JPH0339857U - - Google Patents
Info
- Publication number
- JPH0339857U JPH0339857U JP4978589U JP4978589U JPH0339857U JP H0339857 U JPH0339857 U JP H0339857U JP 4978589 U JP4978589 U JP 4978589U JP 4978589 U JP4978589 U JP 4978589U JP H0339857 U JPH0339857 U JP H0339857U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- molded
- lead
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4978589U JPH0339857U (no) | 1989-04-27 | 1989-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4978589U JPH0339857U (no) | 1989-04-27 | 1989-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339857U true JPH0339857U (no) | 1991-04-17 |
Family
ID=31567771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4978589U Pending JPH0339857U (no) | 1989-04-27 | 1989-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339857U (no) |
-
1989
- 1989-04-27 JP JP4978589U patent/JPH0339857U/ja active Pending
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