JPH0339854U - - Google Patents

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Publication number
JPH0339854U
JPH0339854U JP10135589U JP10135589U JPH0339854U JP H0339854 U JPH0339854 U JP H0339854U JP 10135589 U JP10135589 U JP 10135589U JP 10135589 U JP10135589 U JP 10135589U JP H0339854 U JPH0339854 U JP H0339854U
Authority
JP
Japan
Prior art keywords
semiconductor package
jig
sectional
view
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10135589U
Other languages
English (en)
Japanese (ja)
Other versions
JP2510569Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989101355U priority Critical patent/JP2510569Y2/ja
Publication of JPH0339854U publication Critical patent/JPH0339854U/ja
Application granted granted Critical
Publication of JP2510569Y2 publication Critical patent/JP2510569Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)
JP1989101355U 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具 Expired - Lifetime JP2510569Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989101355U JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989101355U JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Publications (2)

Publication Number Publication Date
JPH0339854U true JPH0339854U (US20030157376A1-20030821-M00001.png) 1991-04-17
JP2510569Y2 JP2510569Y2 (ja) 1996-09-11

Family

ID=31650313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989101355U Expired - Lifetime JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Country Status (1)

Country Link
JP (1) JP2510569Y2 (US20030157376A1-20030821-M00001.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199520A (ja) * 2005-01-18 2006-08-03 Zikusu Kogyo Kk セラミック治具及びその製造方法
US7887899B2 (en) 2005-08-25 2011-02-15 Sumitomo Electric Industries, Ltd. Anisotropic conductive sheet, production method thereof, connection method and inspection method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274646A (ja) * 1986-05-22 1987-11-28 Nec Corp 端子矯正治具
JPS6447050U (US20030157376A1-20030821-M00001.png) * 1987-09-16 1989-03-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274646A (ja) * 1986-05-22 1987-11-28 Nec Corp 端子矯正治具
JPS6447050U (US20030157376A1-20030821-M00001.png) * 1987-09-16 1989-03-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006199520A (ja) * 2005-01-18 2006-08-03 Zikusu Kogyo Kk セラミック治具及びその製造方法
US7887899B2 (en) 2005-08-25 2011-02-15 Sumitomo Electric Industries, Ltd. Anisotropic conductive sheet, production method thereof, connection method and inspection method

Also Published As

Publication number Publication date
JP2510569Y2 (ja) 1996-09-11

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