion Effects 0.000 description 3
• 239000004065 semiconductor Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 238000009434 installation Methods 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000004925 Acrylic resin Substances 0.000 description 1
• 229920000178 Acrylic resin Polymers 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 238000009792 diffusion process Methods 0.000 description 1
• 230000005611 electricity Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 230000003760 hair shine Effects 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 238000012856 packing Methods 0.000 description 1
• 239000003973 paint Substances 0.000 description 1
• 238000005192 partition Methods 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 239000004033 plastic Substances 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 230000001012 protector Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1