JPH0341930U - - Google Patents
Info
- Publication number
- JPH0341930U JPH0341930U JP10245289U JP10245289U JPH0341930U JP H0341930 U JPH0341930 U JP H0341930U JP 10245289 U JP10245289 U JP 10245289U JP 10245289 U JP10245289 U JP 10245289U JP H0341930 U JPH0341930 U JP H0341930U
- Authority
- JP
- Japan
- Prior art keywords
- mound
- turntable
- semiconductor wafer
- liquid
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
第１図は本考案の一実施例に係るマウンドカツ
タの一部破断分解斜視図、第２図及び第３図は第
１図−線に沿つた要部断面図であり、第２図
は、液体を液槽内に注入した状態を示し、第３図
はマウンドを折曲する状態を示している。第４図
は従来のマウンドカツタの斜視図である。
１……ターンテーブル、２……液槽、２２……
流入口、２３……排出口、３……押圧具、３２…
…刃部、Ｗ……半導体エウハ、Ｍ……マウンド。
FIG. 1 is a partially cutaway exploded perspective view of a mound cutter according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views of main parts along the line shown in FIG. 1, and FIG. FIG. 3 shows a state in which the liquid is injected into the liquid tank, and FIG. 3 shows a state in which the mound is bent. FIG. 4 is a perspective view of a conventional mound cutter. 1...Turntable, 2...Liquid tank, 22...
Inflow port, 23... Outlet port, 3... Pressing tool, 32...
...Blade part, W...Semiconductor wafer, M...Mound.
Claims (1)
出して成長するマウンドを切除するマウンドカツ
タであつて、 半導体ウエハを吸着固定するターンテーブルと
、該ターンテーブルを収容する収容部と液体の流
入口と排出口とを有し上方を開口した液槽と、 該液槽の上方に液密状態で位置され上記ターン
テーブル上の半導体ウエハ表面に成長するマウン
ドを切除する断面略Ｔ字状の刃部を有した押圧具
とからなるマウンドカツタ。[Scope of Claim for Utility Model Registration] A mound cutter for cutting off a mound that protrudes and grows on the surface of a semiconductor wafer during epitaxial growth, comprising: a turntable for suctioning and fixing a semiconductor wafer; a housing section for housing the turntable; and a liquid a liquid tank having an inlet and an outlet and opening upward; and a roughly T-shaped cross section located above the liquid tank in a liquid-tight manner for cutting out a mound growing on the surface of the semiconductor wafer on the turntable. A mound cutter consisting of a pressing tool having a blade part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10245289U JPH0341930U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10245289U JPH0341930U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341930U true JPH0341930U (en) | 1991-04-22 |
Family
ID=31651348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10245289U Pending JPH0341930U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100659843B1 (en) * | 2005-12-28 | 2006-12-19 | 동부일렉트로닉스 주식회사 | An apparatus for pure water saving in cmp machine |
-
1989
- 1989-08-31 JP JP10245289U patent/JPH0341930U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100659843B1 (en) * | 2005-12-28 | 2006-12-19 | 동부일렉트로닉스 주식회사 | An apparatus for pure water saving in cmp machine |
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